This document summarizes the IPC position on the subject
of ‘‘halogen-free’’ materials for the electronics industry. Its
initial release was developed over a period of three years
and this revision was also worked upon for another 3 years
by a team representing every level of the electronics supply
chain. This document is applicable to materials for
interconnecting electronics including, but not limited to,
copper-clad laminates and prepregs, resin coated copper
foils, flexible materials and solder masks. This document
reflects the state of the information and technology as of
May 2007.