1 This standard covers methods of chemical analysis of lead-and tin-base solder metals (See PTS 607-01.02; 1969, Specification for Soft Solder Metals) having chemical Composi-tions within the following ranges:
A. General Constituents
Percent
Lead
Tin
Antimony
B. Impurities
Bismuth
Copper
Arsenic
Iron
Zinc
Aluminum
30 - 95
5 - 70
0.02 - 3
0.02 - 0.5
0.01 - 0.5
0.01 0.5
0.005- 0.05
0.001- 0.05
0,001- 0.01
2 The analytical procedures appear in the following order:
Section No.
(a) Tin by the Iodimetric Method
(b) Tin and Lead by the Gravimetric
Method
Antimony by the Permanganate Method
Dismuth by the Photometric Thiourea Method
Iron and Copper by the Photo-metric Method
Arsenic by the Distillation Dromate Method
Zinc by the Photometric Method
Aluminum by the Aluminum (Photometric) Method
(c) (d) (e) (f)
(h)
4 5
0
10
11
3 The test for determination of lead is optional. Lead shall normally be taken as remainder. If lead is to be determined, tin shall be analyzed by the gravimetric method.