This part of IEC 317 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on thermoplastic resin. Class 180 is a thermal class that requires a minimum temperature index of 180 and a heat shock temperature of at least 200 °C.