This part of IEC 60749 provides a test for determinating the effects of constant acceleration on cavity-type semiconductor devices. It is an accelerated test designed to indicate types of structual and mechanical weaknesses not necessarily detected in shock and vibration test. It may be used as a high stress (destructive) test to determine the mechanical limits of the package, internal metallisation and lead system, die or substrate attachment, and other elements of the microelectronic device. When proper stress levels have been established this test method may also be employed as a non-destructive in-line 100 % screen to detect and eliminate devices with l