This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:. tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;. tin-antimony;. tin-bismuth;. tin-copper, with and without silver;. tin-indium, with and without silver and bismuth;. tin-silver, with and without copper and bismuth;. tin-zinc, with and without bismuth.It also includes an indication of the forms generally available.