KS C IEC 61249-3-5-2003 印刷电路板和其他互连结构用材料.第3-5部分:包层和未包层非增强基底材料(用于挠性印刷电路板)的分规范集.贴花黏性薄膜
Material for printed boards and other interconnecting structures-Part 3-5:Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)-Transfer adhesive films