KS C IEC 60068-2-58-2007 环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化熔融和耐焊接热的试验方法
Environmental testing-Part 2-58:Tests-Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)