This standard specifies the environmental, mechanical and electrical test methods and test procedures for military microelectronic devices, as well as the necessary control and restriction measures to ensure the quality and reliability of microelectronic devices meeting the requirements of the intended use. This standard applies to microelectronic devices for military and space applications. If the manufacturer indicates or claims that its semiconductor integrated circuit meets the requirements of this standard, it must meet the requirements of method 5004, 5005 or 5010 (for complex microcircuits), and hybrid integrated circuits should meet the requirements of GJB 2438 and this standard General requirements and requirements of other test methods cited, and product specifications should be confirmed by the standardization body.
GJB 548B-2005 Referenced Document
GB/T 1036 Test method for coefficient of linear thermal expansion of plastics between -30℃ and 30℃ with a vitreous silica dilatometer *, 2008-08-04 Update
GB/T 12842 Terminology for film integrated circuits and hybrid film integrated circuits
GJB 899 Reliability Qualification and Acceptance Test Modification Sheet 1-98
GJB 548B-2005 history
2021GJB 548C-2021 Microelectronic device test methods and procedures
2005GJB 548B-2005 Test methods and procedures for microelectronic device
1996GJB 548A-1996 Microelectronic device test methods and procedures
1988GJB 548-1988 Microelectronic device test methods and procedures
GJB 548B-2005 Test methods and procedures for microelectronic device has been changed from GJB 548A-1996 Microelectronic device test methods and procedures.