This standard specifies the method for measuring package lead resistance. This standard applies to the test of pin grid array package (PGA) lead resistance. This test technique is also applicable to the test of lead resistance of other microelectronic packages such as leadless chip carrier (LCC), quad flat package (QFP) and ceramic dual inline package (CDIP).
GB/T 19248-2003 history
2003GB/T 19248-2003 Test method for measuring the resistance of package leads