GB/T 19247.3-2003
Printed board assemblies--Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies (English Version)

Standard No.

GB/T 19247.3-2003

Language

Chinese, Available in English version

Release Date

2003

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 19247.3-2003

Scope

This standard specifies the requirements for lead and through-hole solder assemblies. This standard applies to the overall lead and hole assembly using the through-hole mounting method (THT), and also applies to the THT part of the assembly using other related methods (ie: surface mount, chip assembly, terminal assembly).

GB/T 19247.3-2003 history

• 2003 GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies

GB/T 19247.3-2003 -All Parts