YS/T 837-2012
Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies (English Version)

Standard No.

YS/T 837-2012

Language

Chinese, Available in English version

Release Date

2012

Published By

Professional Standard - Non-ferrous Metal

Latest

YS/T 837-2012

YS/T 837-2012 Referenced Document

• GB 5226.1 Safety of machinery--Electrical equipment of machines--Part 1: General requirements*， 2019-06-04 Update
• GB/T 11259 Non-destructive testing.Practice for fabrication and control of steel reference blocks used in ultrasonic testing*， 2015-10-09 Update
• GB/T 12604.1 Non-destructive testing—Terminology—Ultrasonic testing*， 2020-11-19 Update
• GB/T 17421.1 General rules for inspection of machine tools Part 1: Geometric accuracy of machine tools under no-load or quasi-static conditions*， 2023-08-06 Update
• GB/T 17421.2 General Rules for Machine Tool Inspection Part 2: Determination of Positioning Accuracy and Repetitive Positioning Accuracy of CNC Axis*， 2023-08-06 Update
• GB/T 18400.6 Test conditions for machining centres--Part 6: Accuracy of feeds, speeds and interpolations
• GB/T 18694 Non-destructivetesting--Ultrasonic inspection--Characterization of search unit and sound field
• GB/T 18852 Non-destructive testing—Ultrasonic testing—Reference blocks and test procedures for the characterization of contact probe sound beams*， 2020-11-19 Update
• GB/T 9445 Non-destructive testing.Qualification and certification of NDT personnel*， 2015-12-10 Update
• GJB 1580A Deformed metal ultrasonic testing*， 2019-12-08 Update
• GJB 9712A Qualification and certification for nondestructive testing of personnel
• JB/T 8771.4 Test conditions of machining centres.Part 4:Accuracy and repeatability of positioning of linear and rotary axes
• JB/T 9269 Mountable environmental requirements of industrial process control computer system

YS/T 837-2012 history

• 2012 YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies