This standard specifies the relevant technical requirements for engineering copper electroplating on metal substrates. This standard is applicable to the copper electroplating layer for engineering purposes, such as the copper electroplating layer that acts as a barrier layer on the surface of heat-treated parts; the copper electroplating layer that is required to reduce wear during the wire drawing process; the bottom layer of the tin plating layer to prevent the diffusion of the base metal copper plating, etc. This standard does not apply to copper plating and copper substrates for decorative purposes and copper plating for electroforming.
GB/T 12333-1990 history
1990GB/T 12333-1990 Metallic coatings--Electroplated coatings of copper for engineering purposes