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Electronic component

Electronic component, Total:500 items.

In the international standard classification, Electronic component involves: Integrated circuits. Microelectronics, Paints and varnishes, Electronic components in general, Resistors, Capacitors, Company organization and management, Electromechanical components for electronic and telecommunications equipment, Quality, Electronic component assemblies, Aerospace electric equipment and systems, Components and accessories for telecommunications equipment, Piezoelectric and dielectric devices, Electrical wires and cables, Mechanical structures for electronic equipment, Telecommunications in general, Rotating machinery, Environmental testing, Installations in buildings, Electrical and electronic testing, Printed circuits and boards, Fibre optic communications, Electrical accessories, Materials for aerospace construction, Semiconductor devices, Magnetic materials, Components for electrical equipment, Graphical symbols, Welding, brazing and soldering, Road vehicle systems, Medical sciences and health care facilities in general, Agricultural machines, implements and equipment, Components for aerospace construction, Aircraft and space vehicles in general, Electronic tubes.


International Electrotechnical Commission (IEC), Electronic component

  • IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
  • IEC PAS 62239:2001 Electronic component management plans
  • IEC 60390A ERTA 1:1979 Dimensions of spindle ends for manually operated electronic components.
  • IEC 60390:1972 Dimensions of spindle ends for manually operated electronic components
  • IEC 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
  • IEC 60390:1972/AMD1:1976 Dimensions of spindle ends for manually operated electronic components
  • IEC 60390A:1976 Dimensions of spindle ends for manually operated electronic components.
  • IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
  • IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
  • IEC PAS 62191:2000 Acoustic microscopy for nonhermetic encapsulated electronic components
  • IEC 62435-7:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
  • IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
  • IEC 107/91/DTS:2008 Aerospace qualified electronic component (AQEC) - Part 1: Microcircuits
  • IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
  • IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
  • IEC TS 62564-1:2009 Aerospace qualified electronic component (AQEC) - Part 1: Microcircuits
  • IEC TS 62239:2003 Process management for avionics - Preparation of an electronic components management plan
  • IEC TS 62239:2008 Process management for avionics - Preparation of an electronic components management plan
  • IEC 60620:1984 Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

Association Francaise de Normalisation, Electronic component

  • UTE C96-029U*UTE C96-029:2011 Electronic components - Long duration storage of electronic components - Guide for implementation
  • NF UTE C96-029:2011 Composants électroniques - Stockage longue durée des composants électroniques - Guide de mise en oeuvre
  • UTE C96-027:2011 Obsolescence des composants électroniques - Exigences pour la gestion de la fin de vie des composants électroniques destinés aux fournisseurs
  • NF C90-512:1983 Components for electronic equipment. Measurement of the dimensions of electronic components.
  • NF C90-510:1986 Electronic Components Coding identification
  • NF C93-404:1988 Electronic components. Chip carrier.
  • NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
  • UTE C93-415U*UTE C93-415:1985 Electronic components - Electromechanical components - Sensitive switches
  • NF EN 62421:2014 Techniques d'assemblage des composants électroniques - Modules électroniques
  • NF C93-525:1988 Electronic components. Flexible ribbon cables.
  • NF C93-450:1983 Electronic components. Electrical thermostatic switches for use in electronic equipments.
  • NF C83-220/A4:1989 Electronic Components Fixed precision resistors
  • NF C83-240/A1:1987 Electronic Components surface mounting resistors
  • NF C93-523:1988 Electronic components. Insulated wires for high temperature.
  • NF C93-050:1987 Electronic components. Basic electrical testing procedures.
  • NF C93-713:1989 Electronic components. Printed boards. General requirements.
  • NF C93-702:1991 Electronic components. Printed boards. Test methods.
  • NF C93-854:1991 Electronic Components Measurement methods for optical fibre cables
  • NF C93-840:1987 Electronic components. Generic specification for optical fibres.
  • NF UTE C93-002:1966 Composants électroniques - Généralités - Contrôles par attributs.
  • NF C83-282/A1:1988 Electronic Components Surge suppression varistors
  • NF C90-511:1991 Electronic components General Coding date of manufacture
  • NF C83-281:1979 Electronic Components L.V. Varistors for telephony applications
  • NF C83-572:1988 Composants électroniques - Système harmonisé d'assurance de la qualité des composants électroniques - Connecteurs coaxiaux pour fréquences radioélectriques - Série MCX - Spécification intermédiaire et spécification particulière cadre.
  • NF C83-566:1988 Composants électroniques - Système harmonisé d'assurance de la qualité des composants électroniques - Connecteurs coaxiaux pour fréquences radioélectriques - Série n - Spécification intermédiaire et spécification particulière cadre.
  • NF C83-573:1988 Composants électroniques - Système harmonisé d'assurance de la qualité des composants électroniques - Connecteurs coaxiaux pour fréquences radioélectriques - Série TNC - Spécification intermédiaire et spécification particulière cadre.
  • NF C90-540:1986 Electronic components. General. Tinned wires for components for soft soldering.
  • NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
  • NF C93-723:1979 Electronic Components Printed wiring Rework of Printed Boards
  • NF C96-435-3*NF EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data
  • NF C96-435-1*NF EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
  • NF C96-435-4*NF EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4 : storage
  • NF C93-010:1968 Components for electronic equipment. Preferred number series for resistors and capacitors.
  • NF C93-800:1991 SEMICONDUCTOR DEVICES. GENERIC SPECIFICATION FOR OPTICAL FIBRE SENSOR.
  • NF C93-751/A1:1987 Electronic Components Base materials for printed circuits Detail specifications
  • NF C93-751:1985 Electronic components. Base material for printed circuits. General requirements.
  • NF C93-334:1981 Electronic components. Dimensions for magnetic oxyde cores intended for use in power supplies (ec-cores).
  • NF UTE C93-715:1994 Composants électroniques - Cartes imprimées - Guide pour l'établissement des documents de base.
  • NF C93-110/AM3:1975 COMPONENTS FOR ELECTRONIC EQUIPMENT. FIXED ALUMINIUM ELECTROLYTIC CAPACITORS. GENERAL REQUIREMENTS.
  • NF C93-132/A1:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. FIXED CERAMIC CAPACITORS (TYPE II). GENERAL REQUIREMENTS.
  • UTE C80-804U*UTE C80-804:1995 Electronic components. Guidance document. Interpretation of "EN 29000". Reliability aspects for electronic components. (specification CECC 00 804).
  • NF C96-435-2*NF EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
  • NF C96-435-9*NF EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9 : special cases
  • NF C93-325:1974 COMPONENTS FOR ELECTRONIC EQUIPMENT. INDUCTIVE COMPONENTS. STRIP-WOUND CUT CORES OF GRAIN ORIENTED SILICON-IRON ALLOY.
  • NF C96-435-8*NF EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8 : passive electronic devices
  • NF C93-422:1977 Electronic components. Connecting devices. Circular multipole connectors.
  • NF EN IEC 62435-4:2018 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 4 : stockage
  • NF EN 62435-1:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 1 : généralités
  • NF EN IEC 62435-3:2020 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 3 : données
  • NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
  • NF C93-335:1981 Electronic Components Dimensions for magnetic oxyde cores intended for use in power supplies(E cores)
  • NF C93-814:1991 Electronic Components Fibre optic Interconnecting Device mechanical splices
  • NF UTE C93-717:1994 Composants électroniques - Cartes imprimées - Caractéristiques et contrôles des drains thermiques
  • NF UTE C93-552:1995 Composants électroniques - Câbles coaxiaux pour installation d'équipements de transmission
  • NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
  • NF C83-401:1987 Electronic Components Two parts and edge socket connectors for printed board application
  • NF EN IEC 62435-7:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 7 : dispositifs microélectromécaniques
  • NF EN 62435-2:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 2 : mécanismes de détérioration
  • NF EN IEC 62435-9:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 9 : cas particuliers
  • NF UTE C93-751:1985 Composants électroniques - Matériaux de base pour circuits imprimés - Recueil de spécifications particulières.
  • NF EN IEC 62435-8:2020 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 8 : dispositifs électroniques passifs
  • NF C93-404-Ⅲ:1991 Electronic Components Pin Grid Array Socket Type SC 05 Detail Requirements
  • NF C93-706:1984 Electronic Components Multilayer printed boards Capability Approval Detail Specifications
  • UTE C96-027U*UTE C96-027:2011 Obsolescence electronic components - Rules concerning the treatment of product discontinuance and replacement
  • NF EN ISO 8826-1:1995 Composants électroniques - Cartes imprimées - Contrôle des cartes imprimées pour applications hyperfréquences
  • UTE C86-614:1977 Composants électroniques - Transistors bipolaires de commutation - Recueil de spécifications particulières.
  • NF UTE C93-720:1995 Composants électroniques - Cartes imprimées - Contrôle des cartes imprimées pour applications hyperfréquences
  • NF UTE C93-680:1989 Composants électroniques - Organes de signalisation - Voyants lumineux - Recueil de spécifications particulières.
  • NF C93-530:1993 Electronic components - Cables with symmetrical circuits for high frequency transmission - Generic specification
  • NF C93-332:1980 Electronic components. Transformers and inductors for telecommunication and professional electronic equipment. General requirements.
  • NF C83-112:1981 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. SECTIONAL SPECIFICATION. TANTALUM CAPACITORS.
  • NF C93-401-Ⅱ:1985 Electronic Components Power supply multicontact connectors with pitch 6,35 mm(Type HE-15)
  • NF C96-435-6*NF EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6 : packaged or finished devices
  • NF C96-009:1989 Electronic Components Semiconductor devices Mechanical and climatic test methods
  • NF C93-681/A1:1989 Electronical Components of assessed quality Incandescent miniature lamps Detail specifications
  • NF C86-213:1988 Harmonized system of quality assessment for electronic components. Ttl standard digital integrated circuits. Family specification.
  • UTE C93-422 L14U*UTE C93-422 L14:1985 ELECTRONIC COMPONENTS - CONNECTING DEVICES - CIRCULAR MULTIPOLE CONNECTORS - BOOK 14
  • UTE C93-530U*UTE C93-530:2005 Electronic components - Cables with symetrical circuits for high frequency transmission - Generic specification
  • NF C83-112/A1:1991 Electronic Components Tantalum capacltors with soild and non-soild electrolyte porous anode
  • NF UTE C96-029-1:2011 Groupe obsolescence des équipements électroniques - Guide méthodologique de dimensionnement des stocks de fin de vie des composants et sous-ensembles électroniques
  • NF C83-410:1988 Harmonized system of quality assessment for electronic components. Electromechanical switches. Generic specification.
  • NF EN IEC 62435-6:2018 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs Partie 6 : dispositifs encapsulés ou finis
  • NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
  • NF C93-715:1981 Electronic components printed boards. Characteristics and acceptance inspection of a production master.
  • NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
  • NF C93-404-Ⅳ:1991 Electronic Components Pin Grid Array Socket Type SC 06 Detail Requirements
  • NF C93-400:1985 Electronic components. Connecting devices. Basic testing procedures and measuring methods.
  • NF UTE C93-427:1983 Electronic Components Connecting devices Sockets for integrated circuits and others plug-in components Detail Requirements
  • NF EN 61190-1-1:2002 Matériaux de fixation pour les assemblages électroniques - Partie 1-1 : exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques
  • NF C93-401:1985 Electronic components. Two part and edge socket. Connectors for printed board application.
  • NF C83-564:1986 Electronic Components Collection of detail specifications within the scope of the French Standards NF C 83-560 and NF C 83-564 Harmonized system of quality assessment for electronic components Radio frequency coaxial connectors
  • NF C83-572:1989 Electronic Components Collection of detail specifications within the scope of the French Standards NF C 83-560 and NF C 83-572 Harmonized system of quality assessment for electronic components Radio frequency coaxial connectors
  • NF C93-521/AM2:1977
  • NF C93-716:1983 Electronic components. Printed boards. Conductors continuity and short circuit. Automatic testing. General requirements.

Professional Standard - Chemical Industry, Electronic component

IEC - International Electrotechnical Commission, Electronic component

  • PAS 62435-2005 Electronic components Long-duration storage of electronic components Guidance for implementation (Edition 1.0)
  • TS 62564-1-2009 Aerospace qualified electronic component (AQEC) – Part 1: Microcircuits (Edition 1.0)
  • TS 62239-2003 Process management for avionics Preparation of an electronic components management plan (Edition 1.0)

CU-NC, Electronic component

  • NC 59-04-08-1985 National Electrotechnical Vocabulery. Electronic Components and Calis Electromechanic Components for Electronic Eouloment. General Conceots
  • NC 59-04-04-1986 National Electrotechnical Vocabulary. Electronic Elements and Components. Electronic Tubes
  • NC 59-04-06-1986 National Electrotechnical Vocabulary. Electronic Elements and Components Power Electronics

PL-PKN, Electronic component

  • PN T84000-1990 Electronic component Dimensions of spindle ends for manually operated electronic components
  • PN T04603-1990 Electronic components Variable capacitors Terms and methods ot' tests
  • PN T80001-1974 Electronic components Mica capacitors General re?uirements and tests
  • PN T80001-1988 Electronit components Mica capacitors General requirements and tests
  • PN T80054-1971 Electronic components Wirewound potentiometers type 2 General specification
  • PN T04601-11-1991 Electronic components. Fixed resistors. Basic environmetal testing procedures
  • PN T04602-12-1990 Electronic components Fixed capacitors Basic environmental testing procedures
  • PN T80053-1971 Electronic components Fixed non-wirewound resistors type 1 General specification
  • PN T80050-1987 Electronic components Fixed power resistors General requirements and tests
  • PN T80240-1971 Electronic components Connec?ors tor Iow trequencies General requirement$ and tes?ing
  • PN T01105-1990 Rules of Procedur? of IEC Quality Assessment System for Electronic Components (IECQ)
  • PN T80006-1988 Electronic components Aluminium electrolytic polar capacitors General requirements and tests
  • PN T80015-1990 Electronic components Variable tuning capacitors type A General re?uirements and tests
  • PN T80012-1972 Electronic components Air dielectr?c rotary variable capacitors General re?uirements and tests
  • PN T80051-1986 Electronic components Fixed low-power nonwirewound resistors General requirements and test
  • PN T01104-1990 Zasady podstawowe systemu IECzapewnienia jako?ci podzespo?ów elektronicznych (IECQ)
  • PN T80004-1988 Electronic components Fixed capacitors of ceramic dielectric class 1 General re?uirements and tests

CZ-CSN, Electronic component

  • CSN 35 8050-1980 Electronic components. Testing
  • CSN 35 8001-1971 Electronic components. Reliability testing
  • CSN 35 4040-1990 Electromechanical components forelectronic equipment.Spindle ends for operated electroniccomponents.Types and basic dimensions
  • CSN IEC 620:1994 Dimensions for the mounting of single-hole, bush mounted, spindle-operated electronic components

American National Standards Institute （ANSI), Electronic component

U.S. Military Regulations and Norms, Electronic component

British Standards Institution (BSI), Electronic component

  • DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
  • BS DD IEC/PAS 62435:2006 Electronic components - Long duration storage of electronic components - Guidance for implementation
  • BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
  • BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
  • BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
  • BS DD CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
  • BS DD CLC/TS 50466:2008 Long duration storage of electronic components. Specification for implementation
  • DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
  • BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
  • BS EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 2: Deterioration mechanisms
  • BS IEC 60319:1999 Presentation and specification of reliability data for electronic components
  • BS 6943:1988 Classification of shapes of electronic components for placement on printed wiring boards
  • DD IEC/TS 62564-1:2009 Aerospace qualified electronic component (AQEC) - Part 1: Microcircuits
  • BS IEC 61163-2:1999 Reliability stress screening - Electronic components
  • BS EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 5: Die and wafer devices
  • BS QC 410000:1990 Harmonized system of quality assessment for electronic components: potentiometers for use in electronic equipment
  • DD IEC/TS 62239:2008 Process management for avionics. Preparation of an electronic components management plan
  • DD IEC/TS 62239:2003 Process management for avionics. Preparation of an electronic components management plan
  • BS EN 188201:1996 Harmonized system of quality assessment for electronic components - Family specification: A1a graded index multimode optical fibres
  • 21/30363433 DC BS IEC 63142. A global methodology for reliability data prediction of electronic components
  • BS EN 123000/Add:1997 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
  • BS EN 136000:1993 Harmonized system of quality assessment for electronic components: generic specification: magnetrons
  • BS EN 113000:1993 Harmonized system of quality assessment for electronic components. Generic specification: camera tubes
  • BS EN 188200:1996 Harmonized system of quality assessment for electronic components - Sectional specification - Optical fibres A1 category graded index multimode
  • BS EN 188202:1996 Harmonized system of quality assessment for electronic components - Family specification: A1b graded index multimode optical fibres
  • BS EN 111100:1984 Harmonized system of quality assessment for electronic components: sectional specification: display storage tubes

SE-SIS, Electronic component

RU-GOST R, Electronic component

Korean Agency for Technology and Standards (KATS), Electronic component

Defense Logistics Agency, Electronic component

Guangdong Provincial Standard of the People's Republic of China, Electronic component

Canadian Standards Association (CSA), Electronic component

American Society for Testing and Materials (ASTM), Electronic component

  • ASTM F542-98 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
  • ASTM F542-02 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
  • ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
  • ASTM F1190-18 Standard Guide for Neutron Irradiation of Unbiased Electronic Components
  • ASTM F1190-11 Standard Guide for Neutron Irradiation of Unbiased Electronic Components
  • ASTM F1190-93 Standard Guide for Neutron Irradiation of Unbiased Electronic Components
  • ASTM F1190-99 Standard Guide for Neutron Irradiation of Unbiased Electronic Components
  • ASTM F1190-99(2005) Standard Guide for Neutron Irradiation of Unbiased Electronic Components
  • ASTM E1161-95 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM E1161-09 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM F1263-99 Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
  • ASTM F1263-99(2005) Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
  • ASTM E1161-09(2014) Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
  • ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components

Indonesia Standards, Electronic component

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Electronic component

  • GB/T 2775-1993 Dimensions of spendle ends for manually operatedelectronic components

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Electronic component

Aerospace Industries Association/ANSI Aerospace Standards, Electronic component

  • AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
  • AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
  • AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
  • AIA/NAS NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
  • AIA/NAS NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
  • AIA/NAS NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
  • AIA/NAS NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
  • AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
  • AIA/NAS NAS4121-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED (Rev 1)
  • AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)

U.S. Environmental Protection Agency (U.S. EPA), Electronic component

GB-REG, Electronic component

US-FCR, Electronic component

Professional Standard - Machinery, Electronic component

  • JB/T 5635-1991 Vacuum resistance furnace for electronic components. Grading of energy consumption

YU-JUS, Electronic component

  • JUS N.R4.203-1989 Dimensions of spindle ends for mavually operated electronic compcments
  • JUS N.R4.204-1989 Dlmensions for the mounting of signale-hole, busb-moimted, spindle-operated electronic components

European Committee for Electrotechnical Standardization（CENELEC）, Electronic component

  • HD 363-1977 Dimensions of Spindle Ends for Manually Operated Electronic Components
  • CLS/TS 50466-2006 Long duration storage of electronic components - Specification for implementation
  • CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
  • EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
  • EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
  • EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
  • EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
  • EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
  • EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
  • EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
  • EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
  • EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices

ECIA - Electronic Components Industry Association, Electronic component

  • 489-1982 Sockets@ Plug-In Electronic Components@ Round Style
  • 186-9E-1978 Passive Electronic Component Parts@ Test Methods for; Method 9: Solderability
  • RS-325-A-1977 FLAMMABILITY TESTS FOR ELECTRONIC COMPONENTS ((Revision of RS-325))
  • 488-1982 Sockets@ Individual Lead Types (for Electrical and Electronic Components)
  • 186-10E-1978 Passive Electronic Component Parts@ Test Methods for; Method 10: Effect of Soldering
  • 186-8E-1978 Passive Electronic Component Parts@ Test Methods for; Method 8: Vibration@ High Frequency
  • 186-1E-1978 Passive Electronic Component Parts@ Test Methods for; Method 1: Humidity (Steady State)
  • 186-2E-1978 Passive Electronic Component Parts@ Test Methods for; Method 2: Moisture Resistance (Cycling)
  • 186-5E-1978 Passive Electronic Component Parts@ Test Methods for; Method 5: Salt Spray (Corrosion)
  • 486-1982 Solder Wicking Test Procedure for Sockets@ Plug-In Electronic Components
  • 186-12E-1978 Passive Electronic Component Parts@ Test Methods for; Method 12: Heat-Life Test
  • 186-13E-1978 Passive Electronic Component Parts@ Test Methods for; Method 13: Insulation Resistance Test
  • RS-414-A-1975 Simulated Shipping Tests for Consumer Electronic Products and Electronic Components ((Revision of RS-414))
  • 186-E-1978 Passive Electronic Component Parts@ Test Methods for; General Instructions and Index of Tests
  • 186-14E-1985 Passive Electronic Component Parts@ Test Method for; Method 14: Panel Seal Test
  • EIA/ECCB-952-2004 Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment
  • 186-6E-1978 Passive Electronic Component Parts@ Test Methods for; Method 6: Mechanical Robustness of Terminals
  • 186-11E-1978 Passive Electronic Component Parts@ Test Methods for; Method 11: Thermal Shock in Air

AENOR, Electronic component

  • UNE 20547:1974 DATE CODE SYSTEMS FOR ELECTRONIC COMPONENTS
  • UNE 20512-6:2001 Presentation and specification of reliability data for electronic components
  • UNE 20535:1974 DIMENSIONS OF SPINDLE ENDS FOR MANUALLY OPERATED ELECTRONIC COMPONENTS
  • UNE 20634:1996 DIMENSIONS FOR THE MOUNTING OF SINGLE-HOLE, BUSH-MOUNTED, SPINDLE-OPERATED ELECTRONIC COMPONENTS.

未注明发布机构, Electronic component

  • BS EN 130800:2001(2003) Harmonized system of quality assessment for electronic components assessment for electronic components — Sectional specification : Tantalum surface mounting capacitors
  • BS EN 123000:1992(2000) Harmonized system ofquality assessment for electronic components Generic specification : Printed boards
  • BS EN 160000:1993(1999) Harmonized system ofquality assessment for electronic components Generic specification : Modular electronic units

European Committee for Standardization (CEN), Electronic component

  • HD 143.3 S1-1988 Packaging of components for automatic handling; part 3: packaging of leadless components on continuous tapes
  • HD 143.1 S1-1983 Packaging of components for automatic handling; part 1: tape packaging of components with axial leads on continuous tapes
  • HD 143.2 S1-1987 Packaging of components for automatic handling; part 2: tape packaging of components with unidirectional leads on continuous tapes

Professional Standard - Electron, Electronic component

  • SJ/T 11126-1997 Encapsulation materials of phenolic series for use in electronic components
  • SJ/T 11215-1999 Oeneral specifications of automatic taping machine for electronic components
  • SJ 3262-1989 General specification for packaging materials for use in electronic components
  • SJ/T 10733-1996 Types and dimensions of single-hole mounting bushes of electronic components
  • SJ 20450-1994 Specification of compound,coating and porcelain for potting electronic components

Government Electronic & Information Technology Association, Electronic component

Standard Association of Australia （SAA）, Electronic component

  • AS 4423:1996 Reference guide to Standards for passive electronic components

PT-IPQ, Electronic component

RO-ASRO, Electronic component

  • STAS 10003-1975 PASSIVE ELECTRON COMPONENTS Method of mcasumnent of nun linearily of resistors
  • STAS 10002-1975 PACKAGING OF ELECTRONIC COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES
  • STAS 9603-1974 PASSIVE ELECTRONIC COMPONENTS General rules for inspecting technical requirements for quality

IECQ - IEC: Quality Assessment System for Electronic Components, Electronic component

  • QC 400601/ JP 0001-1988 Detail Specification for Electronic Components Fixed Chip Resistors
  • QC 790132/SU 0005-1990 Detail Specification for Electronic Components Digital Integrated Circuits KII02AP4 - KII02AP14
  • PQC 39/SU 0008-1990 Detail Specification for Electronic Components Receiving Picture Tube 40LK12B
  • PQC 39/SU 0005-1989 Detail Specification for Electronic Components Receiving Picture Tube 50LK2B
  • PQC 39/SU 0004-1990 Detail Specification for Electronic Components Receiving Picture Tube 6ILK3B@ 6ILK4B
  • PQC 39/CS 0001-1992 Detail Specification for Electronic Components Colour Television Picture Tube A59TMZ40X01
  • QC 300201/ JP 0002-1984 Detail Specification for Electronic Components Fixed Tantalum Capacitors with Solid Electrolyte
  • QC 300301/ CN 0002-1989 Electronic Components: Fixed Aluminium Electrolytic Capacitors@ Type CD30; Assessment Level E
  • QC 300301/ CN 0005-1990 Electronic Components Fixed Aluminium Electrolytic Capacitors@ Type CD288; Assessment Level E
  • QC 300301/ CN 0001-1987 Electronic Components: Fixed Aluminium Electrolytic Capacitors@ Type CD11; Assessment Level E
  • QC 300301/ CN 0003-1989 Electronic Components: Fixed Aluminium Electrolytic Capacitors@ Type CD110; Assessment Level E
  • QC 001004-2000 International Electrotechnical Commission Quality Assessment System for Electronic Componenets
  • QC 300301/ JP 0005-1991 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Assessment Level(s) E
  • QC 300301/ JP 0004-1991 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Assessment Level(s) E
  • QC 300301/ JP 0006-1992 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Assessment Level(s) E
  • QC 250101/JP 0003-1988 Detail Specification for Electronic Components: Ferrite Cores; Assessment Level: A
  • QC 250101/JP 0004-1988 Detail Specification for Electronic Components; Ferrite Cores; Assessment Level: A
  • QC 250101/JP 0002-1988 Detail Specification for Electronic Components; Ferrite Cores; Assessment Level: A
  • QC 250101/JP 0001-1988 Detail Specification for Electronic Components; Ferrite Cores; Assessment Level: A
  • QC 300301/ JP 0003-1991 Electronic Components: Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Assessment Level(s) E
  • QC 300301/ JP 0002-1990 Electronic Components: Fixed Aluminium Electrolytic Capacitors with Solid Electrolyte Assessment Level(s) E
  • PQC 28-1984 Switches for Use in Electronic Components: Sectional Specification: Rotary Switches of Assessed Quality
  • PQC 39/SU 0006-1990 Detail Specification for Electronic Components Receiving Picture Tube 6ILK5C-I (Amendment -1992)
  • QC 301901/ JP 0005-1993 Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
  • QC 301901/ JP 0006-1993 Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
  • QC 300801/ JP 0001-1987 Detail Specification for Electronic Components Fixed Tantalum Chip Capacitors with Solid Electrolyte
  • QC 750108/ CN 0010-1992 Detail Specification for Electronic Components Ambient- Rated Silicon Rectifier Diode for Type 2CZ305
  • QC 750108/ CN 0008-1992 Detail Specification for Electronic Components Ambient- Rated Silicon Rectifier Diode for Type 2CZ317
  • QC 750101/ CN 0001-1990 Detail Specification for Electronic Components Silicon Switching Diode for Type 2CK120 Assessment Level II
  • QC 750108/ CN 0006-1992 Detail Specification for Electronic Components Ambient-Rated Silicon Rectifier Diode for Type 2CZ312
  • QC 750108/ CN 0007-1992 Detail Specification for Electronic Components Ambient-Rated Silicon Rectifier Diode for Type 2CZ313
  • QC 750108/ CN 0005-1992 Detail Specification for Electronic Components Ambient-Rated Silicon Rectifier Diode for Type 2CZ308
  • QC 750108/ CN 0009-1992 Detail Specification for Electronic Components Ambient- Rated Silicon Rectifier Diode for Type 2CZ318

German Institute for Standardization, Electronic component

  • DIN CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation; German version CLC/TS 50466:2006
  • DIN CLC/TS 50466:2006-12 Long duration storage of electronic components - Specification for implementation; German version CLC/TS 50466:2006
  • DIN EN IEC 62435-9:2022-09 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases (IEC 62435-9:2021); German version EN IEC 62435-9:2021 / Note: Date of issue 2022-08-05
  • DIN IEC 60319:2003-02 Presentation and specification of reliability data for electronic components (IEC 60319:1999)
  • DIN 45940-1104:1982 Harmonized system of quality assessment for electronic components; family specification
  • DIN 41593:1989 Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components
  • DIN 45804:1996 Guidance document: Interpretation of "EN ISO 9000:1994" - Reliability aspects for electronic components; German version CECC 00804:1996
  • DIN 41593:1989-09 Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

SAE - SAE International, Electronic component

Society of Automotive Engineers (SAE), Electronic component

  • SAE EIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan
  • SAE ARINC662-2000 STRATEGIES TO ADDRESS ELECTRONIC COMPONENT OBSOLESCENCE IN COMMERCIAL AIRCRAFT
  • SAE ARP7495-2020 Methods to Address Specific Issues Related to COTS Electronic Components in Airborne Electronic Hardware
  • SAE AS81969/43-2020 REMOVAL TOOLS, SOCKET HEAD, ELECTRONIC COMPONENTS, TYPE II, CLASS 1, COMPOSITION C
  • SAE AS81969/43A-2021 REMOVAL TOOLS, SOCKET HEAD, ELECTRONIC COMPONENTS, TYPE II, CLASS 1, COMPOSITION C
  • SAE AS81969/43B-2021 REMOVAL TOOLS, SOCKET HEAD, ELECTRONIC COMPONENTS, TYPE II, CLASS 1, COMPOSITION C

Danish Standards Foundation, Electronic component

PH-BPS, Electronic component

  • PNS IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
  • PNS IEC 62435-3:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
  • PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
  • PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

ES-UNE, Electronic component

  • UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)
  • UNE-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)
  • UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
  • UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
  • UNE-EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration Mechanisms (Endorsed by Asociación Española de Normalización in June of 2017.)
  • UNE-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (Endorsed by Asociación Española de Normalización in October of 2020.)
  • UNE-EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (Endorsed by Asociación Española de Normalización in November of 2021.)
  • UNE-EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
  • UNE-EN 9145:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
  • UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)

Electronic Components, Assemblies and Materials Association, Electronic component

  • ECA 186-9E-1978 Passive Electronic Component Parts, Test Methods for; Method 9: Solderability
  • ECA 186-12E-1978 Passive Electronic Component Parts, Test Methods for; Method 12: Heat-Life Test
  • ECA 186-5E-1978 Passive Electronic Component Parts, Test Methods for; Method 5: Salt Spray (Corrosion)
  • ECA 186-8E-1978 Passive Electronic Component Parts, Test Methods for; Method 8: Vibration, High Frequency
  • ECA 186-10E-1978 Passive Electronic Component Parts, Test Methods for; Method 10: Effect of Soldering
  • ECA 186-4E-1978 Passive Electronic Component Parts, Test Methods for; Method 4: Dielectric Test (Withstanding Voltage)
  • ECA 186-13E-1978 Passive Electronic Component Parts, Test Methods for; Method 13: Insulation Resistance Test
  • ECA 186-1E-1978 Passive Electronic Component Parts, Test Methods for; Method 1: Humidity (Steady State)
  • ECA 186-14E-1985 Passive Electronic Component Parts, Test Method for; Method 14: Panel Seal Test
  • ECA 186-2E-1978 Passive Electronic Component Parts, Test Methods for; Method 2: Moisture Resistance (Cycling)
  • ECA 534-1989 Ceramic Capacitor Applications Guide Soldering and Solderability Maintenance of Leaded Electronic Components
  • ECA 186-6E-1978 Passive Electronic Component Parts, Test Methods for; Method 6: Mechanical Robustness of Terminals
  • ECA 186-11E-1978 Passive Electronic Component Parts, Test Methods for; Method 11: Thermal Shock in Air
  • ECA 186-E-1978 Passive Electronic Component Parts, Test Methods for; General Instructions and Index of Tests
  • ECA 186-3E-1978 Passive Electronic Component Parts, Test Methods for; Method 3: Humidity (Steady State-Sealed Container)

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Electronic component

IN-BIS, Electronic component

Institute of Electrical and Electronics Engineers (IEEE), Electronic component

  • IEEE 200-1957 Reference designations for electrical and electronics parts and equipment
  • IEEE 200-1975 Reference designations for electrical and electronics parts and equipment

Aerospace Industries Association, Electronic component

  • AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
  • AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
  • AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
  • AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
  • AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
  • AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type

AIA/NAS - Aerospace Industries Association of America Inc., Electronic component

  • NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
  • NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
  • NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
  • NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
  • NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
  • NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type
  • NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
  • NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
  • NAS4121-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FORMED (Rev 1)
  • NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)

NEMA - National Electrical Manufacturers Association, Electronic component

  • NEMA VSP 1-2017 Susceptibility of Electrical and Electronic Components to Surge Damage

Group Standards of the People's Republic of China, Electronic component

  • T/CIET 089-2023 Carbon-neutral product evaluation specification for electronic components and electronic special materials manufacturing industry
  • T/CIET 090-2023 Carbon-neutral green technology evaluation specification for electronic components and electronic special materials manufacturing industry

GM North America, Electronic component

  • GM GMN10061-2003 Part Performance Requirements for Finishes of Electrical/Electronic Components

Military Standard of the People's Republic of China-General Armament Department, Electronic component

  • GJB 2649A-2011 Failure rate sampling plans and procedures for military electronic component parts
  • GJB 2649-1996 Military Electronic Component Failure Rate Sampling Plans and Procedures
  • GJB 1437-1992 Electronic component leads

IPC - Association Connecting Electronics Industries, Electronic component

HU-MSZT, Electronic component

Japanese Industrial Standards Committee (JISC), Electronic component

KR-KS, Electronic component

Professional Standard - Aerospace, Electronic component

  • QJ 1693-1989 Anti-static requirements for electronic components

FI-SFS, Electronic component

DE-VDA, Electronic component

  • VDA 605-2012 Phase out management of electronic components in the automotive aftermarket

Shanghai Provincial Standard of the People's Republic of China, Electronic component

  • DB31/ 842-2014 Specifications for Control of Occupational Hazards in Microelectronic Components Manufacturing Industry

Lithuanian Standards Office , Electronic component

  • LST HD 363 S1-2002 Dimensions of spindle ends for manually operated electronic components (IEC 60390:1972+A1:1976)

AT-OVE/ON, Electronic component

  • OVE EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (IEC 47/2667/CDV) (english version)

Electronic Industrial Alliance (U.S.), Electronic component

  • EIA RS-186-9E-1978 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 9:s SOLDERABILITY
  • EIA RS-186-1E-1978 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 1: HUMIDITY (STEADY STATE)
  • EIA RS-186-5E-1978 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 5: SALT SPRAY (CORROSION)
  • EIA RS-186-8E-1978 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 8: VIBRATION, HIGH FREQUENCY

ASHRAE - American Society of Heating@ Refrigerating and Air-Conditioning Engineers@ Inc., Electronic component

  Electronic component, pressure electronics, pressure electronics, Electronic component pressure, Electronic component pressure, Electronic component storage, Electronic component storage, Electronic component, High temperature of electronic components, Electronic components, Electronic component testing, Electronic component testing, microelectronic components, Electronic component equipment, Electronic component glass, Electronic components vibrate, Electronic component packaging, electronic components wet, Electronic and Electrical Components, Electronic component housing.

 



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