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Mechanical standardization of semiconductor devices. Parts 6-17:
Mechanical standardization of semiconductor devices. Parts 6-17:, Total:5 items.
In the international standard classification, Mechanical standardization of semiconductor devices. Parts 6-17: involves: Technical drawings, Semiconductor devices, Mechanical structures for electronic equipment.
German Institute for Standardization, Mechanical standardization of semiconductor devices. Parts 6-17:
- DIN EN 60191-6-17:2011-09 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...
- DIN EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr
ES-UNE, Mechanical standardization of semiconductor devices. Parts 6-17:
- UNE-EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...
Association Francaise de Normalisation, Mechanical standardization of semiconductor devices. Parts 6-17:
- NF C96-013-6-17*NF EN 60191-6-17:2012 Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land g
International Electrotechnical Commission (IEC), Mechanical standardization of semiconductor devices. Parts 6-17:
- IEC 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr