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Mechanical Standards

Mechanical Standards, Total:239 items.

In the international standard classification, Mechanical Standards involves: Tobacco, tobacco products and related equipment, HEALTH CARE TECHNOLOGY, Agricultural machines, implements and equipment, Woodworking equipment, Mechanical structures for electronic equipment, Kitchen equipment, Semiconductor devices, Electronic component assemblies, Microprocessor systems, Technical drawings, Graphical symbols, Pipeline components and pipelines, Iron and steel products, Electronic components in general, Integrated circuits. Microelectronics, Spools. Bobbins, Plant and equipment for the food industry, Coals, Vocabularies, Products of the textile industry, Services, Elements of buildings, Shipbuilding and marine structures in general, Standardization. General rules, Safety of machinery, Civil engineering in general, Cases. Boxes. Crates, Printed circuits and boards, Fuels.


(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Mechanical Standards

Professional Standard - Tobacco, Mechanical Standards

  • YC/Z 313-2009 Standard system for mechanics in tobacco industry
  • YC/T 213.4-2006 Material for tobacco machinery products. Classifying and coding. Part 4: Corporation standard parts

CN-STDBOOK, Mechanical Standards

  • 图书 3-8732 Basics of Heavy Machinery Standards
  • 图书 3-8764 Standard Materials for Heavy Machinery (Part 2)
  • 图书 3-8733 Heavy Machinery Standards--Transmission (Part 1)
  • 图书 3-8735 Heavy machinery standard transmission (below)
  • 图书 3-9842 Heavy Machinery Standards (2021) (Volume 3)
  • 图书 3-9840 Heavy Machinery Standards (2021) (Volume 1)
  • 图书 3-9844 Heavy Machinery Standards (2021) (Volume 5)
  • 图书 3-9841 Heavy Machinery Standards (2021) (Volume 2)
  • 图书 3-9564 Selection of Chinese Construction Machinery Standards
  • 图书 3-9843 Heavy Machinery Standards (2021) (Volume 4)
  • 图书 3-9848 Compilation of Textile Machinery Standards (Volume Three)
  • 图书 3-9073 Compilation of Textile Machinery Standards (Volume 1)
  • 图书 3-8730 Standard Threads and Fasteners for Heavy Machinery (Part 1)
  • 图书 3-8729 Standard threads and fasteners for heavy machinery (below)
  • 图书 3-8897 Standard compilation of lifting appliances for bridge and gantry cranes
  • 图书 3-8747 Standard springs, bearings and other parts and accessories for heavy machinery

Professional Standard - Medicine, Mechanical Standards

Xinjiang Provincial Standard of the People's Republic of China, Mechanical Standards

American National Standards Institute (ANSI), Mechanical Standards

  • ANSI O1.1-2013 Standard for Woodworking Machinery - Safety Requirements
  • ANSI/UL 763c-2012 Standard for Motor-Operated Commercial Food Preparing Machines
  • ANSI/VITA 48.5-2010 Mechanical Standard for Electronic Plug-in units Using Air Flow Through Cooling

SAE - SAE International, Mechanical Standards

  • SAE HS-2800-1998 Construction@ Agricultural@ and Off-Road Machinery Standards Manual
  • SAE J872-1986 Drawbar Test Procedure for Construction@ Forestry@ and Industrial Machines@ Standard
  • SAE J1446-1989 On-Machine Alarm Test and Evaluation Procedure for Construction and General Purpose Industrial Machinery@ Standard

British Standards Institution (BSI), Mechanical Standards

  • BS IEC 60191-2:1966+A21:2020 Mechanical standardization of semiconductor devices. Dimensions
  • BS IEC 60191-2:1966+A18:2011 Mechanical standardization of semiconductor devices. Dimensions
  • 15/30328077 DC BS EN 60191-2. Mechanical standardization of semiconductor devices. Part 2. Dimensions
  • BS EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
  • BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of discrete devices
  • BS 3934-1:1992 Mechanical standardization of semiconductor devices - Recommendations for the preparation of drawings of semiconductor devices
  • BS EN 60191-3:2000 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits
  • BS 3934-10:1992 Mechanical standardization of semiconductor devices - Schedule of UK national drawings giving dimensions
  • BS 3934-5:1997 Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
  • BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
  • BS EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
  • BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
  • BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • 13/30290462 DC BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
  • PD ISO/TR 19201:2013 Mechanical vibration. Methodology for selecting appropriate machinery vibration standards

Japanese Industrial Standards Committee (JISC), Mechanical Standards

  • JIS C 7040:1969 General rules for mechanical standardization of semiconductor integrated circuits

International Electrotechnical Commission (IEC), Mechanical Standards

  • IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions
  • IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD5:2002 Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2-DB:2012 Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD18:2011 Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2Y:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions (23rd Supplement to Publication 60191-2:1966)
  • IEC 60191-2:1966/AMD2:2001 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 2
  • IEC 60191-2U:1997 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 19
  • IEC 60191-2T:1996 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 18
  • IEC 60191-2Z:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 24
  • IEC 60191-2X:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22
  • IEC 60191-2W:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 21
  • IEC 60191-2V:1998 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 20
  • IEC 60191-2X/COR1:2000 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22; Corrigendum 1
  • IEC 60191-2:1966/AMD10:2004 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 10
  • IEC 60191-2:1966/AMD21:2020 Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD17:2008 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 17
  • IEC 60191-2:1966/AMD8:2003 Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
  • IEC 60191-2:1966/AMD12:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 12
  • IEC 60191-2:1966/AMD7:2002 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 7
  • IEC 60191-2:1966/AMD4:2001 Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD14:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 14
  • IEC 60191-2:1966/AMD9:2003 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 9
  • IEC 60191-2:1966/AMD16:2007 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 16
  • IEC 60191-2X:1999/COR1:2000 Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD1:2001 Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD15:2006 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 15
  • IEC 60191-2:1966/AMD3:2001 Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD11:2004 Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD13:2006 Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD20:2018 Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
  • IEC 60191-2:1966/AMD6:2002 Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
  • IEC 60191-2:1966/AMD19:2012 Mechanical standardization of semiconductor devices - Part 2 : Dimensions; Amendment 19
  • IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
  • IEC 60191-2S:1995 Mechanical standardization of semiconductor devices - Part 2: Dimensions; 17. Supplement to IEC 191-2 (1966)
  • IEC 60191-2R:1995 Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 16 to IEC 60191-2(1966)
  • IEC 60191-1A:1969 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
  • IEC 60191-1C:1974 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices.
  • IEC 60191-2P:1988 Mechanical standardization of semiconductor devices; part 2: dimensions; fourteenth supplement to IEC 191-2:1966
  • IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
  • IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
  • IEC 60191-3:1974 Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits
  • IEC 60191-3F:1994 Mechanical standardization of semiconductor devices; part 3: general rules for the preparation of outline drawings of integrated circuits; supplement 6
  • IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
  • IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
  • IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60191-3/AMD1:1983 Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits
  • IEC 60191-3C:1987 Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits.
  • IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices
  • IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
  • IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Institute of Electrical and Electronics Engineers (IEEE), Mechanical Standards

Professional Standard - Electron, Mechanical Standards

  • SJ/Z 9021.2-1987 Mechanical standardization of semiconductor devices--Part 2:Dimensions
  • SJ/Z 9021.1-1987 Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
  • SJ/Z 9021.3-1987 Mechanical standardization of semiconductor components Part 3 General rules for the preparation of outline drawings of integrated circuits

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Mechanical Standards

  • IEEE 1101.3-1993 Mechanical Standard for Conduction-Cooled and Air-Cooled 10 SU Modules (IEEE Computer Society Document)

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Mechanical Standards

  • IPC 9851-2007 SMEMA Standard Mechanical Equipment Interface Standard

ES-AENOR, Mechanical Standards

American Society for Testing and Materials (ASTM), Mechanical Standards

  • ASTM A554-98e1 Standard Specification for Welded Stainless Steel Mechanical Tubing
  • ASTM A554-08 Standard Specification for Welded Stainless Steel Mechanical Tubing
  • ASTM A554-21 Standard Specification for Welded Stainless Steel Mechanical Tubing
  • ASTM A554-03 Standard Specification for Welded Stainless Steel Mechanical Tubing
  • ASTM A511/A511M-08 Standard Specification for Seamless Stainless Steel Mechanical Tubing
  • ASTM A554-08a Standard Specification for Welded Stainless Steel Mechanical Tubing
  • ASTM A519-96(2001) Standard Specification for Seamless Carbon and Alloy Steel Mechanical Tubing
  • ASTM A519/A519M-17 Standard Specification for Seamless Carbon and Alloy Steel Mechanical Tubing
  • ASTM F1966-03(2008) Standard Specification for Dough Divider and Rounding Machines
  • ASTM D7430-17 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-18 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-18ae1 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430/D7430M-20 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-18a Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-16be1 Standard Practice for Mechanical Sampling of Coal
  • ASTM A519-06(2012) Standard Specification for Seamless Carbon and Alloy Steel Mechanical Tubing
  • ASTM D76/D76M-11 Standard Specification for Tensile Testing Machines for Textiles
  • ASTM A513/A513M-18 Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A787/A787M-20 Standard Specification for Electric-Resistance-Welded Metallic-Coated Carbon Steel Mechanical Tubing
  • ASTM A513/A513M-19 Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A513-08 Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A513-06a Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A513/A513M-20 Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A787-01 Standard Specification for Electric-Resistance-Welded Metallic-Coated Carbon Steel Mechanical Tubing
  • ASTM A787/A787M-20a Standard Specification for Electric-Resistance-Welded Metallic-Coated Carbon Steel Mechanical Tubing
  • ASTM A787/A787M-22 Standard Specification for Electric-Resistance-Welded Metallic-Coated Carbon Steel Mechanical Tubing
  • ASTM A513/A513M-20a Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A513/A513M-15 Standard Specification for Electric-Resistance-Welded Carbon and Alloy Steel Mechanical Tubing
  • ASTM A787/A787M-15 Standard Specification for Electric-Resistance-Welded Metallic-Coated Carbon Steel Mechanical Tubing
  • ASTM F1511-16 Standard Specification for Mechanical Seals for Shipboard Pump Applications
  • ASTM F1511-18 Standard Specification for Mechanical Seals for Shipboard Pump Applications
  • ASTM D7430/D7430M-21 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430/D7430M-22 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-12a Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-09 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-10 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-14 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-15 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-16a Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-16b Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-15a Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-08 Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-08a Standard Practice for Mechanical Sampling of Coal
  • ASTM D7430-08ae1 Standard Practice for Mechanical Sampling of Coal

IT-UNI, Mechanical Standards

National Fire Protection Association (NFPA), Mechanical Standards

German Institute for Standardization, Mechanical Standards

  • DIN EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007
  • DIN EN 60191-3:2000-07 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
  • DIN EN IEC 60191-1:2018-10 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018 / Note: DIN EN 60191-1 (2007-11) remains valid alongside this...
  • DIN EN 60191-3:2000 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
  • DIN EN 60191-3 Bb.1:2006 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
  • DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
  • DIN EN 60191-6-13:2017-06 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016 / Note: DIN ...
  • DIN EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
  • DIN EN 60191-3 Beiblatt 1:2006-08 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
  • DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...
  • DIN EN 60191-6-19:2010-10 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
  • DIN EN 60191-6-16:2007-11 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 / Note: To be replaced by DIN EN 60191-6-16 (2013-...

Association Francaise de Normalisation, Mechanical Standards

  • NF EN 60191-3:2000 Normalisation mécanique des dispositifs à semiconducteurs - Partie 3 : règles générales pour la préparation des dessins d'encombrement des circuits intégrés
  • NF EN IEC 60191-1:2018 Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1 : règles générales pour la préparation des dessins d'encombrement des dispositifs discrets
  • NF C96-013-1*NF EN 60191-1:2013 Mechanical standardization of semiconductor devices - Part 1 : general rules for the preparation of outline drawings of discrete devices
  • NF C96-013-3*NF EN 60191-3:2000 Mechnical standardization of semiconductor devices - Part 3 : general rules for the preparation of outline drawings of integrated circuits
  • NF EN 60191-6-16:2013 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-16 : glossaire des supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA
  • NF EN 60191-4/A1:2018 Normalisation mécanique des dispositifs à semiconducteurs - Partie 4 : système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs
  • NF EN 60191-4:2014 Normalisation mécanique des dispositifs à semiconducteurs - Partie 4 : système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs
  • FD E03-002:2006 Screw threads - General sight over standardization of mechanical engineering
  • FD ISO/TR 19201:2013 Vibrations mécaniques - Méthodologie pour la sélection des normes appropriées relatives aux vibrations des machines
  • NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
  • NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
  • NF EN 60191-6:2011 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6 : règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semiconducteurs pour montage en surface
  • NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • NF C96-013-4*NF EN 60191-4:2000 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
  • NF C96-013-4/A1*NF EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
  • NF EN 60191-6-19:2010 Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19 : méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible

Danish Standards Foundation, Mechanical Standards

  • DS/EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
  • DS/EN 60191-3:2001 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
  • DS/ISO/TR 18569:2004 Safety of machinery - Guidelines for the understanding and use of safety of machinery standards
  • DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • DS/EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
  • DS/EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

CENELEC - European Committee for Electrotechnical Standardization, Mechanical Standards

  • EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
  • EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Incorporates Amendment A1: 2018)

AENOR, Mechanical Standards

  • UNE-EN 60191-3:2001 Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.

ES-UNE, Mechanical Standards

  • UNE-EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (Endorsed by Asociación Española de Normalización in May of 2018.)
  • UNE-EN 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 20...
  • UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)
  • UNE-EN 60191-6-19:2010 Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)

HU-MSZT, Mechanical Standards

Group Standards of the People's Republic of China, Mechanical Standards

  • T/HAEMMS 002-2023 Construction Machinery Operation Standard - Rotary drilling rig driver
  • T/HNZLXH 0005-2022 Operational Standards of Construction Machinery of China Lease United - Grader Driver
  • T/HNZLXH 0006-2022 Operational Standards of Construction Machinery of China Lease United - Paver Driver
  • T/HNZLXH 0003-2022 China Leasing United construction machinery operating standards - bulldozer drivers
  • T/HNZLXH 0004-2022 Operational Standards of Construction Machinery of China Lease United - Road Roller Driver
  • T/HNZLXH 0003-2021 China Leasing United construction machinery operating standards - loader driver
  • T/HNZLXH 0002-2022 Operational Standards of Construction Machinery of China Lease United - Truck Crane Driver

国家市场监督管理总局、中国国家标准化管理委员会, Mechanical Standards

  • GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
  • GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Mechanical Standards

  • GB/T 15879-1995 Mechanical standardization of semiconductor devices--Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
  • GB/T 20850-2007 Safety of machinery Guidelines for the understanding and use of safety of machinery standards
  • GB/T 20850-2014 Safety of machinery.Guidelines for the understanding and use of safety of machinery standards

CZ-CSN, Mechanical Standards

ZA-SANS, Mechanical Standards

  • SANS 613:2009 Fenestration products - Mechanical performance criteria

Korean Agency for Technology and Standards (KATS), Mechanical Standards

Professional Standard - Speciality, Mechanical Standards

Lithuanian Standards Office , Mechanical Standards

  • LST EN 60191-1-2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007)
  • LST EN 60191-3-2002 Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999)

European Committee for Electrotechnical Standardization(CENELEC), Mechanical Standards

  • EN 60191-3:1999 Mechanical Standardization of Semiconductor Devices Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits
  • EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
  • EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

International Organization for Standardization (ISO), Mechanical Standards

  • ISO/TR 18569:2004 Safety of machinery - Guidelines for the understanding and use of safety of machinery standards

KR-KS, Mechanical Standards

  • KS B ISO TR 18569-2016 Safety of machinery-Guidelines for the understanding and use of safety of machinery standards

RU-GOST R, Mechanical Standards

  • GOST 26838-1986 Wooden boxes and roof boardings. Standards of mechanical strength

RO-ASRO, Mechanical Standards

  • STAS CEI 191-4-1992 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor devices
  • STAS 6857/1-1985 Tohnical documcntation ?n machine building gENEraL reqUirements for drawings

IEC - International Electrotechnical Commission, Mechanical Standards

  • PAS 60191-6-19-2008 Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (Edition 1.0)




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