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migration test
migration test, Total:26 items.
In the international standard classification, migration test involves: Semiconductor devices, Applications of information technology, Electronic component assemblies, Electromechanical components for electronic and telecommunications equipment, Welding, brazing and soldering.
British Standards Institution (BSI), migration test
- BS IEC 62880-1:2017 Semiconductor devices. Stress migration test standard - Copper stress migration test standard
- BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods. Surface insulation resistance comb test and electrochemical migration test of flux residues
- 14/30297227 DC BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, migration test
International Electrotechnical Commission (IEC), migration test
- IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
Professional Standard - Commodity Inspection, migration test
GM North America, migration test
Danish Standards Foundation, migration test
CENELEC - European Committee for Electrotechnical Standardization, migration test
- EN 62415:2010 Semiconductor devices - Constant current electromigration test
Association Francaise de Normalisation, migration test
- NF EN 62415:2010 Dispositifs à semiconducteurs - Essai d'électromigration en courant constant
ES-UNE, migration test
- UNE-EN 62415:2010 Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
- UNE-EN 16889:2017 Food hygiene - Production and dispense of hot beverages from hot beverage appliances - Hygiene requirements, migration test
German Institute for Standardization, migration test
- DIN EN 62415:2010-12 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
- DIN EN 16889:2016-10 Food hygiene - Production and dispense of hot beverages from hot beverage appliances - Hygiene requirements, migration test; German version EN 16889:2016
Lithuanian Standards Office , migration test
- LST EN 62415-2010 Semiconductor devices - Constant current electromigration test (IEC 62415:2010)
- LST EN ISO 9455-17:2006 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
Group Standards of the People's Republic of China, migration test
- T/SDII 005-2023 Specification for system migration test of information technology application innovation
Institute of Interconnecting and Packaging Electronic Circuits (IPC), migration test
- IPC 9691-2005 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- IPC TM-650 2.6.14.1-2000 Electrochemical Migration Resistance Test
IPC - Association Connecting Electronics Industries, migration test
- IPC 9691A CHINESE-2007 User Guide for the IPC-TM-650@ Method 2.6.25@ Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- IPC 9691A CD-2007 User Guide for the IPC-TM-650@ Method 2.6.25@ Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- IPC 9691A CHINESE CD-2007 User Guide for the IPC-TM-650@ Method 2.6.25@ Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- IPC 9691B CHINESE-2016 User Guide for the IPC-TM-650@ Method 2.6.25@ Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
AENOR, migration test
- UNE-EN ISO 9455-17:2007 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)