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Test method for coefficient of linear thermal expansion
Test method for coefficient of linear thermal expansion, Total:7 items.
In the international standard classification, Test method for coefficient of linear thermal expansion involves: Glass, Plastics, Semiconductor devices.
Japanese Industrial Standards Committee (JISC), Test method for coefficient of linear thermal expansion
- JIS R 3102:1995 Testing method for average linear thermal expansion of glass
- JIS K 7197:1991 Testing method for linear thermal expansion coefficient of plastics by thermomechanical analysis
Association Francaise de Normalisation, Test method for coefficient of linear thermal expansion
- NF EN 62047-11:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 11 : méthode d'essai pour les coefficients de dilatation thermique linéaire des matériaux autonomes pour systèmes microélectromécaniques
German Institute for Standardization, Test method for coefficient of linear thermal expansion
- DIN EN 62047-11:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
ES-UNE, Test method for coefficient of linear thermal expansion
- UNE-EN 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (Endorsed by AENOR in November of 2013.)
Danish Standards Foundation, Test method for coefficient of linear thermal expansion
- DS/EN 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
European Committee for Electrotechnical Standardization（CENELEC）, Test method for coefficient of linear thermal expansion
- EN 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems