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stress test

stress test, Total:104 items.

In the international standard classification, stress test involves: Glass, Railway engineering in general, Testing of metals, Shipbuilding and marine structures in general, Lifting equipment, Hydraulic energy engineering, Electronic tubes, Solar energy engineering, Construction equipment, Structures of buildings, Audio, video and audiovisual engineering, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Earth-moving machinery, Mining equipment, External sewage systems, Quality, Electrical engineering in general, Integrated circuits. Microelectronics, Packaging and distribution of goods in general, Structure and structure elements, Hydraulic construction, Fasteners.


General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, stress test

  • GB/T 18144-2000 Test method for measurement of stress in glass
  • GB/T 18144-2008 Test method for measurement of stress in glass
  • GB/T 34899-2017 Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy

国家铁路局, stress test

RO-ASRO, stress test

  • STAS 11399-1980 Tests of metals TORSIONAL STRESS TESTING
  • STAS 12072-1982 Testing of metals TESTING OF PLATED STEELS AT SHEARING STRENGTH
  • STAS 2700/12-1985 Threaded fasteners General trehnical requirenments for qualitv MECHAN ICAL PROPERTIES AND TEST MHTHODS FOR screwed pins not vnder tensile stress

Professional Standard - Railway, stress test

Group Standards of the People's Republic of China, stress test

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, stress test

  • GB/T 31093-2014 Test method for stress of monocrystalline sapphire ingot
  • GB/T 33941.1-2017 Earth-moving machinery—Structure stress test method—Part 1: General principles
  • GB/T 33941.2-2017 Earth-moving machinery—Structure stress test method—Part 2: Frame of wheeled loaders

Professional Standard-Ships, stress test

  • CB/T 3395-2013 Test method for determining residual stresses by the hole-drilling strain-gage method
  • CB 3395-1992 Residual Stress Test Method Drilling Strain Release Method

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, stress test

Korean Agency for Technology and Standards (KATS), stress test

  • KS B 0951-2008 Instrumented indentation tests on welds in steel-Measurement of residual stress on welded joints
  • KS C IEC 60749-4:2020 Semiconductor devices — Mechanical and climatic test methods — Part 4: Damp heat, steady state,highly accelerated stress test(HAST)
  • KS B 0551-1996 Mechanical properties of fasteners Part 7 : Torsional test and minimum fracture torques for bolts and screws with nominal diameters 1 mm to 10 mm
  • KS B 0551-2015 Mechnical properties of fasteners — Part 7: Torsional test and minimum fracture torques for bolts and screws with nominal diameters 1 mm to 10 mm
  • KS M 6785-1994 Testing methods of stress-strain properties at low deformation for vulcanized rubber

CZ-CSN, stress test

Professional Standard - Electricity, stress test

  • DL/T 5367-2007 Code for rock mass stress measurements of hydroelectric and water conservancy engineering

Professional Standard - Electron, stress test

  • SJ/T 10936-1996 Methods of measurement for residue stress in color picture tube bulbs
  • SJ 3232.2-1989 Test method for bonding residual stress of low-melting welding glass powder

Professional Standard - Aerospace, stress test

  • QJ 3156-2002 Stress test method for large structure of missile ground equipment

Danish Standards Foundation, stress test

  • DS/IEC TS 63209-1:2021 Photovoltaic modules – Extended-stress testing – Part 1: Modules
  • DS/EN 60512-6-2:2002 Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
  • DS/EN 60512-4-1:2003 Connectors for electronic equipment - Tests and measurements - Part 4-1: Voltage stress tests - Test 4a: Voltage proof
  • DS/EN 60512-6-4:2002 Connectors for electronic equipment - Tests and measurements - Part 6-4: Dynamic stress tests - Test 6d: Vibration (sinusoidal)
  • DS/EN 60512-4-2:2002 Connectors for electronic equipment - Tests and measurements - Part 4-2: Voltage stress tests - Test 4b: Partial discharge
  • DS/EN 60512-6-1:2002 Connectors for electronic equipment - Tests and measurements - Part 6-1: Dynamic stress tests - Test 6a: Acceleration, steady state
  • DS/EN 60512-4-3:2002 Connectors for electronic equipment - Tests and measurements - Part 4-3: Voltage stress tests - Test 4c: Voltage proof of pre-insulated crimp barrels
  • DS/EN 60749-4/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
  • DS/EN 60749-4:2003 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
  • DS/EN 60512-6-5:2001 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests - Section 5: Test 6e: Random vibration

Professional Standard - Water Conservancy, stress test

  • SL 565-2012 Residual stress analysis for hydraulic steel structure by magnetoelastic method
  • SL 499-2010 Standard test method for determining residual stresses by the hole-drilling strain-gage method (ASTM E837-08,IDT)

Guangdong Provincial Standard of the People's Republic of China, stress test

  • DB44/T 1555-2015 Interconnect Stress Test Method for High Density Printed Circuit Boards

Military Standard of the People's Republic of China-General Armament Department, stress test

  • GJB 10056-2021 Residual stress test method for aero-engine metal materials

British Standards Institution (BSI), stress test

  • BS IEC 62880-1:2017 Semiconductor devices. Stress migration test standard - Copper stress migration test standard
  • BS EN 62429:2008 Reliability growth - Stress testing for early failures in unique complex systems
  • BS EN 60749-4:2017 Semiconductor devices. Mechanical and climatic test methods - Damp heat, steady state, highly accelerated stress test (HAST)
  • PD IEC TR 62878-2-7:2019 Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
  • 20/30394594 DC BS IEC 62899-506-1. Printed electronics - Part 506-1. Quality assessment- Accelerated stress test of printed heating element

GM Global, stress test

  • GMW 17083-2013 Substrate Surface Stress Test for molded ABS and ABS/PC Issue 1; English

AENOR, stress test

  • UNE-EN 60512-6-2:2002 Connectors for electronic equipment - Tests and measurements -- Part 6-2: Dynamic stress tests - Test 6b: Bump.
  • UNE-EN 60512-6-3:2002 Connectors for electronic equipment - Tests and measurements -- Part 6-3: Dynamic stress tests - Test 6c: Shock.
  • UNE-EN 60512-4-2:2002 Connectors for electronic equipment - Tests and measurements -- Part 4-2: Voltage stress tests - Test 4b: Partial discharge.
  • UNE-EN 60512-6-1:2002 Connectors for electronic equipment - Tests and measurements -- Part 6-1: Dynamic stress tests - Test 6a: Acceleration, steady state.
  • UNE-EN 60512-6-4:2002 Connectors for electronic equipment - Tests and measurements -- Part 6-4: Dynamic stress tests - Test 6d: Vibration (sinusoidal).
  • UNE-EN 60512-4-3:2002 Connectors for electronic equipment - Tests and measurements -- Part 4-3: Voltage stress tests - Test 4c: Voltage proof of pre-insulated crimp barrels.
  • UNE-EN 60749-4:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST).
  • UNE-EN 60512-6-5:2000 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods -- Part 6: Dynamic stress tests -- Section 5: Test 6e: Random vibration.

Association Francaise de Normalisation, stress test

  • NF EN 60512-6-3:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 6-3 : essais de contraintes dynamiques - Essai 6c : chocs
  • NF EN 60512-6-2:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 6-2 : essais de contraintes dynamiques - Essai 6b : secousses
  • NF EN 60512-4-2:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 4-2 : essais de contrainte diélectrique - Essai 4b : décharges partielles
  • NF EN 60512-4-1:2003 Connecteurs pour équipements électroniques - Essais et mesures - Partie 4-1 : essais de contrainte diélectrique - Essai 4a : tension de tenue
  • NF EN 60512-6-4:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 6-4 : essais de contraintes dynamiques - Essai 6d : vibrations (sinusoïdales)
  • NF EN 60512-6-1:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 6-1 : essais de contraintes dynamiques - Essai 6a : accélération constante
  • NF EN 60512-4-3:2002 Connecteurs pour équipements électroniques - Essais et mesures - Partie 4-3 : essais de contrainte diélectrique - Essai 4c : tension de tenue pour fûts préisolés de sertissage
  • NF C96-022-4*NF EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)
  • NF EN 60512-6-5:2000 Composants électromécaniques pour équipements électroniques - Procédures d'essai de base et méthodes de mesure - Partie 6 : essais de contraintes dynamiques - Section 5 : essai 6e : vibrations aléatoires

German Institute for Standardization, stress test

  • DIN EN 60512-4-1:2004-01 Connectors for electronic equipment - Tests and measurements - Part 4-1: Voltage stress tests - Test 4a: Voltage proof (IEC 60512-4-1:2003); German version EN 60512-4-1:2003 / Note: DIN IEC 60512-2 (1994-05) remains valid alongside this standard until ...
  • DIN EN 60512-6-3:2003-01 Connectors for electronic equipment - Tests and measurements - Part 6-3: Dynamic stress tests; Test 6c: Shock (IEC 60512-6-3:2002); German version EN 60512-6-3:2002 / Note: DIN IEC 60512-4 (1994-05) remains valid alongside this standard until 2005-04-01.
  • DIN EN 60512-6-2:2003-01 Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests; Test 6b: Bump (IEC 60512-6-2:2002); German version EN 60512-6-2:2002 / Note: DIN IEC 60512-4 (1994-05) remains valid alongside this standard until 2005-04-01.
  • DIN EN 60512-6-4:2003-01 Connectors for electronic equipment - Tests and measurements - Part 6-4: Dynamic stress tests; Test 6d: Vibration (sinusoidal) (IEC 60512-6-4:2002); German version EN 60512-6-4:2002 / Note: DIN IEC 60512-4 (1994-05) remains valid alongside this standar...
  • DIN EN 60512-4-2:2003-01 Connectors for electronic equipment - Tests and measurements - Part 4-2: Voltage stress tests; Test 4b: Partial discharge (IEC 60512-4-2:2002); German version EN 60512-4-2:2002 / Note: DIN IEC 60512-2 (1994-05) remains valid alongside this standard unt...
  • DIN EN 60512-6-1:2003-01 Connectors for electronic equipment - Tests and measurements - Part 6-1: Dynamic stress tests; Test 6a: Acceleration, steady state (IEC 60512-6-1:2002); German version EN 60512-6-1:2002 / Note: DIN IEC 60512-4 (1994-05) remains valid alongside this sta...
  • DIN EN 60512-4-3:2003-01 Connectors for electronic equipment - Tests and measurements - Part 4-3: Voltage stress tests; Test 4c: Voltage proof of pre-insulated crimp barrels (IEC 60512-4-3:2002); German version EN 60512-4-3:2002 / Note: DIN IEC 60512-2 (1994-05) remains valid ...

Professional Standard - Coal, stress test

  • MT/T 977-2006 The equipments specifications of the crag body stress test set by means of sleeve compression fracture method in mine

GOSTR, stress test

工业和信息化部, stress test

  • YS/T 1578-2022 Test method for residual stress of copper and copper alloy seamless pipes cutting method

American Society for Testing and Materials (ASTM), stress test

  • ASTM D7498-09 Standard Test Method for Vertical Strip Drains Using a Large Scale Consolidation Test

International Electrotechnical Commission (IEC), stress test

  • IEC TS 63209-2:2022 Photovoltaic modules - Extended-stress testing - Part 2: Polymeric component materials
  • IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

水利部, stress test

  • SL 547-2011 Test method for residual stress of hydraulic metal structures X-ray diffraction method

European Committee for Standardization (CEN), stress test

  • EN 62429:2008 Reliability growth — Stress testing for early failures in unique complex systems

Fujian Provincial Standard of the People's Republic of China, stress test

  • DB35/T 1429-2014 Earth-moving machinery structure stress test method track-type bulldozer balance beam

Electronic Components, Assemblies and Materials Association, stress test

  • ECA EIA-364-86A-2014 TP-86A Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets

ECIA - Electronic Components Industry Association, stress test

  • EIA-364-86A-2014 TP-86A Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets
  • EIA-364-86-1996 TP-86 Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets

Lithuanian Standards Office , stress test

  • LST EN 60512-4-1-2004 Connectors for electronic equipment. Tests and measurements. Part 4-1: Voltage stress tests. Test 4a: Voltage proof (IEC 60512-4-1:2003)
  • LST EN 60512-4-2-2003 Connectors for electronic equipment. Tests and measurements. Part 4-2: Voltage stress tests. Test 4b: Partial discharge (IEC 60512-4-2:2002)
  • LST EN 60512-4-3-2003 Connectors for electronic equipment. Tests and measurements. Part 4-3: Voltage stress tests. Test 4c: Voltage proof of pre-insulated crimp barrels (IEC 60512-4-3:2002)
  • LST EN 60749-4-2003 Semiconductor devices. Mechanical and climatic test methods. Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2002)

IPC - Association Connecting Electronics Industries, stress test

  • IPC TR-486 CD-2001 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations

Professional Standard - Pharmaceutical Packaging, stress test

ES-UNE, stress test

  • UNE-EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (Endorsed by Asociación Española de Normalización in July of 2017.)
  • UNE-EN ISO 15630-3:2019 Steel for the reinforcement and prestressing of concrete - Test methods - Part 3: Prestressing steel (ISO 15630-3:2019, Corrected version 2019-10)

Institute of Interconnecting and Packaging Electronic Circuits (IPC), stress test

  • IPC TR-486-2001 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations

KR-KS, stress test

  • KS C IEC 60749-4-2020 Semiconductor devices — Mechanical and climatic test methods — Part 4: Damp heat, steady state,highly accelerated stress test(HAST)

Indonesia Standards, stress test

  • SNI 07-6735-2002 Test methods for determining residual stresses by the hole-drilling strain-gage methods

AT-ON, stress test

  • ONORM B 3646 Teil.3-1986 Roll roofings and prefabricated Sheets for waterproofing made ofbitumen or modified bitumen; testing;test of tenslle strength

RU-GOST R, stress test

Anhui Provincial Standard of the People's Republic of China, stress test

  • DB34/T 3367-2019 Test method for thermal stress in plated-through holes of printed circuit boards

BE-NBN, stress test





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