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Conductive film
Conductive film, Total:52 items.
In the international standard classification, Conductive film involves: Optics and optical measurements, Graphical symbols, Printed circuits and boards, Semiconducting materials, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Electronic component assemblies, Production in the chemical industry, Footwear, Electronic display devices.
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Conductive film
- GB/T 26598-2011 Transparent conductive thin film speciation for optical instruments
British Standards Institution (BSI), Conductive film
- 21/30434810 DC BS EN IEC 62899-202-8. Printed electronics - Part 202-8. Materials. Conductive film. Measurement for difference in resistance with printing direction of conductive film fabricated with wire shaped materials
- BS IEC 62899-202-3:2019 Printed electronics - Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
- BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
- BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
- BS EN 61249-8-7:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Marking legend inks
- BS EN 61249-8-8:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Temporary polymer coatings
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- 18/30366168 DC BS EN 62899-202-6. Printed electronics. Part 202-6. Materials. Conductive film. Environmental test of a printed metal based conductive layer on flexible substrate
Korean Agency for Technology and Standards (KATS), Conductive film
- KS C IEC 61249-5-4:2003 Material for interconnection structures-Part 5:Sectional specification set for conductive foils and films with or without coatings-Section 4:Conductive inks
- KS C IEC 61249-5-4-2003(2019)
- KS C IEC 62951-1:2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
- KS L 1620-2013 Test methods for measuring resistivity of electrically conductive ceramic thin films with Van der Pauw method
- KS L 1620-2003 Test methods for measuring resistivity of electrically conductive ceramic thin films with Van der Pauw method
- KS L 1619-2013 Testing methods for resistivity of conductive fine ceramic thin films with four point probe array
- KS L 1619-2003 Test methods for measuring resistivity of electrically conductive ceramic thin films with four point probe method
Association Francaise de Normalisation, Conductive film
- NF C96-050-22*NF EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates
- NF EN 62047-22:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 22 : méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples
- NF EN 61249-8-7:1997 Matériaux pour les structures d'interconnexion - Partie 8 : collection de spécifications intermédiaires pour films non conducteurs et revêtements - Section 7 : encres de marquage.
- NF C93-747*NF EN 61249-8-7:1997 Materials for interconnection structures. Part 8 : sectional specification set for non conductive films and coatings. Section 7 : marking legend links.
- NF EN 61249-8-8:1998 Matériaux pour les structures d'interconnexion - Partie 8 : collection de spécifications intermédiaires pour les films et revêtements non conducteurs - Section 8 : revêtements amovibles de polymère.
International Electrotechnical Commission (IEC), Conductive film
- IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
- IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
- IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
European Committee for Electrotechnical Standardization（CENELEC）, Conductive film
- EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
- EN 61249-8-7:1996 Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 7: Marking Legend Inks
- EN 61249-8-8:1997 Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings
ES-UNE, Conductive film
- UNE-EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)
Institute of Interconnecting and Packaging Electronic Circuits (IPC), Conductive film
- IPC 3408-1996 General Requirements for Anisotropically Conductive Adhesive Films
German Institute for Standardization, Conductive film
- DIN EN 62047-22:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
- DIN EN 61249-8-7:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; section 7: Marking legend inks (IEC 61249-8-7:1996); German version EN 61249-8-7:1996
- DIN EN 62047-22:2015 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
- DIN EN 61249-8-8:1998 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997
- DIN EN 61249-8-7:1997-02 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; section 7: Marking legend inks (IEC 61249-8-7:1996); German version EN 61249-8-7:1996
- DIN EN 61249-8-8:1998-01 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997
AENOR, Conductive film
- UNE-EN 61249-8-7:1997 MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
- UNE-EN 61249-8-8:2000 Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
Danish Standards Foundation, Conductive film
- DS/EN 61249-8-7:1998 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
- DS/EN 61249-8-8:1998 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
KR-KS, Conductive film
- KS C IEC 62951-1-2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
United States Navy, Conductive film
Group Standards of the People's Republic of China, Conductive film
Lithuanian Standards Office , Conductive film
- LST EN 61249-8-7-2001 Materials for interconnection structures. Part 8: Sectional specification set for non-conductive films and coatings. Section 7: Marking legend inks (IEC 61249-8-7:1996)
- LST EN 61249-8-8-2001 Materials for interconnection structures. Part 8: Sectional specification set for non-conductive films and coatings. Section 8: Temporary polymer coatings (IEC 61249-8-8:1997)
Defense Logistics Agency, Conductive film