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Lightweight and efficient conductive material

Lightweight and efficient conductive material, Total:133 items.

In the international standard classification, Lightweight and efficient conductive material involves: Transformers. Reactors, Equipment for entertainment, Insulating materials, Environmental protection, General methods of tests and analysis for food products, Milk and milk products, Meat, meat products and other animal produce, Electrical accessories, Printed circuits and boards, Adhesives, Paints and varnishes, Ceramics, Analytical chemistry, Pharmaceutics, Welding, brazing and soldering, Electronic component assemblies, Farming and forestry, Animal feeding stuffs, Semiconducting materials, Conducting materials, Piezoelectric and dielectric devices, Components and accessories for telecommunications equipment, Products of the chemical industry, Surface treatment and coating, Insulating fluids.

Group Standards of the People's Republic of China, Lightweight and efficient conductive material

T/CEC 228-2019 Guidelines for the detection of distribution transformer winding materials by pyroelectric effect method

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Lightweight and efficient conductive material

GB/T 34436-2023 Determination of formamide in toy materials by high performance liquid chromatography-mass spectrometry
GB/Z 28818-2012 Selection guide for polymeric materials for outdoor use under HV stress
GB/T 23243-2009 Determination of perfluorooctane sulfonates (PFOS) in the food packaging material.High performance liquid chromatography-tandem mass spectrometry
GB/T 1409-2006 Recommended methods for the determination of the permittivity and dielectric dissipation fator of electrical insulating materials at power,audio and radio frequencies including meter wavelengths
GB/T 1409-1988 Methods for the determination of the permittivity and dielectric dissipation factor of solid electrical insulating materials at power,audio and radio frequencies including metre wavelengths

PT-IPQ, Lightweight and efficient conductive material

NP 116-1962
NP 159-1963 Matériel pour installations électriques & basse tension. Tubes rigides em material plastiquo pour prctection des conducteurs

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Lightweight and efficient conductive material

GB/T 34144-2017 Guidance on material efficiency considerations in environmentally conscious design of electrical and electronic products
GB/T 34435-2017 Determination of migratable chromium(Ⅵ) in toy materials—High performance liquid chromatography-inductively coupled plasma mass spectrometry(HPLC-ICP-MS)

CZ-CSN, Lightweight and efficient conductive material

CSN 34 6319-1987 Testing of ceramic electrotechnic materials. Methods of the determination of medium specific heat, thermal conductivity and medium temperature conductivity

American Society for Testing and Materials (ASTM), Lightweight and efficient conductive material

ASTM D6343-99(2004) Test Methods for Thin Thermally Conductive Solid Materials for Electrical Insulation and Dielectric Applications
ASTM D6343-99 Test Methods for Thin Thermally Conductive Solid Materials for Electrical Insulation and Dielectric Applications
ASTM D6343-10 Test Methods for Thin Thermally Conductive Solid Materials for Electrical Insulation and Dielectric Applications

RU-GOST R, Lightweight and efficient conductive material

GOST 32797-2014 Food products, food raw materials. Method of determination of the chynolony content by high performance liquid chromatography with mass spectrometry detector
GOST 32834-2014 Food products, food raw materials. Method for determination of the anthelminthic by high performance liquid chromatography - mass spectrometry
GOST 32798-2014 Food products, food raw materials. Method for determination of the aminoglycosides content by high performance liquid chromatography with mass spectrometry detector
GOST 34395-2018 Paint Materials. Spark test method for continuity inspection of delectric coatings on conductive substrates
GOST 32881-2014 Food products, food raw materials. Method for determination of the non-steroidal anti-inflammatory drug residue content by high performance liquid chromatography - mass spectrometry
GOST 33482-2015 Food products, food raw materials, mixed feeds. Method for determination of anabolic steroids and stilbene derivatives by high performance liquid chromatography-mass spectrometry
GOST 33616-2015 Food products, food raw materials. Method for determination of residues of arsenic containing growth stimulators using high performance liquid chromatography-mass spectrometry with inductively coupled plasma

Standard Association of Australia （SAA）, Lightweight and efficient conductive material

AS/NZS 2053.4:1995 Conduits and fittings for electrical installations - Flexible plain conduits and fittings of insulating material
AS/NZS 2053.2:2001 Conduits and fittings for electrical installations - Rigid plain conduits and fittings of insulating material
AS/NZS 2053.3:1995 Conduits and fittings for electrical installations - Rigid plain conduits and fittings of fibre-reinforced concrete material

British Standards Institution (BSI), Lightweight and efficient conductive material

BS IEC 62899-202-6:2020 Printed electronics. Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
BS ISO 27447:2009 Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for antibacterial activity of semiconducting photocatalytic materials
BS EN 61190-1-2:2007 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 61190-1-2:2014 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
22/30425870 DC BS ISO 24687. Fine ceramics (advanced ceramics, advanced technical ceramics). Measurement of Seebeck coefficient and electrical conductivity of bulk-type thermoelectric materials at room and high temperatures
PD IEC/TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
BS ISO 24687:2023 Fine ceramics (advanced ceramics, advanced technical ceramics). Measurement of Seebeck coefficient and electrical conductivity of bulk-type thermoelectric materials at room and high temperatures
BS EN 61338-1-3:2000 Waveguide type dielectric resonators.. General information and test conditions. Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency
19/30376495 DC BS EN 17374. Animal feeding stuffs: Methods of sampling and analysis. Determination of inorganic arsenic in animal feed by anion-exchange HPLC-ICPMS

Defense Logistics Agency, Lightweight and efficient conductive material

DLA DSCC-DWG-04036 REV B-2009 WIRE, ELECTRICAL, COMPOSITE, POLYTETRAFLUOROETHYLENE/POLYIMIDE INSULATED, LIGHT WEIGHT, NICKEL COATED, HIGH STRENGTH OR ULTRA HIGH STRENGTH COPPER ALLOY, 260 DEGREE C, 600 VOLT
DLA DSCC-DWG-04035 REV A-2009 WIRE, ELECTRICAL, COMPOSITE, POLYTETRAFLUOROETHYLENE/POLYIMIDE INSULATED, LIGHT WEIGHT, SILVER COATED, HIGH STRENGTH OR ULTRA HIGH STRENGTH COPPER ALLOY, 200 DEGREE C, 600 VOLT
DLA DSCC-DWG-04035 REV B-2010 WIRE, ELECTRICAL, COMPOSITE, POLYTETRAFLUOROETHYLENE/POLYIMIDE INSULATED, LIGHT WEIGHT, SILVER COATED, HIGH STRENGTH OR ULTRA HIGH STRENGTH COPPER ALLOY, 200 DEGREE C, 600 VOLT
DLA DSCC-DWG-04036 REV C-2010 WIRE, ELECTRICAL, COMPOSITE, POLYTETRAFLUOROETHYLENE/POLYIMIDE INSULATED, LIGHT WEIGHT, NICKEL COATED, HIGH STRENGTH OR ULTRA HIGH STRENGTH COPPER ALLOY, 260 DEGREES C, 600 VOLT

International Electrotechnical Commission (IEC), Lightweight and efficient conductive material

IEC 62899-202-6:2020 Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
IEC 61190-1-2:2002 Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
IEC 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

German Institute for Standardization, Lightweight and efficient conductive material

DIN 49019-1:1972 Conduits for electrical installation; flexible plain and non inflammable conduits of insulating material for middle and light pressure load
DIN 49019-3:1975 Conduits and fittings for electrical installation; flexible corrugated and non inflammable conduits of insulating material for light pressure load and a heat resistance up to 105 C
DIN 49018-1:1972 Conduits and fittings for electrical installation; flexible corrugated and inflammable conduits of insulating material and couplers for middle and light pressure load
DIN EN 61190-1-2:2014-11 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014 / Note: DIN EN 61190-1-2 (2007-11) remains valid al...
DIN EN 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007
DIN 50456-3:1999 Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 3: Determination of cationic impurities
DIN EN 61190-1-1:2003-01 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
DIN 50450-1:1987-08 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by using a diphosphorus pentoxide cell
DIN 50450-1:1987 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by using a diphosphorus pentoxide cell
DIN 50456-2:1995 Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 2: Determination of ionic impurities using pressure cooker test
DIN 50451-3:2014 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Determination of 31 elements in high-purity nitric acid by ICP-MS
DIN 50450-2:1991-03 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a galvanic cell
DIN 50450-2:1991 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a galvanic cell
DIN EN 61338-1-4:2006-06 Waveguide type dielectric resonators - Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency (IEC 61338-1-4:2005); German version EN 61338...
DIN EN 61338-1-4 Berichtigung 1:2007-02 Waveguide type dielectric resonators - Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency (IEC 61338-1-4:2005); German version EN 61338...
DIN EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
DIN EN ISO 11127-6:2012 Preparation of steel substrates before application of paints and related products - Test methods for non-metallic blast-cleaning abrasives - Part 6: Determination of water-soluble contaminants by conductivity measurement (ISO 11127-6:2011); German version
DIN EN 61190-1-1:2003 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
DIN EN 61338-1-3:2000-10 Waveguide type dielectric resonators - Part 1-3: General information and test conditions; Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency (IEC 61338-1-3:1999); German version EN 61338-1-3:2000

AT-ON, Lightweight and efficient conductive material

ONORM E 6557-1996 Electrical installation material - Fittings for insulating conduits, halogenfree, for light,medium or heavy mechanical stress, non flamepropagating
ONORM E 6548-1996 Electrical installation material - Pliable corrugated insulating conduits, halogenfree, for light, medium or heavy mechanical stress, non flamepropagating

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Lightweight and efficient conductive material

IPC TM-650 2.5.17.2-1998 Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method

国家市场监督管理总局、中国国家标准化管理委员会, Lightweight and efficient conductive material

GB/T 38420-2019 Determination of bisphenol A migration in polycarbonate and polysulfone materials in toys—High performance liquid chromatography-tandem mass spectrometry

Hebei Provincial Standard of the People's Republic of China, Lightweight and efficient conductive material

DB13/T 5127.11-2019 Determination of Toxic and Hazardous Substances in Extracts of Implantable Medical Devices with High-performance Liquid Chromatography for Glutaraldehyde Migration
DB13/T 5127.12-2019 Determination of Toxic and Hazardous Substances in Extracts of Implantable Medical Devices - High Performance Liquid Chromatography for Isocyanate Migration
DB13/T 5127.8-2019 Determination of Toxic and Hazardous Substances in Extracts of Implantable Medical Device Polymer Materials by High Performance Liquid Chromatography for Migration of Terephthalic Acid
DB13/T 5127.15-2019 Determination of Toxic and Hazardous Substances in Extracts of Implantable Medical Devices’ Polymer Materials Lead, Arsenic, Cadmium, Chromium, Copper, Antimony, Barium, Aluminum, Zinc, Tin Migration Inductively Coupled Plasma Mass Spectrometry

国家质量监督检验检疫总局, Lightweight and efficient conductive material

SN/T 4773-2017 Determination of migration of N-nitrosamines and N-nitroso compounds in toy materials by high performance liquid chromatography-tandem mass spectrometry

GOSTR, Lightweight and efficient conductive material

GOST R IEC 61190-1-1-2020 Materials for electronic modules. Part 1-1. Requirements for soldering fluxes for high-quality interconnections in electronics assembly
GOST 34596-2019 Food products, feed, food raw materials. Determination of the mass fraction of methylmercury compounds and inorganic mercury compounds by high performance liquid chromatography-mass spectrometry with inductively coupled plasma

CENELEC - European Committee for Electrotechnical Standardization, Lightweight and efficient conductive material

EN 61190-1-2:2002 Attachment Materials for Electronic Assembly Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronic Assembly
EN 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

ES-UNE, Lightweight and efficient conductive material

UNE-EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
UNE-EN 61190-1-1:2002 Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
UNE-EN 61338-1-3:2000 Waveguide type dielectric resonators -- Part 1-3: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency (Endorsed by AENOR in August of 2000.)
UNE-EN 61338-1-4:2006 Waveguide type dielectric resonators -- Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency (Endorsed by AENOR in April of 2006.)

Association Francaise de Normalisation, Lightweight and efficient conductive material

NF EN 61190-1-2:2014 Matériaux de fixation pour les assemblages électroniques - Partie 1-2 : exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques
NF C90-700-1-2:2002 Attachment materials for electronic assembly - Part 1-2 : requirements for solder pastes for high-quality interconnections in electronics assembly.
NF C90-700-1-1*NF EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1 : Requirements for soldering fluxes for high-quality interconnections in electronics assembly
NF EN 61190-1-1:2002 Matériaux de fixation pour les assemblages électroniques - Partie 1-1 : exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques
NF C90-700-1-2:2008 Attachment materials for electronic assembly - Part 1-2 : requirements for soldering paste for high-quality interconnects in electronics assembly.
NF C90-700-1-2*NF EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
NF EN 15591:2016 Essais sur matériaux céramiques et basiques - Détermination directe des fractions massiques d'impuretés dans les poudres et les granulés de carbure des silicium par spectroscopie d'émission optique à plasma induit par haute fréquence (ICP OES...
NF EN 61338-1-3:2000 Résonateurs diélectriques à modes guidés - Partie 1-3 : informations générales et conditions d'essais - Méthode de mesure de la permittivité relative complexe des matériaux diélectriques pour les résonateurs diélectriques fonctionnant aux ...
NF EN 61249-2-2:2005 Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-2 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées de papier cellulose phénolique, de haute qualité électrique, plaqué...
NF C96-627-1-3*NF EN 61338-1-3:2000 Waveguide type dielectric resonators - Part 1-3 : general information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency.
NF C96-627-1-4*NF EN 61338-1-4:2006 Waveguide type dielectric resonators - Part 1-4 : general information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimeter-wave frequency
NF EN 61338-1-4:2006 Résonateurs diélectriques à modes guidés - Partie 1-4 : informations générales et conditions d'essai - Méthode de mesure de permittivité relative complexe des matériaux des résonateurs diélectriques fonctionnant à des fréquences millimét...

Korean Agency for Technology and Standards (KATS), Lightweight and efficient conductive material

KS C IEC 61190-1-1-2006(2021) Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly
KS C IEC 61190-1-2-2006(2016) Attachment materials for electronic assembly－Part 1－2：Requirements for solder pastes for high-quality interconnections in electronics assembly
KS C IEC 61190-1-1-2006(2016) Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly
KS C IEC 61190-1-2:2021 Attachment materials for electronic assembly —Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
KS L ISO 27448:2011 Fine ceramics(advanced ceramics, advanced technical ceramics)-Test method for self-cleaning performance of semiconducting photocatalytic materials-Measurement of water contact angle
KS C IEC 61190-1-1:2006 Attachment materials for electronic assembly－Part 1－1：Requirements for soldering fluxes for high-quality interconnections in electronics assembly
KS C IEC 61190-1-2:2006 Attachment materials for electronic assembly－Part 1－2：Requirements for solder pastes for high-quality interconnections in electronics assembly
KS C IEC 61338-1-4:2018 Waveguide type dielectric resonators ─ Part 1-4: General information and test conditions ─ Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave fre
KS C IEC 61338-1-3:2018 Waveguide type dielectric resonators ― Part 1-3: General information and test conditions ― Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency
KS C IEC 61338-1-4-2023 Waveguide type dielectric resonators Part 1-4: General information and test conditions Method for measurement of complex relative permittivity of dielectric resonator materials at millimeter-wave frequencies
KS C IEC 61338-1-3-2023 Waveguide type dielectric resonators Part 1-3: General information and test conditions Method for measurement of complex relative permittivity of dielectric resonator materials at microwave frequencies

FI-SFS, Lightweight and efficient conductive material

Danish Standards Foundation, Lightweight and efficient conductive material

DS/EN 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
DS/EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
DS/EN 61338-1-3:2000 Waveguide type dielectric resonators - Part 1-3: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency
DS/EN 61338-1-4:2006 Waveguide type dielectric resonators - Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency

European Committee for Electrotechnical Standardization（CENELEC）, Lightweight and efficient conductive material

EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002 Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
EN 61338-1-3:2000 Waveguide Type Dielectric Resonators - Part 1-3: General Information and Test Conditions - Measurement Method of Complex Relative Permittivity for Dielectric Resonator Materials at Microwave Frequency test conditions - Measurement Method of Complex Relati

KR-KS, Lightweight and efficient conductive material

KS C IEC 61190-1-2-2021 Attachment materials for electronic assembly —Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
KS C IEC TR 61189-3-914-2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightne
KS C IEC 61338-1-3-2018 Waveguide type dielectric resonators ― Part 1-3: General information and test conditions ― Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency
KS C IEC 61338-1-4-2018 Waveguide type dielectric resonators ─ Part 1-4: General information and test conditions ─ Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave fre
KS C IEC 61338-1-4-2018(2023) Waveguide type dielectric resonators ─ Part 1-4: General information and test conditions ─ Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave fre
KS C IEC 61338-1-3-2018(2023) Waveguide type dielectric resonators ― Part 1-3: General information and test conditions ― Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency

International Organization for Standardization (ISO), Lightweight and efficient conductive material

ISO 27448:2009 Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for self-cleaning performance of semiconducting photocatalytic materials - Measurement of water contact angle
ISO 24687:2023 Fine ceramics (advanced ceramics, advanced technical ceramics) — Measurement of Seebeck coefficient and electrical conductivity of bulk-type thermoelectric materials at room and high temperatures

未注明发布机构, Lightweight and efficient conductive material

DIN EN ISO 22459:2022 High-performance ceramics – fiber reinforcements of ceramic composite materials – determination of the distribution of tensile strength and tensile elongation until failure of filaments within a multifilament cable at room temperature
BS EN 279:1991(1999) Specification for Homogenous rubber materials for dynamic seals in domestic appliances using combustible gases up to 200 mbar
BS EN 61338-1-4:2006(2007) Waveguide type dielectric resonators — Part 1 - 4 : General information and test conditions — Measurement method of complex relative permittivity for dielectric resonator materials at millimetre - wave frequency

AENOR, Lightweight and efficient conductive material

UNE-EN 60249-2-1/A2:1996 BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION No1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
UNE-EN 60249-2-1:1996 BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
UNE-EN 60249-2-1/A3:1996 BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION No 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.

工业和信息化部, Lightweight and efficient conductive material

YS/T 1164-2016 Determination of impurity content in high-purity quartz products for silicon materials by inductively coupled plasma optical emission spectrometry
YB/T 4590-2017 Determination of impurity content in high-purity graphite products for silicon materials by inductively coupled plasma optical emission spectrometry

Lithuanian Standards Office , Lightweight and efficient conductive material

LST EN 61190-1-1-2003 Attachment materials for electronic assembly. Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002)
LST EN 61190-1-2-2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007)
LST EN 61338-1-4-2006 Waveguide type dielectric resonators - Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency (IEC 61338-1-4:2005)
LST EN 61338-1-4-2006/AC-2007 Waveguide type dielectric resonators - Part 1-4: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at millimetre-wave frequency (IEC 61338-1-4:2005)

European Committee for Standardization (CEN), Lightweight and efficient conductive material

EN ISO 11127-6:2011 Preparation of steel substrates before application of paints and related products - Test methods for non-metallic blast-cleaning abrasives - Part 6: Determination of water-soluble contaminants by conductivity measurement