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zn semiconductor element

zn semiconductor element, Total:429 items.

In the international standard classification, zn semiconductor element involves: Semiconductor devices, Fuels, Insulating fluids, Semiconducting materials, Electronic components in general, Pulps, Analytical chemistry, Integrated circuits. Microelectronics, Shipbuilding and marine structures in general, Vocabularies, Optoelectronics. Laser equipment, Electrical accessories, Characteristics and design of machines, apparatus, equipment, Aerospace electric equipment and systems, Electronic display devices, Resistors, Mechanical structures for electronic equipment, Company organization and management, Geology. Meteorology. Hydrology, Fibre optic communications, Lubricants, industrial oils and related products, Electrical wires and cables, Ceramics, Materials for aerospace construction.

International Electrotechnical Commission (IEC), zn semiconductor element

IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
IEC 62951-9:2022 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
IEC 62435-7:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
IEC 60747-5-3:2009 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
IEC 107/126/PAS:2010 IEC/PAS 62686-1, Ed. 1:General requirements for high reliability components -Part 1: Integrated circuits and discrete semiconductors
IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
IEC 60747-5-2:2009 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
IEC 62149-8:2014 Fibre optic active components and devices - Performance standard - Part 8: Seeded reflective semiconductor optical amplifier devices
IEC TR 62240-2:2018 Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime
IEC 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., zn semiconductor element

IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
IEEE PC62.35/D1-2018 Draft Standard for Test Methods for Silicon Avalanche Semiconductor Surge Protective Device Components
IEEE C62.35-2010 Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components

PL-PKN, zn semiconductor element

PN T01503 ArkusZ01-1972 Semiconduc?or devices Dimension Device A1
PN T01503 ArkusZ50-1973 Semiconductor devicesDimensions Case C9
PN-EN IEC 62435-3-2020-11 E Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (IEC 62435-3:2020)
PN-EN IEC 62435-7-2021-08 E Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
PN-EN IEC 62435-8-2021-04 E Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)

Association Francaise de Normalisation, zn semiconductor element

NF X34-123:2011 Solid biofuels - Determination of minor elements - As, Cd, Co, Cr, Cu, Hg, Mn, Mo, Ni, Pb, Sb, V and Zn.
NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
NF C96-009:1989 Electronic Components Semiconductor devices Mechanical and climatic test methods
NF X34-225*NF EN 15411:2011 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn).
NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
NF EN 15411:2011 Combustibles solides de récupération - Méthodes de détermination de la teneur en éléments à l'état de traces (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V et Zn)
NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
NF C86-503:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Phototransistors, photodarlington transistors and phototrasistor-arrays. Blank detail specification CECC 20 003.
NF C96-002:1984 ELECTRONIC COMPONENTS. SEMICONDUCTOR DEVICES. DISCRETE DEVICES AND INTEGRATED CIRCUITS. PART 2 : RECTIFIER DIODES.
NF C96-435-3*NF EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data
NF C96-435-1*NF EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
NF C96-435-4*NF EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4 : storage
NF EN IEC 62435-4:2018 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 4 : stockage
NF EN 62435-1:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 1 : généralités
NF EN IEC 62435-3:2020 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 3 : données
NF C83-282:1987 Harmonized system of quality assessment for electronic components. Surge suppression varistors. Sectional specification. Blank detail specification.
NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-006:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 6 : thyristors.
NF C96-005-5*NF EN 60747-5-5:2012 Semiconductor devices - Discrete devices - Part 5-5 : optoelectronic devices - Photocouplers
NF EN IEC 60749-39:2022 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39 : mesure de la diffusivité d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs
NF C86-411:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 100).
NF C96-435-2*NF EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
NF C96-435-9*NF EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9 : special cases
NF EN 62435-2:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 2 : mécanismes de détérioration
NF EN IEC 62435-9:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 9 : cas particuliers
NF EN IEC 62435-7:2021 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 7 : dispositifs microélectromécaniques
NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
NF C96-435-8*NF EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8 : passive electronic devices
NF EN IEC 62435-8:2020 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 8 : dispositifs électroniques passifs
NF C86-412:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 101).
NF C86-433:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS (APPROVAL PROCEDURES). SECTIONAL SPECIFICATION. SPECIFICATION CECC 64 200.
NF EN ISO 11885:2009 Qualité de l'eau - Dosage d'éléments choisis par spectroscopie d'émission optique avec plasma induit par haute fréquence (ICP-OES)
NF C96-010:1989 Electronic Components Semiconductor devices Part 10:Generic specification for discrete devices and integrated circuits
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
NF C96-435-6*NF EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6 : packaged or finished devices
NF EN IEC 62435-6:2018 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs Partie 6 : dispositifs encapsulés ou finis
NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
NF C86-413:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. SECTIONAL SPECIFICATION. (SPECIFICATION CECC 63 200).
NF C86-506:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components pin-photodiodes for fibre optic applications. Blank detail specification.
NF EN 60269-4/A1:2012 Fusibles basse tension - Partie 4 : exigences supplémentaires concernant les éléments de remplacement utilisés pour la protection des dispositifs à semiconducteurs
NF EN 60269-4:2010 Fusibles basse tension - Partie 4 : exigences supplémentaires concernant les éléments de remplacement utilisés pour la protection des dispositifs à semiconducteurs
NF EN 60269-4/A2:2017 Fusibles basse tension - Partie 4 : exigences supplémentaires concernant les éléments de remplacement utilisés pour la protection des dispositifs à semiconducteurs
NF C86-434:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS (APPROVAL PROCEDURES). (SPECIFICATION CECC 64 201).
NF C93-884-8*NF EN 62149-8:2014 Fibre optic active components and devices - Performance standard - Part 8 : seeded reflective semiconductor optical amplifier devices
NF C86-414:1987 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID INTEGRATED CIRCUITS. CAPABILITY APPROVAL. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 63 201).
NF C86-431:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FIXED FILM RESISTORS NETWORKS. SECTIONAL SPECIFICATION. SPECIFICATION CECC 64 100.
NF C86-430:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FIXED FILM RESISTORS NETWORKS. GENERIC SPECIFICATION. SPECIFICATION CECC 64 000.
NF C93-884-9*NF EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9 : seeded reflective semiconductor optical amplifier transceivers
NF EN 15765:2010 Produits alimentaires - Dosage des éléments traces - Dosage de l'étain par spectrométrie de masse à plasma induit par haute fréquence (ICP-MS) après digestion sous pression
NF C86-812:1981 Harmonised system of quality assessment for electronic components. Blank detail specification : general purpose signal and/or switching semiconductor diodes.
NF C86-432:1988 SEMICONDUCTOR DEVICES. HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM RESISTORS NETWORKS. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 64 101).
NF EN 62149-9:2014 Composants et dispositifs actifs à fibres optiques - Normes de performances - Partie 9 : émetteurs-récepteurs amplificateurs optiques à semiconducteur réfléchissants répartis
NF EN 60749-35:2006 Dispositifs à semiconducteurs - Méthodes d'essai climatiques et mécaniques - Partie 35 : microscopie acoustique pour composants électroniques à boîtier plastique
NF EN 15111:2007 Produits alimentaires - Dosage des éléments traces - Dosage de l'iode par spectrométrie d'émission avec plasma induit par haute fréquence et spectromètre de masse (ICP-SM)
NF C96-022-35*NF EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35 : acoustic microscopy for plastic encapsulated electronic components
NF C86-505:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Photodiodes. Photodiodes-arrays. Blank detail specification CECC 20 005.
NF EN 16171:2016 Boues, bio-déchets traités et sols - Détermination des éléments en traces par spectrométrie de masse avec plasma induit par haute fréquence (ICP-MS)

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, zn semiconductor element

GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
GB/T 15652-1995 Generic specification for gas sensors of metal-oxide semiconductor
GB/T 15653-1995 Measuring methods for gas sensors of metal-oxide semiconductor
GB/T 43012-2023 Determination of sulfur element and sulfate half-ester content in pulp cellulose nanocrystals
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General
GB/T 42706.2-2023 Long-term storage of electronic components and semiconductor devices Part 2: Degradation mechanisms
GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
GB 7085-1986 Detail specification for electronic component--Semiconductor integrated circuit--CJ0450 Dual peripheral positive AND drivers
GB 9426-1988 Detail Specification for Electronic Components Semiconductor Integrated Circuit CC4518 CMOS Double Decade Synchronous Counter (available for certification)

British Standards Institution (BSI), zn semiconductor element

BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS DD CEN/TS 15411:2006 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)
BS IEC 62951-9:2022 Semiconductor devices. Flexible and stretchable semiconductor devices - Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
BS IEC 60747-10:1991 Semiconductor devices. Generic specification for discrete devices and integrated circuits
BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
DD CEN/TS 15411:2006 Solid recovered fuels — Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)
BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
BS DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
BS EN 15411:2011 Solid recovered fuels. Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)
BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
BS EN IEC 60747-17:2020 Semiconductor devices. Magnetic and capacitive coupler for basic and reinforced insulation
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 5: Die and wafer devices
BS CECC 20000:1983 Harmonized system of quality assessment for electronic components: generic specification: semiconductor optoelectronic and liquid crystal devices
BS CECC 50000:1987 Harmonized system of quality assessment for electronic components - Generic specification: discrete semiconductor devices
BS EN IEC 60749-39:2022 Tracked Changes. Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
BS EN 120000:1996 Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices
BS QC 750100:1986+A2:1996 Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
20/30423207 DC BS EN IEC 62951-9. Semiconductor devices. Flexible and stretchable semiconductor devices. Part 9. Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
BS EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 2: Deterioration mechanisms
BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
20/30425840 DC BS EN IEC 60749-39. Semiconductor devices. Mechanical and climatic test methods. Part 39. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
18/30367158 DC BS EN 62435-3. Electronic components. Long-term storage of electronic semiconductor devices. Part 3. Data
PD IEC TR 62240-2:2018 Process management for avionics. Electronic components capability in operation. Semiconductor microcircuit lifetime
BS CECC 00013:1985 Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor dice
BS QC 790130:1992 Specification for harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Blank detail specification - HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
BS CECC 50000 Supplement No. 1:1983 Harmonized system of quality assessment for electronic components - Generic specification: discrete semiconductor devices - CECC assessed process average
20/30424473 DC BS EN 62435-9. Electronic components. Long-term storage of electronic semiconductor devices. Part 9. Special Cases
BS EN 62149-8:2014 Fibre optic active components and devices. Performance standards. Seeded reflective semiconductor optical amplifier devices
BS EN 62149-9:2014 Fibre optic active components and devices. Performance standards. Seeded reflective semiconductor optical amplifier transceivers
BS EN 153000:1998 Harmonized system of quality assessment for electronic components - Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
BS QC 790202:1991 Specification for harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Blank detail specification - Monolithic integrated operational amplifiers
DD IEC/TS 62564-1:2011 Process management for avionics. Aerospace qualified electronic components (AQEC) - Integrated circuits and discrete semiconductors
BS EN 117000:1992 Harmonized system of quality assessment for electronic components - Generic specification - Solid state all-or-nothing relays - Generic data and methods of test
BS QC 790110:1992 Specification for harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Blank detail specification - Microprocessor integrated circuits

Korean Agency for Technology and Standards (KATS), zn semiconductor element

KS C 7013-1971(2000) TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
KS C 7013-1985 TYPE DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
KS C 6563-1996 Principal measuring methods for semiconductor pressure sensor elements
KS C 6562-1996 Essential ratings and characteristics for semiconductor pressure sensor elements
KS C 6563-1996(2016) Principal measuring methods for semiconductor pressure sensor elements
KS C 6563-1996(2021) Principal measuring methods for semiconductor pressure sensor elements
KS V 8209-1999(2004) Electrical installations in ships Part 304：Equipment－Semiconductor convertors
KS C 6562-1996(2021) Essential ratings and characteristics for semiconductor pressure sensor elements
KS C 6562-1996(2016) Essential ratings and characteristics for semiconductor pressure sensor elements
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

German Institute for Standardization, zn semiconductor element

DIN 50451-2:2003-04 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 2: Calcium (Ca), cobalt (Co), chromium (Cr), copper (Cu), Iron (Fe), nickel (Ni) and zinc (Zn) in hydrofluoric acid with plasma-induced emission spect...
DIN 50451-7:2018-04 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 7: Determination of 31 elements in high-purity hydrochloric acid by ICP-MS
DIN 50451-3:2014-11 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Determination of 31 elements in high-purity nitric acid by ICP-MS
DIN 50451-6:2014-11 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 6: Determination of 36 elements in a high-purity ammonium fluoride solution (NH<(Index)4>F) and in etching mixtures of high-purity ammonium ...
DIN 50451-3:2003 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Aluminium (Al), cobalt (Co), copper (Cu), sodium (Na), nickel (Ni) and zinc (Zn) in nitric acid by ICP-MS
DIN 50451-4:2007 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)
DIN 50451-4:2007-02 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)
DIN 50451-3:2014 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Determination of 31 elements in high-purity nitric acid by ICP-MS
DIN EN 15411:2011-11 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn); German version EN 15411:2011
DIN 4000-20:1988 Tabular layouts of article characteristics for opto-electronic semiconductor devices
DIN 50449-1:1997 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
DIN 50451-6:2014 Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 6: Determination of 36 elements in a high-purity ammonium fluoride solution (NH4F) and in etching mixtures of high-purity ammonium fluoride solution
DIN EN IEC 62435-9:2022-09 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases (IEC 62435-9:2021); German version EN IEC 62435-9:2021 / Note: Date of issue 2022-08-05
DIN EN 15411:2011 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn); German version EN 15411:2011
DIN 50451-1:2003 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 1: Silver (Ag), gold (Au), calcium (Ca), copper (Cu), iron (Fe), potassium (K) and sodium (Na) in nitric acid by AAS
DIN EN IEC 60749-39:2021-07 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020 / Not...
DIN EN 60747-5-5:2011 Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2007); German version EN 60747-5-5:2011
DIN 51456:2013-10 Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
DIN 50451-5:2010 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 5: Guideline for the selection of materials and testing of their suitability for apparatus for sampling and sample preparation for the determination of t
DIN 51391-3:2004 Testing of lubricants - Determination of the content of additive elements - Part 3: Direct determination of Ca, Mg, Zn and Ba by optical emission spectral analysis with inductively coupled plasma (ICP OES)
DIN 51456:2013 Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
DIN EN 60747-5-5:2015 Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2007 + A1:2013); German version EN 60747-5-5:2011 + A1:2015
DIN 50451-1:2003-04 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 1: Silver (Ag), gold (Au), calcium (Ca), copper (Cu), iron (Fe), potassium (K) and sodium (Na) in nitric acid by AAS
DIN EN IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020
DIN EN IEC 60749-39:2023-10 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022 / Note: DIN...
DIN EN 62435-6:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (IEC 47/2390/CD:2017)
DIN EN 60749-35:2007-03 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
DIN 50451-2:2003 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 2: Calcium (Ca), cobalt (Co), chromium (Cr), copper (Cu), Iron (Fe), nickel (Ni) and zinc (Zn) in hydrofluoric acid with plasma-induced emission spectros

American National Standards Institute （ANSI), zn semiconductor element

ANSI/EIA 321-C:1987 Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices
ANSI/ASTM E1161:1996 Test Method for Radiologic Examination of Semiconductors and Electronic Components
ANSI/IEEE C62.35:2010 Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, zn semiconductor element

JEDEC EIA-323-1966 Air-Convection-Cooled Life Test Environment for Lead-Mounted Semiconductor Devices
JEDEC EIA-321-C-1987 Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices
JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

Institute of Electrical and Electronics Engineers (IEEE), zn semiconductor element

AIEE No 59-1962 (Supersedes AIEE No. 59, 1956 and AIEE Standard for Semiconductor Rectifier Components
IEEE Std C62.35-2010/COR 1-2018 IEEE Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components--Corrigendum 1

Professional Standard - Machinery, zn semiconductor element

JB/T 11623-2013 Planar thick film semiconductor gas sensor

Taiwan Provincial Standard of the People's Republic of China, zn semiconductor element

CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices

Danish Standards Foundation, zn semiconductor element

DS/EN 15297:2011 Solid biofuels - Determination of minor elements - As, Cd, Co, Cr, Cu, Hg, Mn, Mo, Ni, Pb, Sb, V and Zn
DS/EN 15411:2011 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases
DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DS/ES 59001:1998 Approval scheme for automotive oriented applications within the electronic components industry - Semiconductor stress test qualification
DS/EN 60749-35:2007 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Lithuanian Standards Office , zn semiconductor element

LST EN 15297-2011 Solid biofuels - Determination of minor elements - As, Cd, Co, Cr, Cu, Hg, Mn, Mo, Ni, Pb, Sb, V and Zn
LST EN 15411-2011 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)
LST EN 60749-39-2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006)
LST EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)

FI-SFS, zn semiconductor element

SFS 5327-1987

Professional Standard - Electron, zn semiconductor element

SJ 20025-1992 Generic specification for gas sensors of metal-oxide semiconductor
SJ 20026-1992 Measuring methods for gas sensors of metal-oxide semiconductor
SJ 20079-1992 Test mehods for gas sensors of metal-oxide semiconductor
SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
SJ/T 10947-1996 Detailed specifications for electronic components - FG341052 and FG343053 semiconductor green light emitting diodes
SJ/T 10831-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7193CP chrominance processing circuits
SJ/T 10072-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CE8602 500MHz÷divider
SJ/T 10825-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2013 HTL Hex inverters
SJ/T 10821-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2007 HTL Quad inverters
SJ/T 10037-1991 Detail specification for electronic components semiconductor integrated circuit Cμ402 4-bit microprocesor
SJ/T 10074-1991 Detail specification for electronic components.Semiconductor integrated circuit Quad line driver type CJ 75188
SJ/T 10076-1991 Detail specification for electronic components.Semiconductor integrated circuit Voltage comparator type CJ 710
SJ/T 10948-1996 Detailed specifications for electronic components - FG313052, FG314053, FG313054 and FG314055 semiconductor red light emitting diodes
SJ/T 10270-1991 Detail specification for electronic components.Semiconductor integrated circuit-CF3080 type transconductance operational amplifier
SJ/T 11008-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD11235CP line and field sweep circuits
SJ/T 10832-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7611CP PIF amplifying circuits
SJ/T 10041-1991 Detail specification for electronic component.Semiconductor integrated circuit-CC4014 CMOS 8-bit shift register
SJ/T 10071-1991 Detail Specification for electronic component.Semiconductor integrated circuit.Type CH2022 4-bit shift register
SJ/T 10075-1991 Detail specification for electronic components.Semiconductor integrated circuit CJ 75361 dual TTL-MOS driver
SJ/T 10991-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW574CS voltage regulators for electronic tuners
SJ/T 10987-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD5435CP magnetic field sweep circuits
SJ/T 10042-1991 Detail specification for electronic components.Semiconductor integrated circuit.CT54LS00/CT74LS00 quadruple 2-input positive-NAND gate
SJ/T 10045-1991 Detail Specification for electronic components.Semiconductor integrated circuit CT54LS138/CT74LS138 3-to-8 line decoder
SJ/T 10257-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD3220CP dual preamplifier with ALC
SJ/T 10259-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 2822 CP dual audio power amplifiers
SJ/T 10260-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 7232 CS dual audio power amplifiers
SJ/T 10264-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 3161 CS dual preamplifiers
SJ/T 10823-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2009 HTL triple 3-input positive-NAND gate
SJ/T 10077-1991 Detail specification for electronic components.Semiconductor integrated circuit MOS-LED displaydriver type CJ 75491
SJ/T 10079-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54182/CT74182 look-ahead carry generator
SJ/T 10084-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54H20/CT74H20 dual 4-input positive-NAND gate
SJ/T 10824-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2010 HTL Quad 2-input positive-NAND gate
SJ/T 10822-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2008 HTL dual 4-input positive-NAND gate
SJ/T 10820-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2001 HTL dual 4-input positive-NAND gate
SJ/T 10261-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 7343 GS phaselocked loop FM stereo decoder
SJ/T 10829-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0453 HTL dual peripheral positive OR drivers
SJ/T 10046-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54LS151/CT74LS151 1-of-8 data selector
SJ/T 10068-1991 Detail specification for electronic component.Semiconductor integrated circuit.Type CH2005 dual J-K negative-edge triggered flip-flop
SJ/T 10086-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54H183/CT74H183 dual carry-save full adders
SJ/T 10988-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD5132CP PIF amplifying circuits
SJ/T 11087-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7698CP horizontal and vertical sweep and chrominance processing circuits
SJ/T 11088-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7680CP SIF amplifying circuits
SJ/T 10827-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0451 HTL dual peripheral positive AND drivers
SJ/T 10250-1991 Detail specification for electronic components--Semiconductor integrated circuits,Type CB565 analogue phase-locked loop
SJ/T 11009-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD11215ACP PIF amplifying circuits
SJ/T 10826-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0450 HTL dual peripheral positive AND drivers
SJ/T 10254-1991 Detail specification for electronic components--Semiconductor integrated circuits,Type CB301 CMOS analogue switch
SJ/T 10989-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD5622CP PAL system chrominance signal processing circuits
SJ/T 11010-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD1124ACP SIF amplifying circuits
SJ/T 10253-1991 Detail specification for electronic components--Semiconductor integrated circuits,Type CC4046 CMOS digital phase-locked loop
SJ/T 10040-1991 Detail specification for electronic component.Semiconductor integrated circuit-CC4019 CMOS Quad 2-line to 1-line data selector
SJ/T 10258-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD1405CP 5 LED level display driver
SJ/T 10265-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 7668 GP dual preamplifiers with ALC
SJ/T 10069-1991 Detail specification for electronic component.Semiconductor integrated circuit.Type CH2019 4-line to 10-line decoder (with BCD-in)
SJ/T 10081-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54153/CT74153 dual 4-line to 1-line data selectors
SJ/T 10877-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CF741 operational amplifiers (Applicable for certification)
SJ/T 10990-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD5612CP Picture chrominance signal processing circuits
SJ/T 10252-1991 Detail specification for electronic components--Semiconductor integrated circuits,Type CB7660 CMOS supply voltape converter
SJ/T 10784-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7609CP horizontal and vertical sweep circuits (Applicable for certification)
SJ/T 10830-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0454 HTL dual peripheral positive NOR drivers
SJ/T 10828-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0452 HTL dual peripheral positive NAND drivers
SJ/T 10810-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1004 TTL Hex inverters (Applicable for certification)
SJ/T 10039-1991 Detail specification for electronic component.Semiconductor integrated circuit-CC4028 CMOS 4-line to 10-line decoder (with BCD-in)
SJ/T 10073-1991 Detail specification for electronic component.Semiconductor integrated circuits-CW7915 three terminal negative voltage regulator
SJ/T 10080-1991 Detail specification for electronic components.Semiconductor integrated circuit CT5442/CT7442 4-line-to-10-line decoder (BCD-to-decimal)
SJ/T 10934-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW7805 triple-terminal positive voltage regulators (Applicable for certification)
SJ/T 10815-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1030 TTL8 input positive-NAND gate (Applicable for certification)
SJ/T 10783-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CD7176CP SIF amplifying circuits (Applicable for certification)
SJ/T 10251-1991 Detail specification for electronic components--Semiconductor integrated circuits,Type CB1495 four quadrants analogue multiplier
SJ/T 10047-1991 Detail Specification for electronic components.Semiconductor integrated circuit CT54LS195/CT74LS195 4-bit parallel-access shift register
SJ/T 10883-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CDA7520 10-bit D/A converters (Applicable for certification)
SJ/T 10266-1991 Detail specification for electronic components.Semiconductor integrated circuit-CF714 type precision operational amplifier
SJ/T 10267-1991 Detail specification for electronic components.Semiconductor integrated circuit-CF715 type high-speed operational amplifier
SJ/T 10262-1991 Detail specification for electronic components--Semiconductor integrated circuits--Type CD7640GP FM/AM IF amplifier
SJ/T 10842-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10104 ECL Quad 2-input AND gate (Applicable for certification)
SJ/T 10878-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW723 multi-terminal adjustable voltage regulators (Applicable for certification)
SJ/T 10986-1996 Detailed specifications for electronic components - Semiconductor TV integrated circuits - CD5250CP SIF amplifiers
SJ/T 10808-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1000 TTL Quad 2-input positive-NAND gate (Applicable for certification)
SJ/T 10809-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1002 TTL Quad 2-input positive-NAND gate (Applicable for certification)
SJ/T 10811-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1008 TTL Quad 2-input positive-NAND gate (Applicable for certification)
SJ/T 10813-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1020 TTL dual 4-input positive-NAND gate (Applicable for certification)
SJ/T 10814-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1027 TTL Triple 3-input positive-NAND gate (Applicable for certification)
SJ/T 10038-1991 Detail specification for electronic component.Semicondutor integrated circuit-CC4008 CMOS 4-bit binary full adder with look ahead carry
SJ/T 10044-1991 Detail specification for electronic components.Semiconductor integrated circuit.CT54LS283/CT74LS283 4-bit binary full adder
SJ/T 10048-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54LS169/CT74LS169 4-bit binary up/down synchronous counter
SJ/T 10255-1991 Detail specification for electronic components.Semiconductor integrated circuit-CW1403 type precision energy-gap voltage reference
SJ/T 10263-1991 Detail specification for electronic component.Semiconductor integrated circuit-type CD 7666 GP dual 5 LED level display drivers
SJ/T 10268-1991 Detail specification for electronic components.Semiconductor integrated circuit-CF253 type low power operational amplifier
SJ/T 10078-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54107/CT74107dual J-K flip-flop with clear
SJ/T 10841-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10102 ECL Quad 4-input NOR gate (Applicable for certification)
SJ/T 10935-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CF747 general dual operational amplifiers (Applicable for certification)
SJ/T 10844-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10106 ECL Triple 4, 3, 3-input NOR gate (Applicable for certification)
SJ/T 10884-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10131 ECL dual D-type master-slave flip-flops (Applicable for certification)
SJ/T 10812-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1010 TTL Triple 3-input positive-NAND gate (Applicable for certification)
SJ/T 11003-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CB14433 31/2-bit A/D converters (Applicable for certification)
SJ/T 10845-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10109 ECL dual 4,5-input OR/NOR gate (Applicable for certification)
SJ/T 10932-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CC4013 CMOS dual D positive edge-triggered flip-flops (Applicable for certification)
SJ/T 10843-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10105 ECL Triple 2, 3, 2-input OR/NOR gate (Applicable for certification)
SJ/T 10840-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10101 ECL Quad 2-input OR/NOR gate (Applicable for certification)
SJ/T 10816-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1040 TTL dual 4-input positive-NAND buffer (Applicable for certification)
SJ/T 10070-1991 Detail specification for electronic component.Semiconductor integrated circuit.Type CH2021 4-bit up down synchronous binary counter(dual clock)
SJ/T 10083-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54161/CT74161 4-bit synchronous binary counter (direct clear)
SJ/T 10933-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CC4518 CMOS dual decimal system synchronous counters (Applicable for certification)
SJ/T 10846-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10110 ECL dual 3-input OR gate (3-output) (Applicable for certification)
SJ/T 10931-1996 Detailed specifications for electronic components - Semiconductor microcomputer integrated circuits - Cμ6800 8-bit microprocessors (Applicable for certification)
SJ/T 10269-1991 Detail specification for electronic components.Semiconductor integrated circuit-CF 155/CF255/CF355 type JFET input operational amplifier
SJ/T 10082-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54195/CT74195 4-bit parallel-access shift register
SJ/T 10085-1991 Detail specification for electronic components.Semiconductor integrated circuit CT54H74/CT74H74 dual D-type positive edge-triggred flip-flop with preset and clear
SJ/T 10847-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10111 ECL dual 3-input NOR gate (3-output) (Applicable for certification)

CZ-CSN, zn semiconductor element

CSN 35 8797 Cast.11 IEC 747-11 ZA2:1997
CSN 35 8797 Cast.11 IEC 747-11 Z1:1993
CSN 01 3308-1989 Marking system of conductors and terminals of elektrical elements and equipment and of circuit parts in elektrical diagrams

Aerospace Industries Association, zn semiconductor element

AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

AIA/NAS - Aerospace Industries Association of America Inc., zn semiconductor element

NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type
NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
NAS4121-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FORMED (Rev 1)
NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)
NAS4118-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ RETAINER CLIP TYPE (Rev 1)
NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
NAS4120-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ ENCAPSULATING TYPE@ TO-5 (Rev 1)
NAS4123-2012 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FOR DUAL INLINE PACKAGES (DIP) (Rev 1)

American Society for Testing and Materials (ASTM), zn semiconductor element

ASTM E1161-95 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
ASTM E1161-09 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
ASTM E1161-09(2014) Standard Practice for Radiologic Examination of Semiconductors and Electronic Components
ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
ASTM E1161-21 Standard Practice for Radiographic Examination of Semiconductors and Electronic Components
ASTM F615M-95(2008) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)
ASTM F615M-95 Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components [Metric]
ASTM F615M-95(2002) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components [Metric]
ASTM F615M-95(2013) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)

Aerospace Industries Association/ANSI Aerospace Standards, zn semiconductor element

AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
AIA/NAS NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
AIA/NAS NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA/NAS NAS4121-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED (Rev 1)
AIA/NAS NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)
AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
AIA/NAS NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999

Professional Standard - Building Materials, zn semiconductor element

JC/T 2133-2012 Determination of impurities in silica sol for polishing solution in semiconductor industry.Inductively coupled plasma atomic emission spectrometric method

RU-GOST R, zn semiconductor element

GOST 20332-1984 Thyristors. Terms, definitions and letter symbols

Military Standard of the People's Republic of China-General Armament Department, zn semiconductor element

GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
GJB/Z 56-1994 Guide to Selection of Electronic Components for Aerospace Use Semiconductor Integrated Circuits

European Committee for Standardization (CEN), zn semiconductor element

EN 15411:2011 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)

CEN - European Committee for Standardization, zn semiconductor element

PD CEN/TS 15411:2006 Solid recovered fuels - Methods for the determination of the content of trace elements (As@ Ba@ Be@ Cd@ Co@ Cr@ Cu@ Hg@ Mo@ Mn@ Ni@ Pb@ Sb@ Se@ Tl@ V and Zn)

AENOR, zn semiconductor element

UNE-EN 15411:2012 Solid recovered fuels - Methods for the determination of the content of trace elements (As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Tl, V and Zn)

PH-BPS, zn semiconductor element

PNS IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
PNS IEC 62435-3:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

Government Electronic & Information Technology Association, zn semiconductor element

GEIA-STD-0002-1-2005 Aerospace Qualified Electronic Component (AQEC) Requirements, Volume 1 ?Integrated Circuits and Semiconductors
GEIA SSB-1.003-A-2002 Acceleration Factors Annex to SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications

European Committee for Electrotechnical Standardization（CENELEC）, zn semiconductor element

EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
EN 61643-341:2001 Components for Low-Voltage Surge Protective Devices - Part 341: Specification for Thyristor Surge Suppressors (TSS)

ES-UNE, zn semiconductor element

UNE-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)
UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)
UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration Mechanisms (Endorsed by Asociación Española de Normalización in June of 2017.)
UNE-EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (Endorsed by Asociación Española de Normalización in November of 2021.)
UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)
UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN 9145:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices (Endorsed by AENOR in August of 2014.)
UNE-EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers (Endorsed by AENOR in October of 2014.)
UNE-EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006) (Endorsed by AENOR in January of 2007.)

Insulated Cable Engineers Association （ICEA), zn semiconductor element

ICEA T-25-425-2015 GUIDE FOR ESTABLISHING STABILITY OF VOLUME RESISTIVITY FOR SEMICONDUCTING POLYMERIC COMPONENTS OF POWER CALBES
ICEA T-32-645-2012 TEST METHOD FOR ESTABLISHING VOLUME RESISTIVITY COMPATIBILITY OF WATER BLOCKING COMPONENTS WITH EXTRUDED SEMICONDUCTING SHIELD MATERIALS

ICEA - Insulated Cable Engineers Association Inc., zn semiconductor element

T-25-425-2015-2015 GUIDE FOR ESTABLISHING STABILITY OF VOLUME RESISTIVITY FOR SEMICONDUCTING POLYMERIC COMPONENTS OF POWER CALBES
T-32-645-2012 Test Method for Establishing Volume Resistivity Compatibility of Water Blocking Components With Extruded Semiconducting Shield Materials

Defense Logistics Agency, zn semiconductor element

DLA MIL-PRF-19500/421 G VALID NOTICE 1-2009 Semiconductor, Device, Dual Transistor, Unitized, NPN/PNP, Complementary, Silicon, Types 2N3838, 2N4854, and 2N4854U, JAN, JANTX, and JANTXV
DLA SMD-5962-94537-1994 MICROCIRCUIT, DIGITAL, CMOS, 8-BIT MEMORY PROCESSING UNIT, MONOLITHIC SILICON
DLA MIL-PRF-19500/559 J-2007 SEMICONDUCTOR DEVICE, UNITIZED, NPN, SILICON, SWITCHING, FOUR TRANSISTOR ARRAY, TYPES 2N6989, 2N6989U, AND 2N6990, JAN, JANTX, JANTXV, AND JANS
DLA SMD-5962-90504 REV C-1997 MICROCIRCUIT, DIGITAL, CMOS, BINARY FILTER AND TEMPLATE MATCHER, MONOLITHIC SILICON
DLA SMD-5962-96612 REV B-1997 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, BINARY RATE MULTIPLIER, MONOLITHIC SILICON
DLA SMD-5962-88638 REV C-1996 MICROCIRCUIT, MEMORY, DIGITAL CMOS, PROGRAMMABLE LOGIC CELL ARRAY, MONOLITHIC SILICON
DLA SMD-5962-96706 REV C-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED ADVANCED CMOS, 4-BIT BINARY SYNCHRONOUS COUNTER, MONOLITHIC SILICON
DLA SMD-5962-88640 REV A-1992 MICROCIRCUITS, DIGITAL, FAST CMOS SYNCHRONOUS PRESETTABLE BINARY, COUNTER, TTL COMPATIBLE, MONOLITHIC SILICON
DLA SMD-5962-89492-1991 MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, DUAL, RETRIGGERABLE MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON
DLA SMD-5962-96584 REV A-2006 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, 4-BIT BINARY FULL ADDER WITH FAST CARRY, MONOLITHIC SILICON
DLA SMD-5962-95774 REV B-2004 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS, 4-BIT BINARY FULL ADDER WITH FAST CARRY, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-92105-1992 MICROCIRCUIT, MEMORY, DIGITAL, CMOS 8 - MACROCELL ELECTRICALLY PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
DLA SMD-5962-89458 REV A-2006 MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, 14-STAGE BINARY RIPPLE COUNTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96628 REV C-2003 MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, RIPPLE CARRY BINARY COUNTER/DIVIDER, MONOLITHIC SILICON
DLA SMD-5962-95730 REV B-2000 MICROCIRCUIT, DIGITAL, RADIATION HARDENED HIGH SPEED CMOS, 4-BIT BINARY SYNCHRONOUS COUNTER, MONOLITHIC SILICON
DLA SMD-5962-86009 REV D-2008 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, DUAL BINARY COUNTER, MONOLITHIC SILICON

PT-IPQ, zn semiconductor element

NP 3081-1985

SAE - SAE International, zn semiconductor element

SAE GEIASTD0002_1A-2015 Aerospace Qualified Electronic Component (AQEC) Requirements@ Volume 1 - Integrated Circuits and Semiconductors

Society of Automotive Engineers (SAE), zn semiconductor element

SAE GEIASTD0002_1-2005 Aerospace Qualified Electronic Component (AQEC) Requirements, Volume 1 - Integrated Circuits and Semiconductors

Group Standards of the People's Republic of China, zn semiconductor element

T/ZGM 003-2022 Assessment requirements for quality grading and forerunner - Membrane elements for terminal filtration in the semiconductor industry
T/ZGM 012-2023 Technical specifications of spiral wound reverse osmosis membrane products certification for ultra pure water in semiconductors industry

International Organization for Standardization (ISO), zn semiconductor element

ISO/CD 3884:2023 Solid recovered fuels — Methods for the determination of the content of elements (Al, Ca, Fe, K, Mg, Na, P, S, Si, Ti, As, Ba, Be, Cd, Co, Cr, Cu, Hg, Mo, Mn, Ni, Pb, Sb, Se, Sn, Tl, V, Zn)

BE-NBN, zn semiconductor element

AT-OVE/ON, zn semiconductor element

OVE EN IEC 60749-39:2020 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)
OVE EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (IEC 47/2667/CDV) (english version)

未注明发布机构, zn semiconductor element

BS EN 150001:1993(1999) Specification for Harmonized system of quality assessment for electronic components — Blank detail specification — General purpose semiconductor diodes
BS IEC 60747-10:1991(2011) Harmonized system ofquality assessment for electronic components Semiconductor devices — Generic specification for discrete devices and integrated circuits
BS CECC 13:1985(1999) Harmonized system of quality assessment for electronic components : Basic specification : Scanning electron microscope inspection of semiconductor dice

Standard Association of Australia （SAA）, zn semiconductor element

AS/NZS 1660.2.3:1998 Test methods for electric cables, cords and conductors - Insulation, extruded semi-conductive screens and non-metallic sheaths - Methods specific to PVC and halogen free thermoplastic materials

ZA-SANS, zn semiconductor element

SANS 61643-341:2004 Components for low-voltage surge protective devices Part 341: Specification for thyristor surge suppressors (TSS)

KR-KS, zn semiconductor element

KS L ISO 21859-2023 Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment