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electronic solder

electronic solder, Total:42 items.

In the international standard classification, electronic solder involves: Welding, brazing and soldering, Electronic component assemblies, Materials for aerospace construction.

Institute of Interconnecting and Packaging Electronic Circuits (IPC), electronic solder

• IPC J-STD-006B-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

US-ACEI, electronic solder

• IPC J-STD-006A-2001 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

IPC - Association Connecting Electronics Industries, electronic solder

• IPC J-STD-006B JAPANESE-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006B AMD 1 & 2-2009 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006C CD-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006B JAPANESE CD-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006C CHINESE-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006C-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC J-STD-006C AMD 1-2017 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
• IPC J-STD-006B AMD 1-2008 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
• IPC J-STD-006-1995 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: August 1996)
• IPC J-STD-006B RUSSIAN-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: October 2008)
• IPC J-STD-006B CD-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: October 2008@ Amendment 2: October 2009)

International Electrotechnical Commission (IEC), electronic solder

• IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• IEC 61190-1-3:2007/AMD1:2010 Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
• IEC 61190-1-3:2010 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Korean Agency for Technology and Standards (KATS), electronic solder

• KS C IEC 61190-1-3:2021 Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• KS C IEC 61190-1-3-2006(2016) Attachment materials for electronic assembly－Part 1－3：Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

KR-KS, electronic solder

• KS C IEC 61190-1-3-2021 Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

British Standards Institution (BSI), electronic solder

• BS EN 61190-1-3:2002 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• BS EN IEC 61190-1-3:2018 Tracked Changes. Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
• BS EN 61190-1-3:2007+A1:2010 Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

German Institute for Standardization, electronic solder

• DIN EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007
• DIN EN IEC 61190-1-3:2018-09 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 / Note: DIN...

ES-UNE, electronic solder

• UNE-EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)

IN-BIS, electronic solder

• IS 11516-1985

Danish Standards Foundation, electronic solder

• DS/EN 61190-1-3/A1:2010 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• DS/EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

European Committee for Electrotechnical Standardization（CENELEC）, electronic solder

• EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
• EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)

Lithuanian Standards Office , electronic solder

• LST EN 61190-1-3-2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007)
• LST EN 61190-1-3-2007/A1-2010 Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007/A1:2010)

CENELEC - European Committee for Electrotechnical Standardization, electronic solder

• EN 61190-1-3:2002 Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

RO-ASRO, electronic solder

• STAS 5226-1979 Wooden packages CASES FOR COVERED ELECTRODES FOR ELEGTRICAL WELD1NG

RU-GOST R, electronic solder

• GOST R 59681-2021 Assembly and installation of electronic modules. Solders, soldering fluxes, solder pastes. The type, composition, properties and applications

ECIA - Electronic Components Industry Association, electronic solder

• 486-1982 Solder Wicking Test Procedure for Sockets@ Plug-In Electronic Components

American Society for Testing and Materials (ASTM), electronic solder

• ASTM F106-06 Standard Specification for Brazing Filler Metals for Electron Devices
• ASTM F106-12(2017) Standard Specification for Brazing Filler Metals for Electron Devices

Electronic Components, Assemblies and Materials Association, electronic solder

• ECA 280-C-1992 Solderless Wrapped Electrical Connections

Association of German Mechanical Engineers, electronic solder

• DVS 3204-2013 Electron beam weldability of metallic materials
• DVS 3204-1988

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