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lead frame
lead frame, Total:37 items.
In the international standard classification, lead frame involves: Chipless working equipment, Road vehicle systems, Integrated circuits. Microelectronics, Products of non-ferrous metals, Mechanical structures for electronic equipment, Iron and steel products, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Electronic components in general.
Professional Standard - Machinery, lead frame
Group Standards of the People's Republic of China, lead frame
- T/ZZB 0679-2018 Leadfream assembly of automotive gear-box
- T/ZZB 0142-2016 Copper alloy strips and foils for LED lead frame
- T/ZZB 2858-2022 Small outline package leadframes for integrated circuits
- T/CECA 33-2019 Technical requirements and test methods for the leadfream assembly of automotive
- T/CASME 479-2023 Punched lead frame for plastic small outline packaging of semiconductor integrated circuits
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, lead frame
- GB/T 15878-1995 Specification of leadframes for small outline package
- GB/T 15876-1995 Specification of leadframes for plastic quad flat package
- GB/T 15877-1995 Specification of DIP leadframes produced by etching
- GB/T 16525-1996 Specification of leadframes for plastic leaded chip carrier packages
- GB/T 15878-2015 Semiconductor integrated circuits.Specification of leadframes for small outline package
- GB/T 20254.1-2015 Copper and copper alloy strips for lead frame.Part 1:Plane strip
- GB/T 20254.1-2006 Copper and copper alloy strips for Lead frame.Part 1:Flat strips
- GB/T 15876-2015 Semiconductor integrated circuits.Specification of leadframes for plastic quad flat package
- GB/T 20254.2-2006 Copper and copper alloy strips for Lead Frame Part 2:U-strips
- GB/T 20254.2-2015 Copper and copper alloy strips for lead frames - Part 2: Profiled strips
- GB/T 16525-2015 Semiconductor integrated circuits.Specification of leadframes for plastic leaded chip carrier package
- GB/T 15877-2013 Specification for leadframes for etched dual-row packages for semiconductor integrated circuits
- GB/T 14112-2015 Semiconductor integrated circuits.Specification for stamped leadframes of plastic DIP
- GB/T 14112-1993 Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP
Danish Standards Foundation, lead frame
Lithuanian Standards Office , lead frame
AENOR, lead frame
British Standards Institution (BSI), lead frame
German Institute for Standardization, lead frame
- DIN EN 1758:1998 Copper and copper alloys - Strip for lead frames; German version EN 1758:1997
- DIN EN 1758:1998-03 Copper and copper alloys - Strip for lead frames; German version EN 1758:1997
American Society for Testing and Materials (ASTM), lead frame
- ASTM F375-20 Standard Specification for Integrated Circuit Lead Frame Material
- ASTM F375-89(1999) Standard Specification for Integrated Circuit Lead Frame Material
- ASTM F375-89(2015) Standard Specification for Integrated Circuit Lead Frame Material
Association Francaise de Normalisation, lead frame
- NF EN 1758:1998 Cuivre et alliages de cuivre - Bandes pour grilles de composants (lead frames)
Professional Standard - Electron, lead frame
- SJ/T 11773-2021 Semiconductor integrated circuit stamped lead frame
- SJ/T 11774-2021 Specification of integrated circuit lead frame plating silver layer
- SJ 2850-1988 General specification for base,cap and lead frame of discrete semiconductor devices
- SJ 2854-1988 Discrete semiconductor devices--Detail specification for lead frame of plastic package
- SJ/T 10585-1994 Semiconductor discrete device Dimensions of outline and lead-frame for the surface mounting device
Professional Standard - Ferrous Metallurgy, lead frame
工业和信息化部, lead frame
- YB/T 100-2016 4J42K alloy cold rolled strip for integrated circuit lead frame