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pole piece tem

pole piece tem, Total:271 items.

In the international standard classification, pole piece tem involves: Corrosion of metals, Applications of information technology, Welding, brazing and soldering, Integrated circuits. Microelectronics, Electricity. Magnetism. Electrical and magnetic measurements, Materials for aerospace construction, Rubber and plastics products, Electromechanical components for electronic and telecommunications equipment, Semiconductor devices, Road vehicle systems, Thermodynamics and temperature measurements, Materials for the reinforcement of composites, Capacitors.

Electronic Components, Assemblies and Materials Association, pole piece tem

EIA_ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
EIA/ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
ECA EIA/ECA-955-2007 SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)
ECA SP 4984-2005 Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode To be published as ANSI/EIA/ECA-955

International Organization for Standardization (ISO), pole piece tem

ISO 22426:2020 Assessment of the effectiveness of cathodic protection based on coupon measurements

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, pole piece tem

JEDEC JESD2-1982 Digital Bipolar Pinouts for Chip Carriers
JEDEC JESD51-50-2012 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)

British Standards Institution (BSI), pole piece tem

BS ISO 22426:2020 Assessment of the effectiveness of cathodic protection based on coupon measurements
BS EN ISO 8092-1:1998 Road vehicles - Connections for on-board electrical wiring harnesses - Tabs for single-pole connections - Dimensions and specific requirements
BS CECC 32200:1989 Harmonized system of quality assessment for electronic components - Sectional specification: fixed chip capacitors with metallized electrodes and polyethylene-terephthalate dielectric for direct current

German Institute for Standardization, pole piece tem

DIN 41622-1:1965-01 Multipole Connectors with Blade Contacts 3 × 1 mm; Dimensions
DIN 41618-1:1966-10 Multipole connectors with blade contacts 2,5 mm × 1 mm; dimensions
DIN 41618-3:1974-05 Multipole connectors with blade contacts 2,5 mm × 1 mm; locating and detent parts
DIN CEN/TR 16625:2014-03*DIN SPEC 18449:2014-03 Flexible sheets for waterproofing - Statistical definition of manufacturer's limiting value and declared value (MLV and MDV) - 95 % Statistic; German version CEN/TR 16625:2013
DIN 41618-4:1976-02 Multipole connectors with blade contacts 2,5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622
DIN EN 2995-006:2023-06 Aerospace series - Circuit breakers, single-pole, temperature compensated, rated currents 1 A to 25 A - Part 006:6,3 mm & 2,8 mm blade terminal with polarized signal contact - Product standard; German version ASD-STAN prEN 2995-006:2023 / Note: Dat...
DIN 16196:1991 Dial indicating thermometers with electrical limit contact devices; filled system thermometers and bimetallic-thermometers
DIN 16196:2015 Dial indicating thermometers with electrical limit contact devices - Filled system thermometers and bimetallic thermometers
DIN 16196:2013 Dial indicating thermometers with electrical limit contact devices - Filled system thermometers and bimetallic thermometers
DIN EN 2995-006:2020 Aerospace series - Circuit breakers, single-pole, temperature compensated, rated currents 1 A to 25 A - Part 006: 6,3 mm & 2,8 mm blade terminal with polarized signal contact - Product standard; English version prEN 2995-006:2020
DIN 45910-28:1991 Harmonized system of quality assessment for electronic components; sectional specification: fixed chip capacitors with metallized electrodes and polyethylene-terephthalate dielectric for direct current.

Association Francaise de Normalisation, pole piece tem

NF A81-304:1994 Covered electrodes for manual metal arc welding. Deposition of a weld metal pad for chemical analysis.
NF EN ISO 2128:2010 Anodisation de l'aluminium et de ses alliages - Détermination de l'épaisseur des couches anodiques - Méthode non destructive par microscope à coupe optique
FD R13-438:1996 Road vehicles. Multipole, 3 mm flat tab connections with housing locking. Dimensional characteristics.
NF R13-440:1992 Road vehicles. Flat, quick-connect terminations. Part 2 : tests and performance requirements for single pole connections.

Defense Logistics Agency, pole piece tem

DLA SMD-5962-88589 REV D-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, POSITIVE NAND GATE, MONOLITHIC SILICON
DLA SMD-5962-00516 REV B-2002 MICROCIRCUIT, LINEAR, POSITIVE 5-VOLT ADJUSTABLE PRECISION VOLTAGE REFERENCE, MONOLITHIC SILICON
DLA SMD-5962-02534 REV D-2006 MICROCIRCUIT, LINEAR, POSITIVE, FIXED, 2.5 V, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON
DLA SMD-5962-02535 REV D-2006 MICROCIRCUIT, LINEAR, POSITIVE, FIXED, 3.3 V, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON
DLA SMD-5962-02536 REV D-2006 MICROCIRCUIT, LINEAR, POSITIVE, FIXED, 5 V, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON
DLA SMD-5962-97572 REV A-2006 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES, MONOLITHIC SILICON
DLA SMD-5962-94676 REV F-2005 MICROCIRCUIT, LINEAR, CURRENT FEEDBACK AMPLIFIER, ULTRA HIGH SPEED, MONOLITHIC SILICON
DLA SMD-5962-01507-2001 MICROCIRCUIT, DIGITAL, BIPOLAR, HIGH-SPEED LOOK-AHEAD CARRY GENERATOR, MONOLITHIC SILICON
DLA SMD-5962-88729 REV B-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTING DRIVERS, MONOLITHIC SILICON
DLA SMD-5962-95575 REV B-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR, MONOLITHIC SILICON
DLA SMD-5962-88541 REV B-1992 MICROCIRCUIT, DIGITAL, 512 X 4-BIT BIPOLAR PROM, MONOLITHIC SILICON
DLA SMD-5962-88718 REV C-2013 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, HEX INVERTER WITH OPEN-DRAIN OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-98533 REV D-2010 MICROCIRCUIT, LINEAR, RADIATION HARDENED, VERY LOW NOISE QUAD, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-98533 REV E-2013 MICROCIRCUIT, LINEAR, RADIATION HARDENED, VERY LOW NOISE QUAD, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-87767 REV B-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, OCTAL BUFFER AND LINE DRIVER WITH OPEN-COLLECTOR OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-94677 REV A-2002 MICROCIRCUIT, LINEAR, CURRENT FEEDBACK AMPLIFIER, ULTRA HIGH SPEED, OUTPUT CLAMPING, MONOLITHIC SILICON
DLA SMD-5962-88523 REV B-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, HEX 2-INPUT OR DRIVERS, MONOLITHIC SILICON
DLA SMD-5962-06250-2006 MICROCIRCUIT, DIGITAL, BIPOLAR SCHOTTKY TTL, MULTIPLE NOR GATES, MONOLITHIC SILICON
DLA DSCC-VID-V62/06609-2006 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90506 REV A-2005 MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUS TRANSCEIVER WITH THREE-STATE NONINVERTING OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-96658 REV C-2003 MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, HEX SCHMITT-TRIGGER INVERTERS, MONOLITHIC SILICON
DLA SMD-5962-88727 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, OCTAL BUS TRANSCEIVERS, MONOLITHIC SILICON
DLA DSCC-VID-V62/03620 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 36-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/06609 REV A-2013 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90506 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR, OCTAL BUS TRANSCEIVER WITH THREE-STATE NONINVERTING OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-03202-2003 MICROCIRCUIT, MEMORY, DIGITAL, 1024 X 8-BIT BIPOLAR PROM, MONOLITHIC SILICON
DLA SMD-5962-03203-2003 MICROCIRCUIT, MEMORY, DIGITAL, 2048 X 8-BIT BIPOLAR PROM, MONOLITHIC SILICON
DLA SMD-5962-88728 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, OCTAL D-TYPE EDGE TRIGGERED FLIP-FLOPS, MONOLITHIC SILICON
DLA SMD-5962-88741 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY, TTL, 8-BIT ADDRESSABLE LATCHES, MONOLITHIC SILICON
DLA SMD-5962-86706 REV C-2010 MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR, 1K x 8-bit, REGISTERED PROM WITH PROGRAMMABLE INITIALIZE, MONOLITHIC SILICON
DLA DSCC-VID-V62/04602 REV E-2012 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-87647 REV C-2013 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, QUAD 2-INPUT NAND GATE WITH OPEN DRAIN OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-95537 REV B-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR, MONOLITHIC SILICON
DLA MIL-M-38510/348 C VALID NOTICE 1-2009 Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Bus Transceivers with Three-State Outputs, Monolithic Silicon
DLA MIL-M-38510/348 C VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Bus Transceivers with Three-State Outputs, Monolithic Silicon
DLA SMD-5962-95537 REV A-2001 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR, MONOLITHIC SILICON
DLA MIL-PRF-19500/694 A VALID NOTICE 1-2008 Semiconductor Device, Transistor, Plastic, NPN, Silicon, Switching, Type 2N3700UE1, JAN, JANTX, JANJ
DLA SMD-5962-91726 REV A-2008 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUFFER, THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-84061-1984 MICROCIRCUITS, DIGITAL, ADVANCED LOW POWER SCHOTTKY TTL, INVERTER GATE, BUFFER OUTPUT MONOLITHIC SILICON
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS, MEMORY, DIGITAL, 8192 BIT, SWITCHABLE, SCHOTTKY, BIPOLAR PROM WITH TRI-STATE OUTPUT, MONOLITHIC SILICON
DLA DSCC-VID-V62/03621 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 36-BIT REGISTERED BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90686 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER WITH OPEN DRAIN OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/03658 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, QUADRUPLE 2-INPUT POSITIVE OR GATE WITH TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04671 REV A-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT QUADRUPLE BUS BUFFER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04700 REV A-2011 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04705 REV A-2011 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT QUADRUPLE BUS BUFFER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/328 C VALID NOTICE 1-2008 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Bus Transceivers with Three State Outputs, Monolithic Silicon
DLA MIL-M-38510/324 D VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Octal Buffer Gates with Three State Outputs, Monolithic Silicon
DLA MIL-M-38510/328 C VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Bus Transceivers with Three State Outputs, Monolithic Silicon
DLA MIL-PRF-19500/253 K-2008 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER, TYPES 2N930 AND 2N930UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
DLA SMD-5962-96697 REV A-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 1-LINE TO 8-LINE CLOCK DRIVER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-86709 REV F-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, MEMORY, 16 X 48 X 8 FIELD PROGRAMMABLE LOGIC SEQUENCER, MONOLITHIC SILICON
DLA SMD-5962-88590 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, POSITIVE NAND GATE, MONOLITHIC SILICON
DLA SMD-5962-90590 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER WITH OPEN DRAIN OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-77057 REV G-2005 MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, OCTAL BUFFER, DRIVER/RECEIVER, MONOLITHIC SILICON
DLA DSCC-VID-V62/04757 REV A-2011 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 1-LINE TO 10-LINE CLOCK DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-84031 REV D-2005 MICROCIRCUIT, DIGITAL, ADVANCED LOW-POWER SCHOTTKY TTL, LOGIC GATE WITH BUFFER OUTPUT, MONOLITHIC SILICON
DLA DSCC-VID-V62/04672 REV A-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04673 REV A-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04718 REV A-2011 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-91746 REV A-2008 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUFFER, INVERTING THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/342 A VALID NOTICE 1-2009 Microcircuits, Digital, Bipolar, Advanced Schottky TTL, 4-Bit Binary Full Adders with Fast Carry, Monolithic Silicon
DLA MIL-M-38510/383 B VALID NOTICE 1-2009 Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, Octal Buffer Gates with Three State Outputs, Monolithic Silicon
DLA MIL-M-38510/79 D VALID NOTICE 1-2010 Microcircuits, Digital, Bipolar, SCHOTTKY TTL, Data Selectors/Multiplexers with Three-State Outputs, Monolithic Silicon
DLA SMD-5962-89444 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR, LOW POWER SCHOTTKY, TTL, 8-BIT SHIFT REGISTER WITH INPUT LATCHES, MONOLITHIC SILICON
DLA SMD-5962-90514 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90870 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL REGISTERED TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/322 C VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Hex Bus Drivers with 3 State Outputs, Monolithic Silicon
DLA MIL-M-38510/323 D VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Quadruple Bus Buffer Gates with Three State Outputs, Monolithic Silicon
DLA MIL-M-38510/342 A VALID NOTICE 2-2013 Microcircuits, Digital, Bipolar, Advanced Schottky TTL, 4-Bit Binary Full Adders with Fast Carry, Monolithic Silicon
DLA SMD-5962-88621 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUADRUPLE, 2-INPUT EXCLUSIVE-OR-GATE, MONOLITHIC SILICON
DLA SMD-5962-95577 REV B-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 36-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-95590 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRASCEIVER WITH THREESTATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93175 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93241 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT REGISTERED TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-87621 REV B-2011 MICROCIRCUITS, DIGITAL, BIPOLAR, LOW POWER SCHOTTKY TTL, 8-BIT BINARY COUNTER WITH INPUT REGISTERS, MONOLITHIC SILICON
DLA MIL-M-38510/322 C VALID NOTICE 1-2008 Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Hex Bus Drivers with 3 State Outputs, Monolithic Silicon
DLA MIL-M-38510/323 D VALID NOTICE 1-2008 MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, QUADRUPLE BUS BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/324 D VALID NOTICE 1-2008 MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, OCTAL BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/339 D VALID NOTICE 1-2008 Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Data Selectors/Multiplexers with Three-State Outputs, Monolithic Silicon
DLA SMD-5962-90746 REV C-2013 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL D-TYPE TRANSPARENT LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93200 REV D-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93227 REV E-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA DSCC-VID-V62/04676 REV A-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-93188 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-88626 REV D-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ALS SCHOTTKY TTL, DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-93199 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93218 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93219 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94509 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 10-BIT BUFFER/DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90910 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCE SCHOTTKY, TTL, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE, MONOLITHIC SILICON
DLA SMD-5962-95646 REV B-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 20-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90625 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER WITH THREESTATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90743 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER WITH THREESTATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94601 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-92314 REV D-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93201 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96769 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 10-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94501 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-97623 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSCEIVER WITH BUS HOLD AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90695 REV A-2010 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY, TTL, 8-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90780 REV C-2012 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, 10-BIT BUS INTERFACE FLIP-FLOPS WITH NON-INVERTING AND INVERTING INPUTS, MONOLITHIC SILICON
DLA SMD-5962-84011 REV G-2005 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, DUAL D-TYPE POSITIVE EDGE TRIGGERED FLIP-FLOPS WITH CLEAR AND RESET, MONOLITHIC SILICON
DLA SMD-5962-89602 REV B-2006 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, OCTAL BUFFERS AND DRIVERS WITH NONINVERTING THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-89668 REV B-2006 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, SYNCHRONOUS 8-BIT UP/DOWN COUNTER WITH ASYNCHRONOUS CLEAR, MONOLITHIC SILICON
DLA SMD-5962-90582 REV A-2006 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, UP/DOWN BINARY COUNTER WITH PRESET AND RIPPLE CLOCK, MONOLITHIC SILICON
DLA SMD-5962-93148 REV B-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-92147 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94718 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93220 REV D-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-97625 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUS TRANSCEIVER WITH BUS HOLD AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93148 REV C-2013 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90710 REV A-2010 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, 10-BIT BUS INTERFACE D-TYPE LATCHES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-91716 REV A-2010 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, CLOCK DRIVER, QUAD D-TYPE FLIP-FLOP WITH MATCHED PROPAGATION DELAYS, MONOLITHIC SILICON
DLA SMD-5962-90748 REV B-2012 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-89722-1989 MICROCIRCUIT, DIGITAL, ADVANCED SCHOTTKY, TTL, OCTAL 30-OHM TRANSMISSION LINE/BACKPLANE TRANSCEIVERS NINV (OPEN COLLECTOR WITH ENABLE WITH THREE STATE), MONOLITHIC SILICON
DLA SMD-5962-96698 REV A-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT TRANSCEIVER/ REGISTER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93241 REV B-2000 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT REGISTERED TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90514 REV A-2006 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90523 REV B-2003 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, OCTAL BUS TRANSCEIVERS AND REGISTERS WITH INVERTING THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-96849 REV B-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V 16-BIT REGISTERED TRANSCEIVER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94672 REV B-2013 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT UNIVERSAL BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA MIL-M-38510/321 C VALID NOTICE 1-2008 MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, BUFFERS/DRIVERS, OPEN COLLECTOR OUTPUT, HIGH VOLTAGE, MONOLITHIC SILICON
DLA SMD-5962-90741 REV C-2013 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER/MOS DRIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90562 REV A-2005 MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY 1 OF 16 DATA GENERATORS/ MULTIPLEXERS WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90625 REV A-2006 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER WITH THREESTATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93227 REV D-2000 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93250 REV A-2005 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, OCTAL BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS AND 25 OHM SERIES PULL-DOWN RESISTORS IN OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-96761-1996 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 1-LINE TO 8-LINE CLOCK DRIVER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-95642 REV D-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3 VOLT OCTAL BUS TRANSCEIVER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96685 REV D-2010 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V 16-BIT BUFFER/DRIVER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94615 REV B-2013 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL REGISTERED BUS TRANSCEIVER, THREESTATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90523 REV C-2009 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, OCTAL BUS TRANSCEIVERS AND REGISTERS WITH INVERTING THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-90939 REV D-2013 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER/MOS DRIVER WITH INVERTED THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-92314 REV C-1997 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94615 REV A-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL REGISTERED BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94501 REV A-1998 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94509 REV A-2001 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 10-BIT BUFFER/DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94618 REV A-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUS TRANSCEIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93086 REV A-1996 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUS TRANSCEIVER AND REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93174 REV D-2003 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93188 REV B-1995 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93199 REV B-1999 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93218 REV B-2000 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93219 REV B-2000 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96753 REV A-1999 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, CLOCK AND WAIT-STATE GENERATION CIRCUIT, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96768 REV A-2003 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, QUADRUPLE BUS BUFFER GATE WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96810 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-VOLT 16-BIT TRANSPARENT D-TYPE LATCH WITH BUS HOLD, THREE-STATE OUTPUTS, AND TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94698 REV A-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER AND REGISTER, THREE-STATE OUTPUTS AND TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94587 REV C-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT NONINVERTING BUFFER/LINE DRIVER WITH SERIES RESISTOR AND THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94616 REV B-2013 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUS TRANSCEIVER AND REGISTER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96862 REV A-2008 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, QUADRUPLE BUS BUFFER GATE WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-96868 REV A-2008 MICROCIRCUIT, DIGITAL, ADVANCED HIGHSPEED CMOS, QUADRUPLE BUS BUFFER GATE WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-95647 REV C-2008 MICROCIRCUIT, DIGITAL, ADVANCED BICMOS, 3.3 V 16-BIT EDGE-TRIGGERED D-TYPE FLIPFLOPS WITH BUS HOLD, THREE-STATE OUTPUTS, AND TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93186 REV B-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96747-1997 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, SCAN PATH SELECTOR WITH 8-BIT BIDIRECTIONAL DATA BUS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94616 REV A-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH OCTAL BUS TRANSCEIVER AND REGISTER, THREE-SATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93147 REV A-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93148 REV A-1995 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLOCK ENABLE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93149 REV C-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90616 REV A-2004 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW- POWER SCHOTTKY, TTL, 10-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS, MONOLITHIC SILICON
DLA SMD-5962-93242 REV B-2001 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUS TRANSCEIVER AND REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96746 REV A-2003 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 8-BIT TO 9-BIT PARITY BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96748 REV D-1999 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-VOLT OCTAL BUS TRANSCEIVER AND REGISTER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94697 REV D-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/LINE DRIVER WITH 25 OHM SERIES RESISTOR AND INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96748 REV E-2009 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-VOLT OCTAL BUS TRANSCEIVER AND REGISTER WITH BUS HOLD, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA MIL-PRF-19500/394 M-2008 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER SWITCHING, TYPES: 2N4150, 2N5237, 2N5238, 2N4150S, 2N5237S, AND 2N5238S, JAN, JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF, JANSG, JANSH, JANHCA, JANHCB, JANKCA, JANKCB, JANKCM, JANKC
DLA SMD-5962-94586 REV A-2007 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE, OCTAL BUS TRANSCEIVER AND REGISTER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94601 REV B-1996 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94508 REV A-2000 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 9-BIT BUS INTERFACE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-94528 REV B-2003 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-89663-1989 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, 9 BIT PARITY GENERATORS/CHECKER WITH BUS DRIVER PARITY I/O PORT, MONOLITHIC SILICON
DLA SMD-5962-89950 REV A-2006 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, DUAL NEGATIVE EDGE TRIGGERED JK FLIPFLOP WITH ASYNCHRONOUS SET AND CLEAR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96769 REV A-1998 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 10-BIT BUS-INTERFACE D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-96810 REV B-1998 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-VOLT 16-BIT TRANSPARENT D-TYPE LATCH WITH BUS HOLD, THREE-STATE OUTPUTS, AND TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-90516 REV B-2006 MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL D-TYPE EDGE-TRIGGERED FLIP FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-93201 REV B-1997 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DLA SMD-5962-88591 REV C-2008 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, INVERTING, OCTAL BUFFER AND LINE DRIVER WITH THREESTATE OUTPUTS, MONOLITHIC SILICON

National Association of Corrosion Engineers (NACE), pole piece tem

NACE RP0104-2004 The Use of Coupons for Cathodic Protection Monitoring Applications Item No:21105
NACE 35201-2001 Technical Report on the Application and Interpretation of Data from External Coupons Used in the Evaluation of Cathodically Protected Metallic Structures (Item No. 24213)

Society of Automotive Engineers (SAE), pole piece tem

SAE AMS6546E-1991 Steel Sheet, Strip, and Plate 0.48Cr 8.0Ni 4.0Co 0.48Mo 0.09V (0.24-0.30C) Consumable Electrode Melted, Annealed
SAE AMS6524D-1991 Steel, Sheet, Strip, and Plate 1.0Cr 7.5Ni 4.5Co 1.0Mo 0.09V (0.29-0.34C) Consumable Electrode Melted, Annealed
SAE AMS6439B-1988 Steel Sheet, Strip, and Plate, 1.05Cr 0.55Ni 1.0Mo 0.12V (0.42 - 0.48C), Consumable Electrode Vacuum Melted, Annealed
SAE AMS6520D-1995 Steel, Maraging, Sheet, Strip, and Plate, 18Ni 7.8Co 4.9Mo 0.40Ti 0.10Al, Consumable Electrode Melted, Solution Heat Treated
SAE MAM5914A-2003 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Foil 52.5ni 19cr 3.0mo 5.0cb 0.90ti 0.50al 18fe Consumable Electrode Or Vacuum Induction Melted Precision Cold Rolled, Solution Heat Treated
SAE AMS5605F-2013 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate, 41.5Ni - 16Cr - 37Fe - 2.9Cb - 1.8Ti, Consumable Electrode or Vacuum Induction Melted, 1800 °F (982 °C) Solution Heat Treated
SAE AMS5605E-2006 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate 41.5Ni - 16Cr - 37Fe - 2.9Cb - 1.8Ti Consumable Electrode or Vacuum Induction Melted 1800 Degrees F (982 Degrees C) Solution Heat Treated UNS N09706
SAE AMS5605D-2000 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate 41.5Ni 16Cr 37Fe 2.9Cb 1.8Ti Consumable Electrode or Vacuum Induction Melted, 1800°F (982°C) Solution Heat Treated
SAE J2223/3-1998 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 3: Multipole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements
SAE J2223/1-1998 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 1: Single-Pole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements
SAE J2223/1-2011 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 1: Single-Pole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements
SAE J2223/1-2005 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 1: Single-Pole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements
SAE J2223/3-1994 Connections for On-Board Road Vehicle Electrical Wiring Harnesses--Part 3: Multipole Connectors--Flat Blade Terminals--Dimensional Characteristics and Specific Requirements
SAE J2223/3-2003 Connections for On-Board Road Vehicle Electrical Wiring Harnesses Part 3: Multipole Connectors Flat Blade Terminals Dimensional Characteristics and Specific Requirements
SAE J2223/1-2003 Connections for On-Board Road Vehicle Electrical Wiring Harnesses Part 1: Single-Pole Connectors Flat Blade Terminals Dimensional Characteristics and Specific Requirements
SAE J2223/1-1994 Connections for On-Board Road Vehicle Electrical Wiring Harnesses--Part 1: Single-Pole Connectors--Flat Bladeterminals--Dimensional Characteristics and Specific Requirements
SAE J2223-3-2011 Connections for On-Board Road Vehicle Electrical Wiring HarnessesPart 3: Multipole Connectors Flat Blade TerminalsDimensional Characteristics and Specific Requirements
SAE AMS5872D-2000 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate 48Ni 20Cr 20Co 5.9Mo 2.2Ti 0.45Al Consumable Electrode or Vacuum Induction Melted Solution Heat Treated
SAE AMS5606D-2000 Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate 41.5Ni 16Cr 37Fe 2.9Cb 1.8Ti Consumable Electrode or Vacuum Induction Melted 1750°F (954°C) Solution Heat Treated
SAE AMS5597F-2009 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Plate, 52.5Ni 19Cr 3.0Mo 5.1Cb (Nb) 0.90Ti 0.50Al 18Fe, Consumable Electrode or Vacuum Induction Melted, 1950°F (1066°C) Solution Heat Treated
SAE AMS5914A-2001 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip, and Foil 52.5Ni - 19Cr - 3.0Mo - 5.0Cb - 0.90Ti - 0.50Al - 18Fe Consumable Electrode or Vacuum Induction Melted Precision Cold Rolled, Solution Heat Treated Composition similar to UNS N07719

U.S. Military Regulations and Norms, pole piece tem

ARMY MIL-PRF-55365/12 D (2)-2008 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, STYLE CWR15
ARMY MIL-PRF-55365/12 E-2011 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, STYLE CWR15
ARMY MIL-PRF-55365/13 A-2011 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, STYLE CWR16
ARMY MIL-PRF-55365/8 H-2011 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY AND HIGH RELIABILITY, STYLE CWR11 (METRIC)
ARMY MIL-PRF-55365/4 H-2011 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY STYLES CWR06 AND CWR09
ARMY MIL-PRF-55365/11 C-2011 CAPACITORS, CHIP, FIXED, TANTALUM, POLARIZED ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY AND HIGH RELIABILITY, STYLES CWR19 AND CWR29

SAE - SAE International, pole piece tem

SAE AMS6546F-2001 Steel@ Sheet@ Strip@ and Plate 0.48Cr - 8.0Ni - 4.0Co - 0.48Mo - 0.09V (0.24 - 0.30C) Consumable Electrode Melted@ Annealed (UNS K91122)
SAE AMS6546E-1995 Steel@ Sheet@ Strip@ and Plate 0.48Cr - 8.0Ni - 4.0Co - 0.48Mo - 0.09V (0.24 - 0.30C) Consumable Electrode Melted@ Annealed (UNS K91122)
SAE AMS6524E-2003 Steel@ Sheet@ Strip@ and Plate 1.0Cr - 7.5Ni - 4.5Co - 1.0Mo - 0.09V (0.29 - 0.34C) Consumable Electrode Vacuum Melted@ Annealed (UNS K91313)
SAE AMS6520D-2001 Steel@ Maraging@ Sheet@ Strip@ and Plate 18Ni - 7.8Co - 4.9Mo - 0.40Ti - 0.10Al Consumable Electrode Melted@ Solution Heat Treated (UNS K92890)
SAE AMS6520C-1995 Steel@ Maraging@ Sheet@ Strip@ and Plate 18Ni - 7.8Co - 4.9Mo - 0.40Ti - 0.10Al Consumable Electrode Melted@ Solution Heat Treated (UNS K92890)
SAE AMS6520E-2016 Steel@ Maraging@ Sheet@ Strip@ and Plate 18Ni - 7.8Co - 4.9Mo - 0.40Ti - 0.10Al Consumable Electrode Melted@ Solution Heat Treated (UNS K92890)
SAE AMS5605G-2019 Nickel Alloy@ Corrosion and Heat Resistant@ Sheet@ Strip@ and Plate 41.5Ni - 16Cr - 37Fe - 2.9Cb (Nb) - 1.8Ti Consumable Electrode or Vacuum Induction Melted 1800 °F (982 °C) Solution Heat Treated (UNS N09706)
SAE J2223-1-2005 Connections for On-Board Road Vehicle Electrical Wiring Harnesses Part 1: Single-Pole ConnectorsFlat Blade Terminals Dimensional Characteristics and Specific Requirements
SAE J2223-3-1998 Connections for On-Board Road Vehicle Electrical Wiring HarnessesPart 3: Multipole Connectors Flat Blade TerminalsDimensional Characteristics and Specific Requirements
SAE J2223-3-2006 Connections for On-Board Road Vehicle Electrical Wiring HarnessesPart 3: Multipole Connectors Flat Blade TerminalsDimensional Characteristics and Specific Requirements
SAE J2223/3 DRAFT-1994 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 3: Multipole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements@ Technical Report
SAE J2223/1 DRAFT-1994 Connections for On-Board Road Vehicle Electrical Wiring Harnesses - Part 1: Single-Pole Connectors - Flat Blade Terminals - Dimensional Characteristics and Specific Requirements@ Technical Report

American Society for Testing and Materials (ASTM), pole piece tem

ASTM D1830-17 Standard Test Method for Thermal Endurance of Flexible Sheet Materials Used for Electrical Insulation by the Curved Electrode Method
ASTM D1830-99 Standard Test Method for Thermal Endurance of Flexible Sheet Materials Used for Electrical Insulation by the Curved Electrode Method
ASTM D1830-99(2005) Standard Test Method for Thermal Endurance of Flexible Sheet Materials Used for Electrical Insulation by the Curved Electrode Method

American National Standards Institute （ANSI), pole piece tem

ANSI/ASTM D1830:1999 Test Method for Thermal Endurance of Flexible Sheet Materials Used for Electrical Insulation by the Curved Electrode Method (10.01)
ANSI/EIA 580AOOO:1991 Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric, Sectional Specification for / Note: Approved 1991-11-07.

Korean Agency for Technology and Standards (KATS), pole piece tem

KS C IEC 60130-5-2003(2008) Connectors for frequencies below 3 MHz(Mc/s)－Part 5：Rectangular multipole connectors with blade contacts
KS C IEC 60130-6-2003(2008) Connectors for frequencies below 3MHz(Mc/s)－Part 6：Rectangular miniature multipole connectors with blade contacts
KS R ISO 8092-3-2003(2018) Road vehicles－Connections for on－board electrical wiring harnesses－ Part 3：Tabs for multi－pole connections－Dimensions and specific requirements
KS C IEC 60748-2-1:2001 Semiconductor integrated circuits－Part 2：Digital integrated circuits Section One：Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
KS C 6384-3101-2013 Fixed capacitors for use in electronic equipment－Part 3：Detail specification：Fixed tantalum chip capacitors for surface mountingwith solid electrolyte and porous anode, style I. Assessment level E

SE-SIS, pole piece tem

SIS SS 06 11 01-1990 Welding electrodes — Wire electrodes and tubular wires for gas metal arc welding and metal arc welding of carbon steel, carbon-manganese alloyed steel, microalloyed steel and low-alloyed steel — Weld metal test specimens for all-weld-metal tests
SIS SS CECC 32200-1988 Sectional specification: Fixed chip capacitors with metallized electrodes andpo/yethy/ene-terephtha/ate dielectric for direct current
SIS SS 06 13 01-1990 Consumables — Wire electrodes and fluxes for submerged-arc welding of carbon steels, carbon-manganese steels, microalloyed steel and low-alloyed steels — Weld metal test specimens for all-weld-metal tests
SIS SS CECC 32201-1988 Blank detail specification: Fixed chip capacitors with metallized electrodes andpo/yethylene-terephtha/ate dielectric for direct current

Danish Standards Foundation, pole piece tem

DS/EN ISO 8092-1:1999 Road vehicles - Connections for on-board electrical wiring harnesses - Del 1: Tabs for single-pole connections - Dimensions and specific requirements
DS/EN ISO 8092-3:2000 Road vehicles - Connections for on-board electrical wiring harnesses - Part 3: Tabs for multi-pole connections - Dimensions and specific requirements
DS/IEC 574-18:1989 Audiovisual, video and television equipment and systems. Part 18: Connectors for automatic slide projectors with built-in-triacs for audiovisual application

YU-JUS, pole piece tem

JUS N.R2.624-1980 Polar tantahim electrolytic capacitors with sintered anode and solid electrolyte without protected-layer - tantahim chip capacitors (type 3A2), 6,3 to 35 V d.c. Climatic severities 55/125/

BE-NBN, pole piece tem

NBN-EN 28092-2-1992

Hebei Provincial Standard of the People's Republic of China, pole piece tem

DB13/T 5026.3-2019 Method for Determination of Physical Properties of Graphene Conductive Paste Part 3: Four-probe Method for Determination of Electrode Resistivity of Paste

PT-IPQ, pole piece tem

NP 2955/6-1985

Lithuanian Standards Office , pole piece tem

LST EN ISO 8092-3:2002 Road vehicles - Connections for on-board electrical wiring harnesses - Part 3: Tabs for multi-pole connections - Dimensions and specific requirements (ISO 8092-3:1996)
LST EN ISO 8092-1:2002 Road vehicles - Connections for on-board electrical wiring harnesses - Part 1: Tabs for single-pole connections - Dimensions and specific requirements (ISO 8092-1:1996)

ECIA - Electronic Components Industry Association, pole piece tem

580A000-1992 Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment

Underwriters Laboratories (UL), pole piece tem

UL 1681 CRD-2013 UL Standard for Safety Wiring Device Configurations - Section / Paragraph Reference: New Figure C3.2 Subject: 2-Pole@ 3-Wire grounding-type@ Attachment Plug Rated 15 A@ 125 V employing polarized neutral blade profile (Edition 4: April 10@ 2012)

PL-PKN, pole piece tem

PN M01002-01-1992 Basic quantities in cutting and grinding. Geometry of the active part of cutting tools. General terms, reference systems, tool and working angles, chip breakers

TH-TISI, pole piece tem

TIS 1903-1999 Fixed capacitors for use in electronic equipment.part 3-101: detail specification: fixed tantalum chip capacitors for surface mounting with solid electrolyte and porous anode, style i. Assessment level e