31.180 印制电路和印制电路板 标准查询与下载
共找到 1625 条与 印制电路和印制电路板 相关的标准，共 109 页
本标准规定了限定燃烧性的薄覆铜箔环氧玻璃布层压板（以下简称薄覆箔板）的技术要求。 本标准适用于厚度不大于0.8mm的薄覆铜箔板（不包括铜箔）。 本标准涉及的薄覆箔板主要用于制造多层印制板，也适用于制造单面或双面印制板。 本标准涉及的薄覆箔板型号为CEPGC-34F。
Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 1990-12-28
- 实施
- 1991-10-01
本标准规定了印制电路用照相底图图形及尺寸系列。 本标准适用于手工贴图制作印制电路照相底图和光绘图制作照相原版。
The patternes series for artwork master of printed circuits
- ICS
- 31.180
- CCS
- L39
- 发布
- 1990-12-08
- 实施
- 1991-10-01
本标准规定了通用的单面、双面和多层印制电路板的外形尺寸系列，但不包括在箱柜中使用的插件式印制电路板的外形尺寸，其带插头和不带插头的印制电路板均以最大外形尺寸计算。
Series for printed boards outside dimension
- ICS
- 31.180
- CCS
- L30
- 发布
- 1988-06-09
- 实施
- 1988-12-01
本标准规定了印制板的外观检验和尺寸检验。 本标准适用于单面、双面和多层印制板。
General examination method for printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 1988-06-07
- 实施
- 1988-10-01
本标准规定了自动、半自动和手工方法绘制印制板零件图及印制板组装件装配图（以下简称印制板装配图）图样的规则。 本标准未规定微型电路、微型组件和类似产品图样的绘制规则。
Printed board drawing
- ICS
- 31.180
- CCS
- L30
- 发布
- 1985-11-01
- 实施
- 1986-05-01
本标准适用于测试印制板上印制导线通过不同电流时的温升，以确定印制导线的载流量。 本方法是一个比较法，用以确定印制导线材料、导线横截面、基材和工艺对印制板的温度——直流电流特性的影响，推荐并规定一个标准试样。
Test method for current carrying capacity of conductors on printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 1984-12-19
- 实施
- 1985-10-01
本标准适用于测量印制板上印制导线间的局部放电。
Test method for partial discharge of conductors on printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 1984-12-19
- 实施
- 1985-10-01
本标准适用于具有或不具有金属化孔的单面或双面印制板、多层印制板的可焊性的测试。
Test method of solderability for printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 1984-07-25
- 实施
1 Scope This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method
- ICS
- 31.180
- CCS
- 发布
- 2024-06-30
- 实施
- 2024-06-30
1 Scope This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA
- ICS
- 31.180
- CCS
- 发布
- 2024-05-31
- 实施
- 2024-05-31
本文件规定了IC基板封装光学检测装置的技术构成、基于主要距离的空域融合主板拼接方法、基于匹配特征融合的SMT贴片元件缺陷检测框架和基于元迁移学习和多尺度融合网络SMT贴装小样本缺陷分割框架要求，提供了缓解遗忘性的图像增量学习分类方法和基于能量分布的未知异常样本检测方法。 本文件适用于工业IC封装基板及SMT贴装图像检测系统的研究、设计、技术路线，可作为IC封装基板和SMT贴装自动光学检测系统设计与研究的技术依据。适用于3C、芯片等泛半导体行业、LED、OLED等新型显示面板行业以及新能源产业电池模组端板、电芯等行业产品工业视觉质检。
Technical specification for image inspection system of IC package substrate
- ICS
- 31.180
- CCS
- C397
- 发布
- 2024-05-16
- 实施
- 2024-05-16
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
- ICS
- 31.180
- CCS
- 发布
- 2024-04-12 (7)
- 实施
- -
BS IEC 62899-402-2 Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
- ICS
- 31.180
- CCS
- 发布
- 2024-04-12
- 实施
- 2024-04-12
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures - Part 3-6. Sectional specification set for unreinforced base materials, clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical…
- ICS
- 31.180
- CCS
- 发布
- 2024-04-10
- 实施
- 2024-04-10
本文件规定了印制板制造用直径0.05 mm及以上硬质合金钻头（以下简称钻头）的要求、通用直径、钻头规格、检验方法、质量保证规定、钻头的包装、标识、运输、贮存和环保要求。 本文件适用于印制板用硬质合金钻头。
Tungsten carbide drills for printed boards
- ICS
- 31.180
- CCS
- C398
- 发布
- 2024-03-28
- 实施
- 2024-04-28
本文件规定了高精度刚性印制电路板的材料、技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于高精度刚性印制电路板（以下简称“电路板”）的生产、检验。
High precision rigid printed circuit board
- ICS
- 31.180
- CCS
- C356
- 发布
- 2024-03-26
- 实施
- 2024-04-01
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
- ICS
- 31.180
- CCS
- 发布
- 2024-03-11
- 实施
- 2024-03-11
Wearable electronic devices and technologies - Performance Measurement of Fitness Wearables. Step Counting
- ICS
- 31.180
- CCS
- 发布
- 2024-01-31
- 实施
- 2024-01-31
本文件规定了柔印渐变印刷用柔性板处理工艺规范的术语和定义、技术要求、工艺流程、检验方法、检验规则、标志、包装、运输和贮存。 本文件适用于柔印渐变印刷用柔性板处理工艺的生产、设计及检验。
Specification for processing process of flexible plates for flexo gradient printing
- ICS
- 31.180
- CCS
- C397
- 发布
- 2023-10-11
- 实施
- 2023-10-26
