31.180 印制电路和印制电路板 标准查询与下载
共找到 1625 条与 印制电路和印制电路板 相关的标准，共 109 页
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC TR 62878-2-2:2015 describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC PAS 61249-8-5:2014(E) defines the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the minimum of test redundancy.
Qualification and performance specification of permanent solder mask and flexible cover materials
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
GSO IEC 61249-2-41:2021 印刷板和其他互连结构的材料 第2-41部分：包覆和未包覆的增强基材 具有规定可燃性的溴化环氧纤维素纸/编织 E 玻璃增强层压板（垂直燃烧测试）、铜...
IEC 61249-2-41:2010 gives requirements for properties of brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 100 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copp...
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61249-4-19:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defi...
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61249-2-42:2010 gives requirements for properties of brominated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-cla...
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC PAS 61249-8-1:2014(E) establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy.
Qualification and performance of electrical insulating compound for printed wiring assemblies
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61249-2-40:2012 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-...
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
GSO IEC 61189-2-719:2021 电气材料、印制板和其他互连结构和组件的测试方法 第2-719部分：互连结构材料的测试方法 相对介电常数和损耗角正切（500 MHz 至 10 GHz）
IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC PAS 62878-2-5:2015(E) defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.
Device embedded substrate - Guidelines - Data format
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
IEC 61249-2-27:2012 gives requirements for properties of bismaleimide/triazine modified with non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning...
- ICS
- 31.180
- CCS
- 发布
- 2021-07-01
- 实施
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021)
- ICS
- 31.180
- CCS
- 发布
- 2021-06-15
- 实施
- 2021-06-15
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021)
- ICS
- 31.180
- CCS
- 发布
- 2021-05-31
- 实施
- 2021-05-31
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021)
- ICS
- 31.180
- CCS
- 发布
- 2021-05-31
- 实施
- 2021-05-31
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for
- ICS
- 31.180
- CCS
- 发布
- 2021-05-31
- 实施
- 2021-05-31
