31.240 电子设备用机械构件 标准查询与下载

EN 60917-2-4:2010 用于电子设备实践的机械结构开发的模块化顺序 第 2-4 部分：分规范 25 mm 设备实践的接口配合尺寸 子架或底盘应用的适配尺寸

IEC 60917-2-4:2010 specifies dimensions for mounting flanges of metric subracks or chassis that are to be mounted into 19 in cabinets or racks. Additional dimensions for subracks or chassis are according to the IEC 60917 series, and for 19 in cabinets or racks to the IEC 60297 series. EMC, seismic climatic and environmental requirements and tests, are defined in the IEC 61587 series.

Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicab

IEC 60297-3-106:2010 电子设备用机械构件.482,6mm(19英寸)系列机械构件的尺寸.第3-106部分:与IEC 60917-2-1标准一致的米制机架或货架可用的支架或底架用适配尺寸

This part of IEC 60297 specifies dimensions for mounting flanges of 19 in subracks or chassis that are to be mounted into metric cabinets or racks. Additional dimensions for subracks or chassis are according to the IEC 60297 series, and for metric cabinets or racks to the IEC 60917 series. EMC, seismic, climatic and environmental requirements and tests, are defined in the IEC 61587 series. The drawings used in this standard are not intended to indicate product design, only the specific dimensions that should be used. The terminology used complies with IEC 60917-1.

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1

IEC 60917-2-4:2010 电子设备用机械结构设计模块化规则.第2-4部分:分规范.25mm设备接口协调尺寸.与IEC 60297-3-100标准一致的机架或货架可用的支架或底架用适配尺寸(19英寸)

This part of IEC 60917 specifies dimensions for mounting flanges of metric subracks or chassis that are to be mounted into 19 in cabinets or racks. Additional dimensions for subracks or chassis are according to the IEC 60917 series, and for 19 in cabinets or racks to the IEC 60297 series. EMC, seismic climatic and environmental requirements and tests, are defined in the IEC 61587 series. The drawings used in this standard are not intended to indicate product design, only the specific dimensions that shall be used. The terminology used complies with IEC 60917-1

Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applica

DD IEC/TS 62610-3:2009 电子设备的机械结构 机柜热管理符合 IEC 60297 和 IEC 60917 系列 设计指南 热电冷却系统的评价方法（珀耳帖效应）

1   Scope and object This part of IEC 62610 provides an evaluation method for thermoelectrical cooling systems (Peltier effect).With this design guide it is possible to calculate the efficiency of the thermoelectrical cooling system (Peltier effect) and its cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency.

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Evaluation method for thermoelectrical cooling systems (Peltier effect)

BS DD IEC/TS 62610-3:2010 电子设备用机械结构.符合IEC 60297及60917系列标准的机壳热量管理.设计指南.热电冷却系统用评估方法(珀尔帖效应)

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide - Evaluation method for thermoelectrical cooling systems (Peltier effect)

IEC 60191-6-19:2010 半导体器件的机械标准化.第6-19部分:在高温及最大允许翘曲下构装翘曲的测量方法

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

DD IEC/TS 62610-1:2009 电子设备的机械结构 机柜热管理符合 IEC 60297 和 IEC 60917 系列 设计指南 热电冷却系统的接口尺寸和配置（珀耳帖效应）

1   Scope This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified: – mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; – mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet; – mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

BS DD IEC/TS 62610-1:2010 电子设备用机械结构.符合IEC 60297及IEC 60917系列标准的机壳热量管理.设计指南.热电冷却系统接口尺寸和规定(珀尔帖效应)

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide - Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

JIS C 5070:2009 表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南

This Standard describes the transportation and storage conditions for surface mounting devices (hereafter referred to as "SMDs")that are fulfilled and used in order to enable trouble-free processing of surface mounting devices, both active and passive.

Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide

IEC TS 62610-3:2009 电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第3部分:设计指南:热电冷却系统的评估方法（珀耳帖效应）

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical coolin

KS C IEC 61760-2-2009(2020) 表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

Surface mounting technology－Part 2：Transportation and storage conditions of surface mounting devices(SMD)－Application guide

KS C IEC 61760-2:2009 表面安装技术.第2部分:表面安装元件(SMD)的运输和存储条件.使用指南

이 표준은 표면실장부품(SMD)의 운송 및 보관조건에 대한 요구사항을 규정하고 있다. SM

Surface mounting technology-Part 2:Transportation and storage conditions of surface mounting devices(SMD)-Application guide

DS/IEC/TS 62610-1:2009 电子设备的机械结构 机柜的热管理符合 IEC 60297 和 IEC 60917 系列 第1部分：设计指南：热电冷却系统的接口尺寸和配置（珀耳帖效应）

This standard provides guidelines for the installation of advanced cooling systems (Peltier- Effect) within cabinets of the IEC 60297 (19”) and IEC 60917 (25mm) series.The cooling performance is in direct relation with mounting location within a cabinet.Three typical mounting locations are defined:Mounting location 1: Cabinet with advanced cooling system inside or outside mounted for the cooling of a whole cabinet.Mounting location 2: Cabinet with advanced cooling system top mounted for the cooling of a wholecabinet.Mounting location 3: Cabinet with inbuilt advanced cooling system in form of a subrack for hot spotcooling.

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

IEC 60917-1:1998+AMD1:2000 CSV 电子设备用机械结构开发的模块化顺序.第1部分:通用标准

Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard

IEC TS 62610-1:2009 电子设备的机械结构.符合IEC 60297和IEC 60917系列的机柜热管理.第1部分:设计指南:热电冷却系统的接口尺寸和规定（珀耳帖效应）

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoel

DIN EN 60297-3-100:2009-09 电气设备的机械结构.482.6 mm(19 in)系列的机械结构尺寸规格.第3-100部分:面板,子架,底盘,架子和柜子的基准尺寸规格(IEC 60297-3-100-2008).德文版本EN 60297-3-100-2009

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008); German version EN 60297-3-100

DIN EN 60297-3-105:2009 电气设备的机械结构.482.6 mm(19 in)系列的机械结构尺寸规格.第3-105部分:1U高底盘的尺寸规格和设计方面(IEC 60297-3-105-2008).德文版本EN 60297-3-105-2009

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008); German version EN 60297-3-105:2009

LST EN 60297-3-100-2009 电子设备的机械结构 482.6 毫米（19 英寸）系列机械结构的尺寸 第 3-100 部分：前面板、子架、底盘、机架和机柜的基本尺寸（IEC 60297-3-100:2008）

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008)

LST EN 60297-3-105-2009 电子设备的机械结构 482.6 毫米（19 英寸）系列机械结构的尺寸 第 3-105 部分：1U 高底盘的尺寸和设计方面（IEC 60297-3-105:2008）

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008)

DS/EN 60297-3-105:2009 电子设备的机械结构 482.6 毫米（19 英寸）系列机械结构的尺寸 第 3-105 部分：1U 高底盘的尺寸和设计方面

This part of IEC 60297 specifies the dimensions for 1U chassis mounted into IEC 60297-3-100 compliant racks/cabinets where dimensions, loaded weight and accessibility require differing assembly methods.Guidance for cooling and reference for EMC, seismic and for the climatic and mechanical requirements and tests are provided, as defined in the IEC 61587 series.The drawings used in this standard are not intended to indicate product design, only the specific dimensions shall be used.The terminology used complies with IEC 60917-1.

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis