31.240 电子设备用机械构件 标准查询与下载



共找到 701 条与 电子设备用机械构件 相关的标准,共 47

本标准规定了高度进制为20mm的插箱面板、插件面板、架和柜的基本尺寸系列,以及插箱面板与架(或柜)间的安装尺寸。 本标准适用于高度进制为20mm的电工电子设备用插箱面板、插件面板、架或柜。

Series of basic dimensions of panels, rack and cabinets for vertical increment of 20mm

ICS
31.240
CCS
K05
发布
1995-01-16
实施
1995-08-01

本标准规定了电子设备机柜的分类与标记,设计和制造的要求、试验方法及检验规则。 本标准适用于雷达、测控、通信、计算机等地面、车载、舰载、机载用各种结构形式的电子设备机柜。

General technical specification for cabinet of electronic equipment

ICS
31.240
CCS
M05
发布
1994-12-28
实施
1995-08-01

本标准规定了多探针测试台(以下简称探针台)的术语、技术要求、试验方法、检验规则、包装贮存等要求。 本标准适用于手动、半自动、全自动多探针测试台。其他类型的探针测试台亦可参照使用。

General specification for probe tester

ICS
31.240
CCS
L97
发布
1994-12-28
实施
1995-08-01

本标准规定了高度进制为44.45mm的面板、机架和机柜的基本尺寸系列。 本标准适用于地面、车载、船载电子设备和核电子仪器等产品。

Series of basic dimensions of panels,racks and enclosures for vertical increment of 44.45mm

ICS
31.240
CCS
L89
发布
1992-10-04
实施
1993-06-01

Blank detail specification for reverse conducting triode thyristors, ambient or case-rated, 5A/5A and above

ICS
31.240
CCS
K46
发布
1991-08-29
实施
1992-05-01

本标准规定了叉指形散热器的型号编制方法、品种规格和技术要求。

Heat sink of semiconductor devices--Heat sink, staggered fingers shapes

ICS
31.240
CCS
L32
发布
1987-03-16
实施
1987-11-01

本标准规定了型材散热器的型号编制方法、品种规格和技术要求。

Heat sink of semiconductor devices--Heat sink, Extruded shapes

ICS
31.240
CCS
L32
发布
1987-03-16
实施
1987-11-01

本标准主要适用于通信设备。分两部分: 高度进制为20mm的条形机架基本尺寸;高度进制为44.45mm的条形机架基本尺寸。

Basic dimensions of narrow frame used for telecommunication equipment

ICS
31.240
CCS
L89
发布
1986-05-27
实施
1987-05-01

本标准规定了电子设备台式机箱的基本尺寸系列。

Series of basic dimensions of cases for electronic equipment

ICS
31.240
CCS
L89
发布
1986-04-04
实施
1987-01-01

本标准规定了安装在符合GB3047.1-82《面板、架和柜的基本尺寸系列》第二部分规定的架、柜中的插箱、插件的基本尺寸。

Series of basic dimensions of subracks and plug-in units for vertical increment of 44.45mm

ICS
31.240
CCS
L89
发布
1986-04-04
实施
1987-01-01

本文件规定了电器柜安装支撑机构的术语和定义、结构及原理、技术要求、试验方法、检验规则、标志、包装、运输及贮存。 本文件适用于电器柜安装支撑机构的生产及检验。

Electrical cabinet installation support mechanism

ICS
31.240
CCS
C389
发布
2024-03-28
实施
2024-04-11

本文件规定了头戴式耳机转动连接结构的技术要求、试验方法、检验规则、标志、包装、运输和贮存。

Technical specifications for the headphone rotation connecting structure

ICS
31.240
CCS
C3990
发布
2024-03-15
实施
2024-03-30

本文件规定了可变换环抱孔径连接构件的术语和定义、构成及原理、技术要求、试验方法、检验规则、标志、包装、运输及贮存。 本文件适用于可变换环抱孔径连接构件的生产及检验。

Changeable surrounding aperture connecting member

ICS
31.240
CCS
C348
发布
2024-03-14
实施
2024-03-29

本文件规定了便于散热鳍片有效清洁除尘的散热结构的术语和定义、技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于便于散热鳍片有效清洁除尘的散热结构的生产和检验。

The heat dissipation structure facilitates effective cleaning and dust removal of the heat dissipation fins.

ICS
31.240
CCS
C356
发布
2024-02-02
实施
2024-02-17

IEC 60917-1:2019 is available as IEC 60917-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60917-1:2019 specifies the relationships between equipment practices and the modular order which are applicable to the main structural dimensions of electronic and electrical equipment mounted in various installations where dimensional interfaces have to be considered for mechanical compatibility. This document also established terms for parts and assemblies of mechanical structures for electrical and electronic equipment, to clarify the specific relations between equipment practices and modular order. This second edition cancels and replaces the first edition published in 1998 and its Amendment 1:2000. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) added information on newly developed detail specification standards of mechanical structures for the electrical and electronic equipment practices; b) added information on newly developed performance test standards for the verifications of environmental performances and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices; c) introduced the relations between the mechanical structure for electrical and electronic system, the verification of environmental performance and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices. Key words: IT Cabinets, Mechanical Structures

Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard

ICS
31.240
CCS
发布
2024-01-31
实施

本文件规定了角度可调摄影机摇臂的设备组成、工作流程、操作要求、基本要求、主要功能以及安装与调试。 本文件适用于角度可调摄影机摇臂的设计与应用。

Angle-adjustable camera crane

ICS
31.240
CCS
C356
发布
2023-12-13
实施
2023-12-28

Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects

ICS
31.240
CCS
发布
2023-11-20
实施

Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects

ICS
31.240
CCS
发布
2023-11-20
实施

本文件规定了半导体设备精密结构组件的基本要求、原材料要求、技术要求、试验方法、检验规则、标志、包装、运输、贮存。

Technical requirements for precision structural components of semiconductor equipment

ICS
31.240
CCS
C397
发布
2023-11-17
实施
2023-11-25

本文件规定了电子设备用液冷板的术语和定义、技术要求、试验方法、检验规则、标志、包装、运输及贮存。 本文件适用于电子设备生产、验收用的液冷板(以下简称“冷板”)。

Liquid cooling plate for electronic equipment

ICS
31.240
CCS
C356
发布
2023-09-26
实施
2023-10-11



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