UNE-EN 60191-6-22:2013
半导体器件的机械标准化 第6-22部分:表面安装半导体器件封装外形图编制的一般规则 半导体封装设计指南 硅细间距球栅阵列和硅
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...