BS EN 60749-19:2003+A1:2010
半导体器件.机械和气候试验方法.模剪切强度
Semiconductor devices. Mechanical and climatic test methods. Die shear strength
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- 标准号
- BS EN 60749-19:2003+A1:2010
- 发布
- 2003年
- 发布单位
- 英国标准学会
- 当前最新
- BS EN 60749-19:2003+A1:2010
- 适用范围
- This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates.