This part of IEC 62899 specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.
IEC 62899-402-1-2017由国际电工委员会 IX-IEC 发布于 2017-03。
IEC 62899-402-1-2017 在中国标准分类中归属于: L30 印制电路,在国际标准分类中归属于: 31.180 印制电路和印制电路板。
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