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Composition of lead-free solder

Composition of lead-free solder, Total:113 items.

In the international standard classification, Composition of lead-free solder involves: Analytical chemistry, Welding, brazing and soldering, Testing of metals, Electronic components in general, Components for aerospace construction, Non-ferrous metals, Company organization and management, Materials for aerospace construction, Aerospace electric equipment and systems, Environmental testing, Electronic component assemblies, Fuels, Iron and steel products.

Korean Agency for Technology and Standards (KATS), Composition of lead-free solder

KS D 2008-2022 Methods for chemical analysis of Pb-free solder(Tin alloys)
KS D 2008-2007 Methods for chemical analysis of Pb-free solder(Tin alloys)
KS D 2008-2007(2017) Methods for chemical analysis of Pb-free solder(Tin alloys)

ES-AENOR, Composition of lead-free solder

UNE 37-403-1986

CZ-CSN, Composition of lead-free solder

CSN 42 0614 Cast.9-1974 Chemical analysis of tin-lead solders. Determination of tin by titration
CSN 42 0614 Cast.1-1974 Chemical analysis of tin-lead solders. General data
CSN 42 0614 Cast.8-1974 Chemical analysis of tin-lead solders. Determination of antimony by titration
CSN 42 0614 Cast.6-1974 Chemical analysis of tin-lead solders. Determination of copper by photometric method
CSN 42 0614 Cast.2-1974 Chemical analysis of tin-lead solders. Determination of aluminium by photometric method
CSN 42 0614 Cast.4-1974 Chemical analysis of tin-lead solders. Determination oí bismuth by photoinetrc method
CSN 42 0614 Cast.10-1974 Chemical analysis of tin-lead solders. Determination of zinc by atomic absorption spectrometry
CSN 42 0614 Cast.5-1974 Chemical analysis of tin-lead solders. Determination of copper by atomic absorption spectrometry
CSN 42 0614 Cast.7-1974 Chemical analysis of tin-lead solders. Determination of iron by atomic absorption spectrometry

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Composition of lead-free solder

GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
GB/T 10574.12-2003 Methods for chemical analysis of tin-lead solders--Determination of sulphur content
GB/T 10574.10-2003 Methods for chemical analysis of tin-lead solders--Determination of cadmium content
GB/T 10574.9-2003 Methods for chemical analysis of tin-lead solders--Determination of aluminum content
GB/T 10574.5-2003 Methods for chemical analysis of tin-lead solders--Determination of arsenic content
GB/T 10574.7-2003 Methods for chemical analysis of tin-lead solders--Determination of silver content
GB/T 10574.8-2003 Methods for chemical analysis of tin-lead solders--Determination of zinc content
GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
GB/T 10574.4-2003 Methods for chemical analysis of tin-lead solders--Determination of iron content
GB/T 10574.6-2003 Methods for chemical analysis of tin-lead solders--Determination of copper content
GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
GB/T 10574.5-2003 Determination of arsenic content by chemical analysis method of tin-lead solder
GB/T 10574.13-2003 Methods for chemical analysis of tin-lead solders-determination of copper,iron cadmium,silver,gold,arsenic,zinc,aluminium,bismuth,phosphorous content

Professional Standard - Electron, Composition of lead-free solder

SJ/T 11392-2009 Lead-free solders-Chemical compositions and forms
SJ/T 11021-1996 Methods of analysis for silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb with spectrochemical method
SJ/T 11019-1996 Methods of analysis for pure silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)

工业和信息化部, Composition of lead-free solder

SJ/T 11392-2019 Chemical composition and morphology of lead-free solder
SJ/T 11698-2018 Lead-free solder chemical analysis method Inductively coupled plasma atomic emission spectrometry
YS/T 746.17-2018 Methods for chemical analysis of lead-free tin-based solders - Part 17: Determination of amounts of silver, copper, lead, bismuth, antimony, iron, arsenic, zinc, aluminum, cadmium, nickel and indium by inductively coupled plasma atomic emission spectromet

RU-GOST R, Composition of lead-free solder

GOST 1429.0-1977 Tin-lead solders. General requirements for methods of analysis
GOST 1429.13-1977 Tin-lead solders. Spectrochemical method for the determination of addition of antimony, copper, bismuth, arsenic, iron, nickel, zinc, aluminium using the synthetic graduated samples

Professional Standard - Non-ferrous Metal, Composition of lead-free solder

YS/T 746.1-2010 Methods for chemical analysis of lead-free tin-based solders- Part 1: Determination of tin content- Pyrogallic acid demasking-lead nitrate titrimetric method
YS/T 746.4-2010 Methods for chemical analysis of lead-free tin-based solders- Part 4: Determination of lead content- Flame atomic absorption spectrometric method
YS/T 746.12-2010 Methods for chemical analysis of lead-free tin-based solders- Part 12: Determination of Indium content- NaEDTA titrimetric method
YS/T 746.8-2010 Methods for chemical analysis of lead-free tin-based slders.Part 8: Determination of arsenic content.Molybdenum antimony arsenate blue spectrometric method
YS/T 746.16-2010 Methods for chemical analysis of lead-free tin-based solders- Part 16: Determination of total rare earth content- Arserazo Ⅲ spectrophotometry
YS/T 746.6-2010 Methods for chemical analysis of lead-free tin-based solders- Part 6: Determination of antimony content- Flame atomic absorption spectrometric method
YS/T 746.7-2010 Methods for chemical analysis of lead-free tin-based solders- Part 7: Determination of iron content- Flame atomic absorption spectrometric method
YS/T 746.10-2010 Methods for chemical analysis of lead-free tin-based solders- Part 10: Determination of aluminum content- Electrothermal atomic absorption spectrometric method
YS/T 746.11-2010 Methods for chemical analysis of lead-free tin-based solders- Part 11: Determination of Cadmium content- Flame atomic absorption spectrometric method
YS/T 746.13-2010 Methods for chemical analysis of tin-based lead-free solders- Part 13: Determination of nickel content- Flame atomic absorption spectrometric method
YS/T 746.15-2010 Methods for chemical analysis of lead-free tin-based solders- Part 15: Determination of Germanium content- Salicylfluorone-sim polyethylene glycol phenyl ether spectrophotometry
YS/T 746.14-2010 Methods for chemical analysis of lead-free tin-based solders- Part 14: Determination of phosphorus content- Crystal violet phosphorus-vanadium-molybdenum heteropoly acid spectrophotometry
YS/T 746.9-2010 Methods for chemical analysis of lead-free tin-based solders- Part 9: Determination of zinc content- Flame atomic absorption spectrometric method and NaEDTA titrimetric method
YS/T 746.2-2010 Methods for chemical analysis of tin-based lead-free solders- Part 2: Determination of silver content- Flame atomic absorption spectrometric method and potassium thiosulfate titrimetric method
YS/T 746.3-2010 Methods for chemical analysis of tin-based lead-free solders- Part 3: Determination of copper content- Flame atomic absorption spectrometric method and sodium thiosulfate titrimetric method
YS/T 746.5-2010 Methods for chemical analysis of lead-free tin-based solders.Part 5 Determination of bismuth content.Flame atomic absorption spectrometric method and EDTA titrimetric method

KR-KS, Composition of lead-free solder

KS D 8546-2018(2023) Lead free soft solder alloys — Chemical compositions and forms

UNKNOWN, Composition of lead-free solder

GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content
GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content

未注明发布机构, Composition of lead-free solder

BS 3338-4:1961(2011) Method for The determination of copper in ingot tin and tin - lead solders (photometric method) — Methods for the sampling and analysis oftin and tin alloys
BS 3338-8:1961(2011) Method for The determination of bismuth in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
BS 3338-10:1961(2011) Method for The determination of iron in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys

International Electrotechnical Commission (IEC), Composition of lead-free solder

IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IEC 107/108/PAS:2009 Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems
IEC TS 62647-21:2013 IEC/TS 62647-21: Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
IEC PAS 62647-2:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IEC 107/160/DTS:2011 IEC/TS 62647-2, Ed. 1: Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
IEC TS 62647-4:2018 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

British Standards Institution (BSI), Composition of lead-free solder

BS 3338-4:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)
PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Mitigation of deleterious effects of tin

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Composition of lead-free solder

GB/T 10574.14-2017 Methods for chemical analysis of tin-lead solders—Part 14：Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry
GB/T 10574.9-2017 Methods for chemical analysis of tin-lead solders—Part 9：Determination of aluminium content—Graphite furnace atomic absorption spectrometric method
GB/T 10574.8-2017 Methods for chemical analysis of tin-lead solders—Part 8：Determination of zinc content—Flame atomic absorption spectrometric method
GB/T 10574.12-2017 Methods for chemical analysis of tin-lead solders—Part 12：Determination of sulfur content—High frequency combustion with infrared absorption method
GB/T 10574.11-2017 Methods for chemical analysis of tin-lead solders—Part 11：Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry
GB/T 10574.10-2017 Methods for chemical analysis of tin-lead solders—Part 10：Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method
GB/T 10574.7-2017 Methods for chemical analysis of tin-lead solders—Part 7：Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titration

IT-UNI, Composition of lead-free solder

Japanese Industrial Standards Committee (JISC), Composition of lead-free solder

JIS Z 3198-6:2003 Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead
JIS C 0099:2005 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
JIS Z 3198-3:2003 Test methods for lead-free solders -- Part 3: Methods for spread test
JIS Z 3198-5:2003 Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints
JIS Z 3198-7:2003 Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components
JIS Z 3198-1:2003 Test methods for lead-free solders -- Part 1: Methods for measuring of melting temperature ranges
JIS Z 3198-1:2014 Test methods for lead-free solders.Part 1: Methods for measuring of melting temperature ranges
JIS Z 3198-2:2003 Test methods for lead-free solders -- Part 2: Methods for testing of mechanical characteristics-tensile test
JIS Z 3198-4:2003 Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method

German Institute for Standardization, Composition of lead-free solder

DIN IEC/TS 62647-2:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
DIN IEC/TS 62647-2:2013-09*DIN SPEC 42647-2:2013-09 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
DIN IEC/TS 62647-3:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes (IEC 107/213/DTS:2013)
DIN IEC/TS 62647-1:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)
DIN IEC/TS 62647-1:2013-07*DIN SPEC 42647-1:2013-07 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)

国家市场监督管理总局、中国国家标准化管理委员会, Composition of lead-free solder

GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2：Mitigation of deleterious effects of tin

Canadian General Standards Board （CGSB), Composition of lead-free solder

CGSB 1-GP-71 METH 50.29-1980 Methodes D'Essai Des Peintures Et Pigments Analyse Pigmentaire Teneur Totale En Zinc Des Revetements Mineraux A Base De Zinc

American Society for Testing and Materials (ASTM), Composition of lead-free solder

ASTM D6227-18 Standard Specification for Unleaded Aviation Gasoline Containing a Non-hydrocarbon Component
ASTM A309-01(2012) Standard Test Method for Weight and Composition of Coating on Terne Sheet by the Triple-Spot Test
ASTM D7960-16 Standard Specification for Unleaded Aviation Gasoline Test Fuel Containing a Non-hydrocarbon Component
ASTM D6227-18(2023) Standard Specification for Unleaded Aviation Gasoline Containing a Non-hydrocarbon Component

IEC - International Electrotechnical Commission, Composition of lead-free solder

TS 62647-2-2012 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin (Edition 1.0)
PAS 62647-2-2011 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin (Edition 1.0)
PAS 62647-1-2011 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Lead-free management (Edition 1.0)
TS 62647-3-2014 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead-free solder and finishes (Edition 1.0)
PAS 62647-3-2011 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead-free solder and finishes (Edition 1.0)
TS 62647-1-2012 Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan (Edition 1.0)

American National Standards Institute （ANSI), Composition of lead-free solder

ANSI/ASTM D7960:2021 Standard Specification for Unleaded Aviation Gasoline Test Fuel Containing Non-hydrocarbon Components