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Lead-Free Solder Composition

Lead-Free Solder Composition, Total:91 items.

In the international standard classification, Lead-Free Solder Composition involves: Non-ferrous metals, Analytical chemistry, Welding, brazing and soldering, Testing of metals, Products of non-ferrous metals, Electronic components in general, Components for aerospace construction, Company organization and management, Materials for aerospace construction, Aerospace electric equipment and systems, Environmental testing, Electronic component assemblies.

Group Standards of the People's Republic of China, Lead-Free Solder Composition

T/ZZB 2541-2021 Lead-free solder paste
T/CNIA 0081-2021 Green design product evaluation technical specification for lead-free tin-based solder

Professional Standard - Non-ferrous Metal, Lead-Free Solder Composition

YS/T 747-2010 Lead-free tin-based solder
YS/T 746.1-2010 Methods for chemical analysis of lead-free tin-based solders- Part 1: Determination of tin content- Pyrogallic acid demasking-lead nitrate titrimetric method
YS/T 746.4-2010 Methods for chemical analysis of lead-free tin-based solders- Part 4: Determination of lead content- Flame atomic absorption spectrometric method
YS/T 746.12-2010 Methods for chemical analysis of lead-free tin-based solders- Part 12: Determination of Indium content- NaEDTA titrimetric method
YS/T 746.8-2010 Methods for chemical analysis of lead-free tin-based slders.Part 8: Determination of arsenic content.Molybdenum antimony arsenate blue spectrometric method
YS/T 746.16-2010 Methods for chemical analysis of lead-free tin-based solders- Part 16: Determination of total rare earth content- Arserazo Ⅲ spectrophotometry
YS/T 746.6-2010 Methods for chemical analysis of lead-free tin-based solders- Part 6: Determination of antimony content- Flame atomic absorption spectrometric method
YS/T 746.7-2010 Methods for chemical analysis of lead-free tin-based solders- Part 7: Determination of iron content- Flame atomic absorption spectrometric method
YS/T 746.10-2010 Methods for chemical analysis of lead-free tin-based solders- Part 10: Determination of aluminum content- Electrothermal atomic absorption spectrometric method
YS/T 746.11-2010 Methods for chemical analysis of lead-free tin-based solders- Part 11: Determination of Cadmium content- Flame atomic absorption spectrometric method
YS/T 746.13-2010 Methods for chemical analysis of tin-based lead-free solders- Part 13: Determination of nickel content- Flame atomic absorption spectrometric method
YS/T 746.15-2010 Methods for chemical analysis of lead-free tin-based solders- Part 15: Determination of Germanium content- Salicylfluorone-sim polyethylene glycol phenyl ether spectrophotometry
YS/T 746.14-2010 Methods for chemical analysis of lead-free tin-based solders- Part 14: Determination of phosphorus content- Crystal violet phosphorus-vanadium-molybdenum heteropoly acid spectrophotometry
YS/T 746.9-2010 Methods for chemical analysis of lead-free tin-based solders- Part 9: Determination of zinc content- Flame atomic absorption spectrometric method and NaEDTA titrimetric method

GM North America, Lead-Free Solder Composition

GM 9981999-2002 Premixed Lead Free Tinning Solder (Issue 7; Do Not Use on New Programs; No Replacement)

Korean Agency for Technology and Standards (KATS), Lead-Free Solder Composition

KS D 2008-2022 Methods for chemical analysis of Pb-free solder(Tin alloys)
KS D 2008-2007 Methods for chemical analysis of Pb-free solder(Tin alloys)
KS D 2008-2007(2017) Methods for chemical analysis of Pb-free solder(Tin alloys)
KS D 8546-2008 Lead free soft solder alloys－Chemical compositions and forms

Professional Standard - Electron, Lead-Free Solder Composition

SJ/T 11392-2009 Lead-free solders-Chemical compositions and forms

工业和信息化部, Lead-Free Solder Composition

SJ/T 11392-2019 Chemical composition and morphology of lead-free solder
SJ/T 11698-2018 Lead-free solder chemical analysis method Inductively coupled plasma atomic emission spectrometry
YS/T 746.17-2018 Methods for chemical analysis of lead-free tin-based solders - Part 17: Determination of amounts of silver, copper, lead, bismuth, antimony, iron, arsenic, zinc, aluminum, cadmium, nickel and indium by inductively coupled plasma atomic emission spectromet

Professional Standard - Machinery, Lead-Free Solder Composition

JB/T 50194-1999 Quality classification of tin-lead solder products

ES-AENOR, Lead-Free Solder Composition

UNE 37-403-1986

CZ-CSN, Lead-Free Solder Composition

CSN 42 0614 Cast.9-1974 Chemical analysis of tin-lead solders. Determination of tin by titration
CSN 42 0614 Cast.1-1974 Chemical analysis of tin-lead solders. General data
CSN 42 0614 Cast.8-1974 Chemical analysis of tin-lead solders. Determination of antimony by titration
CSN 42 0614 Cast.6-1974 Chemical analysis of tin-lead solders. Determination of copper by photometric method
CSN 42 0614 Cast.2-1974 Chemical analysis of tin-lead solders. Determination of aluminium by photometric method
CSN 42 0614 Cast.4-1974 Chemical analysis of tin-lead solders. Determination oí bismuth by photoinetrc method
CSN 42 0614 Cast.10-1974 Chemical analysis of tin-lead solders. Determination of zinc by atomic absorption spectrometry
CSN 42 0614 Cast.5-1974 Chemical analysis of tin-lead solders. Determination of copper by atomic absorption spectrometry
CSN 42 0614 Cast.7-1974 Chemical analysis of tin-lead solders. Determination of iron by atomic absorption spectrometry

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Lead-Free Solder Composition

GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
GB/T 10574.1-1989 Tin-lead solders--Determination of tin content--Potassium iodate titrimetric method
GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
GB/T 10574.12-2003 Methods for chemical analysis of tin-lead solders--Determination of sulphur content
GB/T 10574.10-2003 Methods for chemical analysis of tin-lead solders--Determination of cadmium content
GB/T 10574.9-2003 Methods for chemical analysis of tin-lead solders--Determination of aluminum content
GB/T 10574.5-2003 Methods for chemical analysis of tin-lead solders--Determination of arsenic content
GB/T 10574.7-2003 Methods for chemical analysis of tin-lead solders--Determination of silver content
GB/T 10574.8-2003 Methods for chemical analysis of tin-lead solders--Determination of zinc content
GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
GB/T 10574.4-2003 Methods for chemical analysis of tin-lead solders--Determination of iron content
GB/T 10574.6-2003 Methods for chemical analysis of tin-lead solders--Determination of copper content
GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
GB/T 10574.5-2003 Determination of arsenic content by chemical analysis method of tin-lead solder
GB/T 10574.9-1989 Tin-lead solders--Determination of silver content--Potentiometric titrimetric method
GB/T 10574.4-1989 Tin-lead solders--Determination of bismuth content--Thiourea spectrophotometric method
GB/T 10574.3-1989 Tin-lead solders--Determination of antimony content--Potassium bromete titrimetric method
GB/T 10574.2-1989 Tin-lead solders--Determination of antimony content--Malachite green spectrophotometric method
GB/T 10574.12-1989 Tin-lead solders--Determination of cadmium content--Catalytic oscillopolarographic method
GB/T 10574.14-1989 Tin-lead solders--Determination of sulphur content--Oscillopolarographic method after distillation
GB/T 10574.6-1989 Tin-lead solders--Determination of arsenic content--Molybdoantimony arsenate blue spectrophotometric method
GB/T 10574.5-1989 Tin-lead solders--Determination of iron content--1,10-phenanthroline spectrophotometric method
GB/T 10574.10-1989 Tin-lead solders--Determination of zinc content--Flame atomic absorption spectrophotometric method
GB/T 10574.8-1989 Tin-lead solders--Determination of silver content--Flame atomic absorption spectrophotometric method
GB/T 10574.13-2003 Methods for chemical analysis of tin-lead solders-determination of copper,iron cadmium,silver,gold,arsenic,zinc,aluminium,bismuth,phosphorous content
GB/T 10574.13-1989 Tin-lead solders--Determination of phosphorus content--Phosphor-vanadium-molybdium poly acid-crystal violet spectrophotometric method
GB/T 10574.7-1989 Tin-lead solders--Determination of copper content--2,9-dimethyl-1,10-phenanthroline spetrophotometric method

KR-KS, Lead-Free Solder Composition

KS D 8546-2018(2023) Lead free soft solder alloys — Chemical compositions and forms

RU-GOST R, Lead-Free Solder Composition

GOST 1429.0-1977 Tin-lead solders. General requirements for methods of analysis

UNKNOWN, Lead-Free Solder Composition

GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content
GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content

未注明发布机构, Lead-Free Solder Composition

BS 3338-4:1961(2011) Method for The determination of copper in ingot tin and tin - lead solders (photometric method) — Methods for the sampling and analysis oftin and tin alloys
BS 3338-8:1961(2011) Method for The determination of bismuth in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
BS 3338-10:1961(2011) Method for The determination of iron in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys

International Electrotechnical Commission (IEC), Lead-Free Solder Composition

IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

IPC - Association Connecting Electronics Industries, Lead-Free Solder Composition

IPC SPVC-WP-006-2003 ROUND ROBIN TESTING AND ANALYSIS LEAD-FREE ALLOYS TIN@ SILVER and COPPER

British Standards Institution (BSI), Lead-Free Solder Composition

BS 3338-4:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)
BS 3338-5:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of lead in ingot tin and tin-antimony solders (photometric method)
BS 3338-8:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of bismuth in ingot tin, tin-lead solders and white metal bearing alloys (photometric method)
BS 3338-10:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of iron in ingot tin, tin-lead solders and white metal bearing alloys (photometric method)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Lead-Free Solder Composition

GB/T 10574.14-2017 Methods for chemical analysis of tin-lead solders—Part 14：Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry
GB/T 10574.9-2017 Methods for chemical analysis of tin-lead solders—Part 9：Determination of aluminium content—Graphite furnace atomic absorption spectrometric method
GB/T 10574.8-2017 Methods for chemical analysis of tin-lead solders—Part 8：Determination of zinc content—Flame atomic absorption spectrometric method

IT-UNI, Lead-Free Solder Composition

Japanese Industrial Standards Committee (JISC), Lead-Free Solder Composition

JIS Z 3198-6:2003 Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead
JIS C 0099:2005 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste

BE-NBN, Lead-Free Solder Composition

NBN-EN 29453-1994 Soft solder alloys. Chemical compositions and forms (ISO 9453: 1990)

German Institute for Standardization, Lead-Free Solder Composition

DIN IEC/TS 62647-2:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)

国家市场监督管理总局、中国国家标准化管理委员会, Lead-Free Solder Composition

GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2：Mitigation of deleterious effects of tin

CH-SNV, Lead-Free Solder Composition

SN 132 151-1984 Process plant Installation devicesSafety valve PN 16, spring-loaded, with bellowsset pressure 1,9 up to 10 bar

Canadian General Standards Board （CGSB), Lead-Free Solder Composition

CGSB 1-GP-71 METH 50.29-1980 Methodes D'Essai Des Peintures Et Pigments Analyse Pigmentaire Teneur Totale En Zinc Des Revetements Mineraux A Base De Zinc