共找到 1168 条与 环境条件与通用试验方法 相关的标准,共 78 页
Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests (IEC 60068-2-75:2014); German version EN 60068-2-75:2014
Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method (IEC 60068-2-65:2013); German version EN 60068-2-65:2013
Detection method of residual dust on urban road pavement
Packaging — Complete, filled transport packages — Rolling test
本标准规定了评估核查标准(CS)材料的一次检测结果与其标准值(ARV)之间的差异,并确定相应可接受的公差区间,估算单一测试结果落在公差区间外概率的方法。 本标准适用于产生连续性数值结果的实验室测试方法有无偏倚的判定,不适用于在现场精密度或重复性条件下,通过同一个CS材料来获得多个测试结果的评估。
Standard practice for laboratory bias evaluation using single test result from standard material
Environmental testing - Part 2-75 : tests - Test Eh : hammer tests
本标准规定了电镀工艺和飞机用化学品导致机械氢脆的评估试验方法。本标准适用于电镀工艺和飞机用化学品导致机械氢脆的评估试验。
Standard test method for mechanical hydrogen embrittlement evaluation of plating processes and service environments
Classification of environmental conditions -- Part 2-9: Environmental conditions appearing in nature -- Measured shock and vibration data -- Storage, transportation and in-use
Environmental testing -- Part 2-78: Tests -- Test Cab: Damp heat, steady state
Environmental testing — Part 2-6: Tests — Test Fc: Vibration(sinusoidal)
This part of IEC 60068 outlines test Td@ applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys@ which are eutectic or near eutectic tin lead (Pb)@ or lead-free alloys. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering@ to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition@ test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB)@ see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
本标准适用于下列四类试验,对于不属于以上四类的试验,若其部分内容在本标准中做了规定,则这部分内容应符合本标准的要求: --作物及林、草蒸发蒸腾量观测试验; --作物及林、草灌溉制度试验; --作物劣态试验和灌溉效益试验; --灌水方法及灌水技术试验。
Specifications for irrigation experiment
Sensory analysis. General guidance for the staff of a sensory evaluation laboratory. Part 1. Staff responsibilities
Sensory analysis. General guidance for the staff of a sensory evaluation laboratory. Part 2. Recruiting and training of panel leaders
Organoleptic analysis. Methodology. General guidance for establishing an organoleptic profile
Sensory analysis. General guidelines for the selection, training and monitoring of selected assessors and expert sensory assessors
Organoleptic analysis. Methodology. Duo-trio test
Sensory analysis. Methodology. Sequential analysis
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