L10 电子元件综合 标准查询与下载

IEC 61193-2:2007 质量评估系统.第2部分:电子元件和包装件检验用抽样检验方法的选择和使用

This part of IEC 61193 applies to the inspection of electronic components, packages, and also modules (referred to as “products” in this standard) for use in electronic and electric equipment. It specifies sampling plans for inspection by attributes on the assumption that the acceptance number is zero (Ac = 0), including criteria for sample selection and procedures. The zero acceptance number sampling plans provided by this standard apply to the inspection of products, that are manufactured under suitable process control with the target of a “zerodefect” quality level before sampling inspection. In addition, this standard provides a method for the calculation of the expected value of the statistical verified quality limit (SVQL) at a confidence level of 60 %. Amongst other things, this method can be used to verify the effectiveness of the supplier’s process control. NOTE In this standard the term “module” is used for products which are modules according to the definition in IEC 60194.

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

BS EN 61760-2:2007 表面安装技术.表面安装设备(SMD)的运输和存储条件.使用指南

Surface mounting technology - Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 62137-1-2:2007 表面安装技术.表面装配焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验

This test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which put test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminates and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

DLA MIL-HDBK-660 A VALID NOTICE 2-2007 硬式波导装置制作(弯头和扭转)

MIL-HDBK-660A, dated 05 September 2002, has been reviewed and determined to be valid for use in acquisition.

FABRICATION OF RIGID WAVEGUIDE ASSEMBLIES (SWEEP BENDS AND TWISTS)

DLA SMD-5962-92144 REV M-2007 直流-直流转换器,双沟道12瓦特直线式混合微处理器

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

MICROCIRCUIT, HYBRID, LINEAR, 12 VOLT, DUAL CHANNEL, DC/DC CONVERTER

DIN EN 60062 Berichtigung 1:2007 电阻器和电容器的标记代码.DIN EN 60062-2005技术勘误

Marking codes for resistors and capacitors (IEC 60062:2004, modified); German version EN 60062:2005, Corrigenda to DIN EN 60062:2005-11; German version CENELEC-Cor. :2007 to EN 60062:2005

UL 991 CRD-2007 使用固态设备的安全相关控制的 UL 安全测试标准 章节/段落参考：第 18 节（第 3 版：2004年10月22日）

UL Standard for Safety Tests for Safety-Related Controls Employing Solid-State Devices - Section/Paragraph Reference: Section 18 (Edition 3: October 22, 2004)

JIS R 1660-3 ERRATUM 1:2007 勘误表

ERRATUM

NAVY QPL-19803-21 NOTICE 3-2007 CGU-24A/A型10升型液态氧转换器

QPL-19803-21, which identified products qualified under the requirements specified in MIL-DTL-19803, has been transformed to an equivalent qualification data set (QDS).

Converter, Liquid Oxygen, 10-Liter, CGU-24A/A

IEC 61760-2:2007 表面安装技术.第2部分:表面安装器件(SMD)的运输和存储条件.使用指南

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 61190-1-3:2007 电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求

This part of IEC61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

DLA DSCC-DWG-07016-2007 低顺磁共振的,韦伯分级的钽晶片固定电容器

This drawing and MIL-PRF-55365 describe the complete requirements for low ESR tantalum chip capacitors.

CAPACITOR, FIXED, TANTALUM CHIP, WEIBULL GRADED, LOW ESR

DLA DSCC-DWG-02002 REV B-2007 芯片是钽材料的固定电容器

Dimensions are in inches.

CAPACITORS, FIXED, TANTALUM, CHIP

DIN V VDE V 0884-10 Berichtigung 1:2007 半导体器件.安全绝缘用磁性电容耦合器.对DIN V VDE V 0884-10的技术勘误

Semiconductor devices - Magnetic and capacitive couplers for safe isolatio; Corrigenda to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

DLA DSCC-DWG-02006 REV B-2007 钽芯片固定电容器

This drawing and MIL-PRF-55365 describes the requirements for tantalum chip capacitors.

CAPACITORS, FIXED, TANTALUM, CHIP

ECA SP 5126-2007 电子连接器和插座偏振/编码键压力过重的测试程序.发表为ANSI/EIA/ECA-364-86

Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets To be published as ANSI/EIA/ECA-364-86

Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets To be published as ANSI/EIA/ECA-364-86

NAVY QPL-19803-21 REINST NOTICE 2-2007 GCU-24A/A型10升型液态氧转换器

Military Specification MIL-C-19803F, which covered the products listed thereon has been revised to reflect this QPL reinstatement.

CONVERTER, LIQUID OXYGEN, 10-LITER GCU-24A/A

IPC 9151B-2007 印制电路板制程能力,质量和可靠性相对(PCQR2)基准测试标准和数据库

The purpose of this document is to define the Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database Program used for the evaluation of Printed Circuit Board (PCB) manufacturing processes. This is in accordance with The National Technology Roadmap for Electronic Interconnections 2000/2001 published by IPC, which states that ‘‘For a company to efficiently manage its supply chain it must identify the capability of its suppliers and make certain that their capability for manufacturing a product is consistent with the needs of the customer.’’

Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database

IEC 61300-2-22:2007 纤维光学互联器件和无源元件.基本试验和测量程序.第2-22部分:试验.温度变化

This part of IEC 61300 describes a procedure to determine the suitablity of a fibre optic device to withstand the effects of a change of temperture or a succession of changes of temperature.

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-22: Tests - Change of temperature

DLA MIL-PRF-15733 H (3)-2007 射频干扰滤光片和电容器 常规

This specification covers the general requirements for low-pass filters and capacitors used to suppress radio frequency/electromagnetic interference. Filters furnished to the requirements of this specification contain shunting capacitors and series inductors (FSC 5915). Capacitors furnished to the requirements of this specification contain shunting capacitors (FSC 5910). For the purposes of this specification, feed-thru capacitor types (C circuit configuration) are referred to herein as a filter. Passband power may be alternating current (ac)and/or direct current (dc) and the filter is used primarily in the reduction of broadband radio frequency interference.

FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR