L30 印制电路 标准查询与下载

DIN EN 61188-7:2009 印刷版和印刷版总成.设计和使用.第7部分:CAD图书馆结构的电子元器件零方向(IEC 61188-7:2009),德文版本 EN 61188-7:2009

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009

BS EN 61249-4-15:2009 印制板和其它互连结构用材料.非包覆预浸料的分规范集(用于多层板产品).阻燃型多功能环氧编织E型玻璃纤维预浸料坯

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burn

BS EN 61249-4-14:2009 印制板和其它互连结构用材料.非包覆预浸料的分规范集(用于多层板产品).指明易燃的环氧编织E型玻璃纤维预浸料

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead

BS EN 61249-4-16:2009 印制板和其它互连结构用材料.非包被预浸处理材料分规范集(多层板的生产).阻燃型(垂直燃烧试验)多功能非卤化编织E.玻璃环氧预浸料坯

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammabilit

BS EN 61249-4-17:2009 印制板和其它互连结构用材料.无铅装配用规定了燃烧性的无卤环氧化物编织E玻璃纤维预浸料(垂直燃烧法)

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burn

IEC 91/893A/PAS:2009 IEC/TS 62326-14设备嵌入式基板术语/可靠性/设计指南

IEC/PAS 62326-14: Device embedded substrate - Terminology/Reliability/Design guide

BS EN 61188-7:2009 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

IEC 62496-3-1:2009 光学电路板.第3-1部分:性能标准.利用未连接光学玻璃纤维的柔性光学电路板

This part of IEC 62496 defines the performance of flexible optical circuit boards (FOCBs) using unconnectorized optical glass fibres for controlled environment. This standard clarifies the requirements for quality classification of the flexible OCBs incorporating optical glass fibres.

Optical circuit boards - Part 3-1: Performance standard - Flexible optical circuit boards using unconnectorized optical glass fibres

BS EN 62496-1:2009 光学电路板.第1部分:总则

IEC 62496-1 applies to optical circuit boards possessing all of the following general features: – transmit patterns with straight, cross, bending optical paths and input and output optical ports in plane; – optical paths consisting of optical fibres and/or optical waveguides; – controlled lengths of the optical paths, if required; – may be combined with a printed electric circuit board, the functionality of which is outside the scope of this standard; – functions to interconnect between optical components and the ability to mount components. The purpose of this standard is to specify optical circuit board requirements as they relate to − classification, − IEC standard system, − documentation, − materials, − workmanship, − performance, − identification − packaging.

Optical circuit boards - Part 1:General

DIN EN 61249-2-36:2009 印制板和其他互连结构用材料.第2-36部分:包层和非包层增强基材.无铅装配用规定可燃性的铜包改性非卤化环氧化物编织的E玻璃层压板(IEC 61249-2-36-2008).德文版本EN 61249-2-36-2009

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 6124

DIN EN 61249-2-37:2009 印制板和其他互连结构用材料.第2-37部分:包层和非包层增强基材.无铅装配用阻燃型铜包改性非卤化环氧化物编织的E玻璃层压板(垂直燃烧试验).德文版本EN 61249-2-37-2009

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lea

DIN EN 61249-2-38:2009 印制板和其他互连结构用材料.第2-38部分:包层和非包层增强基材.无铅装配用阻燃型铜包非卤化环氧化物编织的E玻璃层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free as

DIN EN 61249-2-35:2009 印制板和其他互连结构用材料.第2-35部分:包层和非包层增强基材.无铅装配用规定可燃性(垂直燃烧试验)的铜包改性非卤化环氧化物编织的E玻璃层压板(IEC 61249-2-35-2008).德文版本EN 61249-2-35-2009

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

BS EN 61249-2-38:2009 印制板和其他互连结构用材料.包层和非包层增强基材.无铅装配用规定可燃性的铜包改性非卤化环氧化物编织的E玻璃层压板(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of di-functional non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

BS EN 61249-2-36:2009 印制板和其他互连结构用材料.包层和非包层增强基材.无铅装配用规定可燃性的铜包改性非卤化环氧化物编织的E玻璃层压板(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of di-functional brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

GJB 362B-2009 刚性印制板通用规范

本规范规定了刚性印制板产品的技术要求和质量保证规定。 本规范适用于有或无镀覆孔的刚性单面、双面和双层和多层印刷制板产品。

General specification for rigid PCB

IEC 61249-4-16:2009 印制板和其他互连结构用材料.第4-16部分:非包被预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined

IEC 61249-4-14:2009 印制板和其他互连结构用材料.第4-14部分:非包被预浸料(多层板结构)的分规范集.指定易燃性的无铅化环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning t

IEC 61249-4-15:2009 印制板和其他互连结构用材料.第4-15部分:非包被预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (ve

IEC 61188-7:2009 印制板和印制板组件.设计和使用.第7部分:用于CAD文库构建的电子元件零方向

This part of IEC 61188 establishes a consistent technique for the description of electronic component orientation@ and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners.

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction