L30 印制电路 标准查询与下载

IEC 62496-2-1:2011 光学电路板.第2-1部分:测量.光纤衰减和隔离

IEC 62496-2-1 describes the various methods to measure the optical attenuation and isolation of optical circuit boards (OCBs).

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation

DB34/T 1437-2011 高密度印制电路板

本标准适用于高密度印制电路板。

High Density Printed Circuit Board

DB34/T 1439-2011 刚性及多层印制板用基材

本标准适用于刚性及多层印制板用基材。

Base Materials for Rigid and Multilayer Printed Boards

NF C93-930-2-2*NF EN 62496-2-2:2011 光电路板.第2-2部分:测量.光学电路板的尺寸.

Optical circuit boards - Part 2-2 : measurements - Dimensions of optical circuit boards.

BS EN 62496-4:2011 光电路板.接口标准.综述和指南

This part of IEC 62496 covers general information on the subject of Optical Circuit Board (OCB) interfaces. It includes normative references, definitions and rules for creating and interpreting the standard drawings.

Optical circuit boards. Interface standards. General and guidance

IEC 62496-2-2:2011 光学电路板.第2-2部分:测量.光学电路板的尺寸规格

This part of IEC 62496 specifies the measurement procedures for dimensions related to interface information of optical circuit boards (OCB), defined in IEC 62496-4.

Optical circuit boards - Part 2-2: Measurements - Dimensions of optical circuit boards

DIN EN 61191-6:2011 印制板组装.第6部分:BGA与LGA焊接接头中空隙的评定准则和测量方法(IEC 61191-6-2010);德文版本EN 61191-6-2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010

DIN EN 62496-3-1:2011 光学电路板.性能标准.第3-1部分:采用无连接器光学玻璃纤维的挠性光学电路板(IEC 62496-3-1-2009);德文版本EN 62496-3-1-2010

Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (IEC 62496-3-1:2009); German version EN 62496-3-1:2010

IEC 62496-3:2011 光学电路板.第3部分:性能标准.总则和指南

This part of IEC 62496 covers general information on optical circuit board performance standards. It defines those tests and severities which form the performance categories or general operating service environments and identifies those tests which are considered to be product-specific. Test and severity details are given in Annex A. IEC 62496-3 provides references, definitions and rules for creating optical circuit board performance standards, as well as related information pertinent to the subject. Subsequent parts of the IEC 62496-3 series are sequentially numbered and contain performance criteria for specific applications. Each part will be added as the performance criteria become standardized for international use.

Optical circuit boards - Part 3: Performance standards - General and guidance

IEC 62496-4:2011 光学电路板.第4部分:接口标准.一般和指南

This part of IEC 62496 covers general information on the subject of Optical Circuit Board (OCB) interfaces. It includes normative references, definitions and rules for creating and interpreting the standard drawings.

Optical circuit boards - Part 4: Interface standards - General and guidance

DIN EN 61249-2-42:2010 印制板和其它互连结构用材料.第2-42部分:包被和非包被增强基材.限定燃烧性(垂直燃烧试验)的覆铜溴化环氧非织物/织物E型玻璃增强层压板

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad

DIN EN 61249-2-41:2010 印制板和其它互连结构用材料.第2-41部分:包被和非包被增强基材.限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素纸/织物E型玻璃增强层压板

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-

BS DD IEC/PAS 62326-14:2010 印刷电路板.设备嵌入式基底.术语/可靠性/设计指南

Printed boards. Device embedded substrate. Terminology / reliability / design guide

UL 796F-2010 柔性材料互连结构

UL Standard for Safety Flexible Materials Interconnect Constructions (Second Edition; Reprint with Revisions Through and Including November 08, 2012)

UL 796-2010 印刷线路板

UL Standard for Safety Printed-Wiring Boards (Tenth Edition; Reprint with revisions through and including September 11, 2013)

IEC PAS 62326-14:2010 印刷电路板.第14部分:设备嵌入式基底.术语/可靠性/设计指南

This PAS is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. Figure 1 shows examples of device embedding in the fabrication process of the device embedded substrate. Active and passive devices are connected to each other by interlayer vias and/or conductor patterns. Insulating layers are formed using insulating materials with vias for the connection of inside conductor patterns to the conductor patterns formed on the surface(s) of the substrate. Figure 2 shows the substrate with connections using pads, and Figure 3 shows the board using via connections. The insulating layer includes rigid and flexible insulating resins such as phenol resin, epoxy resin, polyimide resin and modified polyimide resin, which are reinforced with glass cloth, aramid cloth or paper; and resins without reinforcement. Interconnections to the input and output terminals to the embedded device and the surface conductor pattern include conventional interconnection of the terminals of the embedded device to an interconnecting land for SMD, and formation of terminals on the surface of an embedded device by copper plating or vias using conductive paste. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

BS EN 61249-2-41:2010 印制板和其它互连结构用材料.包覆和非包覆增强基材.无铅装配用限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素纸/织物E型玻璃增强层压板

This part of IEC 61249 gives requirements for properties of brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 100 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for le

BS EN 61249-2-42:2010 印制板和其它互连结构用材料.包被和非包被增强基材.无铅装配用限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素非织物/织物E型玻璃增强层压板

This part of IEC 61249 gives requirements for properties of brominated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-f

IEC 91/926/PAS:2010 高亮度发光二极管电路板

Electronic circuit board for high-brightness LEDs

IEC 91/928/PAS:2010 高亮度发光二极管用电路板试验方法

Test methods for electronic circuit board for high-brightness LEDs