L30 印制电路 标准查询与下载
共找到 1036 条与 印制电路 相关的标准，共 70 页
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-15：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Multifunctional epoxide woven E-glass prepreg of defined flammability (vertica
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-16：Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards)－Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flamma
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지 두께의
Materials for printed boards and other interconnecting strutures-Part 2-10:Reinforced base materials clad and unclad-Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical bur
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의
Materials for printed boards and other interconnecting structures-Part 2-36:Reinforced base materials clad and unclad-Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-17：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertica
- ICS
- 31.180;13.810
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의
Materials for printed boards and other interconnecting structures-Part 2-32:Reinforced base materials, clad and unclad-Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
이 표준은 인쇄회로기판에 대한 성능인증(CA:Capability Approval) 절차를
Printed boards－Part 1：Generic specification
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의
Materials for printed boards and other interconnecting structures-Part 2-38:Reinforced base materials, clad and unclad-Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembl
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지 두께의
Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
이 성능개별표준(Cap DS)의 토대가 되는 표준은 IEC 62326-4이며 3.1에 규정
Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification－Section 1：Capability Detail Specification－Performance levels A, B, and C
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.80 mm에서 1.60 mm 두께의 폴
Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 (수직연소시험에서) 규정된 난연성 등급을
Materials for printed boards and other interconnecting structures－Part 2-35：Reinforced base materials, clad and unclad－Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 (수직연소시험에서) 규정된 난연성 등급을
Materials for printed boards and other interconnecting structures-Part 2-33:Reinforced base materials, clad and unclad-Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less th
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-14：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Epoxide woven E-glass prepreg of defined flammability (vertical burning test)
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249-2-37:2011 印刷电路板和其他互连结构用材料.第2-37部分:包覆和非包覆增强基材.无铅组件用铜包覆的规定可燃性(垂直燃烧试验)的改良非卤化环氧编织E型玻璃层压板材
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의
Materials for printed boards and other interconnecting structures－Part 2-37：Reinforced base materials, clad and unclad－Modified non-halogenated expoide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-fr
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지 두께의
Materials for printed boards and other interconnecting structures－Part 2-31：Reinforced base materials, clad and unclad－Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
本标准规定了航天用刚性多层印制电路板的试验方法。 本标准适用于刚性多层印制电路板的各类试验和检验。
Test method of multilayer printed board for aeropace
- ICS
- CCS
- L30
- 发布
- 2011-07-19
- 实施
- 2011-10-01
本规范规定了航天用刚性多层印制电路板的技术要求、质量保证规定及交货准备等。 本规范适用于航天用刚性多层印制电路板的设计、生产及检验。不适用于刚性高密度互连印制板和微波印制板。
General specification for multillayer printed board for aerospace
- ICS
- CCS
- L30
- 发布
- 2011-07-19
- 实施
- 2011-10-01
本标准规定了刚性印制电路板（以下简称印制板）的设计依据、设计准则和设计内容。 本标准适用于航天电子电气产品用的刚性印制板，不适用于高密度互连印制板和微波印制板。
Design requirement for printed circuit board
- ICS
- CCS
- L30
- 发布
- 2011-07-19
- 实施
- 2011-10-01
本标准规定了高可靠表面安装刚性印制板组装件(以下简称表面安装印制板组装件）设计准则和设计要求。 本标准适用于航天电子电气产品使用高可靠表面安装印制电路板组装件的设计。其它电子电气产品使用的高可靠表面安装印制电路板组装件的设计可参照使用。
Design requirements for high-reliability surface mount circuit assemblies
- ICS
- CCS
- L30
- 发布
- 2011-07-19
- 实施
- 2011-10-01
