共找到 227 条与 半导体发光器件 相关的标准,共 16 页
Provides new measuring methods, terminology and letter symbols as well as essential ratings and characteristics.
Semiconductor devices. Microwave integrated circuits. Frequency prescalers
To be read in conjunction with IEC 60747-1
Discrete semiconductor devices and integrated circuits - Thyristors
To be read in conjunction with IEC 60747-1
Discrete semiconductor devices and integrated circuits - Bipolar transistors
To be read in conjunction with IEC 60747-1
Discrete semiconductor devices and integrated circuits - Thyristors
Semiconductor opto-electronic devices Detail specification for type GR1325J light emitting diode module
本标准规定了超辐射发光二极管组件光电参数的测试方法。 本标准适用于超辐射发光二极管组件光电参数测试。
Measuring methods for super luminescent diode module
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in man
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
The document applies for photovoltaic systems; power conditioners and procedure for measuring efficiency.
Photovoltaic systems - Power conditioners - Procedure for measuring efficiency (IEC 61683:1999); German version EN 61683:2000
The document deals with rating of direct coupled photovoltaic (PV) pumping systems.
Rating of direct coupled photovoltaic (PV) pumping systems (IEC 61702:1995); German version EN 61702:1999
Semiconductor optoelectronic devices.Detail specification for type GF1120 red emitting diode
The document is a sectional specification for liquid crystal display modules.
Liquid crystal and solid-state display devices - Part 2: Liquid crystal display modules; sectional specification (IEC 61747-2:1998); German version EN 61747-2:1999
This test method defines the procedurfeosr performing acoustic microscopy on onhennetic encapsulated electronic components. This method provides users with an acoustic microscopy processf ofrlo w detecting anomalies (delamination, crackms,o ld compound voids, etc.) nondestructively in plastic packages while achieving reproducibility.
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
The document lists test methods applicable to liquid crystal display devices.
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods (IEC 61747-5:1998); German version EN 61747-5:1998
This part of IEC 62007 describes the measuring methods applicable to the semiconductor optoelectronic devices to be used in the field of fibre optic systems and subsystems.
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
This part of IEC 62007 gives the essential ratings and characteristics of the following categories of semiconductor optoelectronic devices to be used in the field of fibre optic systems and subsystems: – semiconductor photoemitters; – semiconductor photoelectric detectors; – monolithic or hybrid integrated optoelectronic devices and their modules.
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Essential ratings and characteristics
Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must ident
Failure Rate Estimating Annex to SSB-1, Guidelines for Using of Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures
Environmental Tests and Associated Failure Mechanisms Annex to SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.
Qualification and Reliability Monitors Annex to SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
本规范规定了GG 2204型多路高速数据光电隔离组件的技术要求、质量保证规定、检验和试验方法、交货准备等要求。 本规范适用于组件的研制、生产和采购。
Detail specification for type GG2240 optoelectronic isolator assembly for multi-channel high-speed data
本规范规定了GG6001型脉冲信号光电隔离组件的技术要求、质量保证规定、检验和试验方法、交货准备等要求。 本规范适用于组件的研制、生产和采购。
Detail specification for type GG6001 optoelectronic isolator assembly for pulse signal
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