正性光刻胶PR1-12000A

PR1-12000A
Positive Resist PR1-12000A is a positive tone photoresist designed for 365 or 436 nm wavelength
exposure, using tools such as wafer steppers, scanning projection aligners, proximity printers and
contact printers. PR1-12000A excels in applications when superior adhesion is required. Use of
adhesion promoters, such as HMDS is not recommended with PR1-12000A.
These are the advantages of PR1-12000A over other resists:
- superior resolution capability
- fast photospeed
- substrate adhesion which is superior to that of any commercial positive resist
- ease of removal after RIE process
- shelf life exceeding 1 year at room temperature storage.
The formulation and processing of PR1-12000A were designed with regard to occupational and
environmental safety. The principal solvent in PR1-12000A is 1-methoxy-2-propanol and
development of PR1-12000A is accomplished in a basic water solution.
Properties
♦ Solids content (%): 40-45
♦ Principal solvent: 1-methoxy-2-propanol
♦ Appearance: light yellow liquid
♦ Coating characteristic: very uniform, striation free
♦ Film thickness information:
Coating spin speed,
40 s spin (rpm)
Film thickness after 100°C oven
bake for 15 min (nm)
800 23500-24500
2300 14800-15200
3000 11800-12200
♦ Sensitivity (mJ/cm² for 1 μm thick film):
365 nm exposure wavelength: 70
436 nm exposure wavelength: 40
♦ Guaranteed shelf life at 25°C storage (years): 1
Processing
1 Application of resist by spin coating at selected spin speed for 40 s.
2 Application of Edge Bead Remover EBR1 to bottom and edge of the coated wafer for 10 s,
until 5 s before completion of spin cycle.
3 100°C bake in a bake oven for 30 minutes or 120ºC hotplate bake for 180 s.
4 Resist exposure with a tool emitting 365, 406 or 436 nm wavelengths.
5 Resist development in Resist Developer RD6 by spray or immersion.

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注：该产品未在中华人民共和国食品药品监督管理部门申请医疗器械注册和备案，不可用于临床诊断或治疗等相关用途