NPC-3500（A）全自动等离子清洗/去胶机应用：

• 有机物以及无机物的残留物去除

• 光刻胶剥离或灰化

• 去残胶以及内腐蚀(深腐蚀)应用

• 清洗微电子元件，电路板上的钻孔或铜线框架

• 提高黏附性，消除键合问题

• 塑料的表面改型：O2处理以改进涂覆性能

• 产生亲水或疏水表面

NPC-3500（A）全自动等离子清洗/去胶机Features：

• Stand Alone System

• Auto wafer Load/Unload with load lock

• Stainless Steel, Aluminum or Bell Jar Chambers

• Class 100 Clean Room Compatible

• Shower Head, ICP or Microwave Plasma Sources

• Rotating Platen

• RF Biasable Heated up to 300 °C PID Controlled or Cooled Platen

• Fully Automated or Manual RF tuning

• Up to 5 Mass Flow Controllers with Electropolished Gas Lines

• PC Controlled Pneumatic Valves

• Multiple Levels of Access with Password Protection

• PC Controlled with LabVIEW

• Mechanical Pump with Pressure goes to 10 mTorr 

• 250 l/sec Turbomolecular Pump

• 5x10-7 Torr Base Pressure

• Fully Safety Interlocked

NPC-3500（A）全自动等离子清洗/去胶机Applications:

• Removal of Organic and Inorganic Materials without Residues

• Photoresist Stripping or Ashing

• Desmearing and Etch Back Applications 

• Cleaning Microelectronics, Drilled Holes on Circuit Boards or Cu Lead Frames

• Adhesion Promotion, Elimination of Bonding Problems

• urface Modification of Plastics: O2 Treatment for Paintability

• Producing Hydrophilic or Hydrophobic Surfaces