This specification covers qualification and performance of rigid multilayer printed boards with platedthrough holes. Circuitry may be bare copper@ metallic overplated or coated@ unfused@ fused@ leveled etc. Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of multilayer printed boards for industry and government use@ (excluding multilayer flexible and rigid-flex products).
ML-950C-1986由IPC - Association Connecting Electronics Industries 发布于 1986-11-01,并于 2014-01-16 实施。
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