The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon@ it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC/ PERM Task group 8-81@ during which identical sets of test vehicles were assembled@ in accordance with IPC J-STD-001@ Class 3@ at multiple locations. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.