Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin (Edition 1.0)
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace@ defence@ and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. This document may be used by other high-performance and high-reliability industries@ at their discretion.