"This test procedure provides standard methods for the evaluation of semiconductor thermal dissipators. Purpose: The purpose of this Bulletin is to establish standard procedures for the evaluation@ calibration@ and presentation of test data for semiconductor thermal dissipators. Since semiconductor and thermal dissipator temperature measurements are meaningless when test conditions are not uniform or controlled@ this test procedure will define the methods for testing and presenting data on temperature measurements of semiconductor junction@ semiconductor case@ chassis@ thermal dissipator@ and ambient under both natural and forced convection environments. Nomenclature : The commonly used and incorrect term ""heat sink"" refers in practice to ""heat"" or ""thermal"" dissipators used to reduce the operating case temperature of a semiconductor by transferring heat t o an ambient fluid."