IPC - Association Connecting Electronics Industries
适用范围
This document describes the design and assembly challenges for implementing passive and active components@ in either formed or placed methodology@ into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and can be made from organic@ inorganic (ceramic) or both types of material. Purpose The target audiences for this document are managers@ design and process engineers@ and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed@ passive or active components and to help establish inspection techniques@ testing processes@ and reliability validations.