"This document establishes methods for characterizing the robustness of vehicle electronic modules to certain environmental stresses. They include: Voltage-Temperature Design Margins Voltage Interruptions-Transients Over Temperature Voltage Dips Current Draw Under a Number of Conditions These methods can be applied during Development@ Pre-Qualification@ Qualification or for Conformity. This document does not address other environmental robustness stresses such as vibration@ high temp exposure@ load faults@ ESD@ etc. Measurement Philosophy The major causes for today's electronic systems issues are: 1. Requirements not properly defined (e.g. functionality@ environment) 2. System interfaces 3. Trouble Not Indicated (TNI) A major contributor to issues in these categories is Conducted Immunity (CI). The methods used in this document are designed to address the deficiencies inherent in other commonly used validation methods for CI. An alternate approach is specified to supplement those methods. It uses relatively simple and low cost techniques that does not require a laboratory environment. This makes it easier to identify concerns early during the development stage (although they can be used at any stage). Conducted Immunity is a major issue for todays electronics. That aspect of Electromagnetic Compatibility (EMC) has the highest potential for warranty and customer satisfaction issues. However@ traditional validation testing for CI has major limitations. Specifically@ CI testing is most often run at room temperature due to the nature of the test equipment and facilities - the response of the product could be different when cold or hot than at room temperature. Another limitation is that very repeatable@ accurate and idealized signals are used to represent the ""real world"". While this would appear to be desirable@ it is not necessarily the case. The ""real world"" contains randomness and other characteristics (e.g. complex impedances) not replicated by such idealized test signals. Randomness is extremely critical for a microprocessor type DUT since the stress event (e.g. transients) must often line up in time with a certain point(s) in software execution to have an effect. In addition to CI@ current draw under a number of conditions is also characterized since it is a good indication of proper module operation@ degradation during environmental testing@ detection of inadvertent changes to the design or manufacturing process (conformity) and detection of sneak paths. It is important to note that many of these tests are not the ""test for success"" type where the results are classified as either pass or fail. Such testing is of limited value since it generates little information. The goal is to generate variable data or anomalies so that the maximum amount of information is obtained and an informed engineering judgement can be made. Rationale The methods in this document@ using relatively simple and low cost techniques@ are designed to address some of the deficiencies inherent in other commonly used testing methods for conducted immunity. Examples of such deficiencies - not tested throughout temperature range and use of idealized signals that do not adequately represent the real world. It also addresses other robustness issues not addressed elsewhere."