62951-7-2019
Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et extensibles – Partie 7: Méthode d’essai pour caractériser la performance des barrières en couches minces utilisées pour l’encapsulation des semiconducteurs organiques souples (Editio

62951-7-2019 发布历史

This part of IEC 62951 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra-low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen@ electrical contacts@ sensor films and calculation procedures. For these purposes@ this document provides terms@ definitions@ symbols@ configurations@ and test methods including test conditions such as temperature@ relative humidity@ testing time.

62951-7-2019由IEC - International Electrotechnical Commission 发布于 2019-02-01，并于 2019-03-01 实施。

62951-7-2019的历代版本如下：

• 2019年02月01日 62951-7-2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

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标准号

62951-7-2019

发布日期

2019年02月01日

实施日期

2019年03月01日

废止日期

无

中国标准分类号

/

国际标准分类号

/

发布单位

IEC - International Electrotechnical Commission

引用标准

32

适用范围

This part of IEC 62951 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra-low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen@ electrical contacts@ sensor films and calculation procedures. For these purposes@ this document provides terms@ definitions@ symbols@ configurations@ and test methods including test conditions such as temperature@ relative humidity@ testing time.