SM-817A-2014

General Requirements for Dielectric Surface Mounting Adhesives

SM-817A-2014 发布历史

This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. Purpose This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer@ syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light@ heat or ambient conditions.

SM-817A-2014由IPC - Association Connecting Electronics Industries 发布于 2014-12-01，并于 2014-12-25 实施。

SM-817A-2014的历代版本如下：

• 2014年12月01日 SM-817A-2014

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标准号

SM-817A-2014

发布日期

2014年12月01日

实施日期

2014年12月25日

废止日期

无

中国标准分类号

/

国际标准分类号

/

发布单位

IPC - Association Connecting Electronics Industries

引用标准

24

适用范围

This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. Purpose This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer@ syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light@ heat or ambient conditions.