KS C IEC 60249-3-1-2002(2012) 印制电路用基材第3部分:与印制电路有关的特殊材料第1号规范:多层印制板制造中用作粘合片材的预浸料
Base materials for printed circuits-Part 3:Special materials used in connection with printed circuits-Specification No. 1:Prepreg for use as bonding sheet material in the fabrication of multiplayer pr